JPS5954232A - Bonding tool - Google Patents

Abstract

PURPOSE:To equalize the temperature distribution of the surface of action of bonding, and to improve the productivity of an IC by previously forming a plurality of through-holes made parallel with the surface of action of bonding to the side surface sections of the four sides of the nose section of the tool in the pulse heating type bonding tool used for simultaneously connecting a lead and the electrode of a chip. CONSTITUTION:The positions of the electrode section of an IC element and the nose section of the lead are aligned, and these sections are connected by the bonding tool consisting of a metallic conductor generating heat by the electric resistance of itself. The through-holes 2' combined with a separating slit 3 are formed to the surfaces of action 1 of the tool at that time, but the through-holes 2' are each formed to the corner sections 4' of the side surfaces of the lower nose of the tool at that time, and the number of the holes is made previously more than that of a normal tool. Accordingly, a sectional area of a section generating heat is reduced, while a temperature is elevated, temperature distribution is equalized, and the workabiity of bonding is improved.

Description

[Detailed description of the invention] The present invention relates to bonding tools, and more particularly.

The present invention relates to a bonding tool for simultaneously connecting multiple external leads to electrodes of an integrated circuit element.

In the manufacturing process of integrated circuit devices, it is necessary to connect lead wires to draw conductive circuits from integrated circuit elements and the like to the outside. As a method for this connection, in recent years, gigantic bonding using a tape carrier method or the like, in which a large number of leads are simultaneously bonded by thermocompression, has been adopted.

The honing tool used for such bonding inks usually employs a pulse heat method. This is a method in which the bonding tool is made of a metal conductor, and by passing a large current through it, the tool itself generates heat due to the metal conductor's air resistance, supplying the necessary heat during bonding. It goes without saying that bonde ink pressure may be applied to the tool by a suitable mechanism immediately before or at the same time.

FIG. 1 shows the shape of a conventional general punch ink tool. In the figure, a through hole 2 and a separation slit 3 parallel to the working surface 1 are drilled in the upper part of the working surface 1 of the bonding tool that performs bonding after aligning the positions of the electrodes of the integrated circuit element and the tips of the external leads. There is. That is, due to the through hole 2, the bonding tool tip end side surface portion 4 has a minimum cross-sectional area and a maximum electrical resistance. When a current 5 is applied in such a shape, heat is generated at the maximum electric resistance portion, that is, the left and right side surface portions 4 of the tip, the working surface 1 is heated, and the necessary heat is supplied to the bonding ink. Furthermore, a thermocouple (not shown) for temperature control is welded slightly above the bonding surface 1, and this feeds back the heating temperature to the source to accurately control the temperature. There is. The function required of such a bonding tool is that it must be able to uniformly and quickly raise the temperature of the working surface 1 of the bonding tool by 400 DEG C. to 500 DEG C. when energized. However, in conventional bonding tools, it is necessary to increase the electrical resistance value in order to obtain the above-mentioned high temperature, so the cross-sectional area of the tip side surface portion 4 must be reduced, and it must necessarily be processed to be thin.

However, since the pressing force required for bonding increases as the number of pins increases, the bonding tool tip side surface 4 must become extremely fragile. For this reason, this cross-sectional area cannot be reduced within a certain limit. Therefore, there is a problem in that the time required to reach the set temperature is delayed and the bonding time is long. or,
When the temperature of the bonding surface 1 increases, the tip side surface 4
The heat is generated the most on the left and right sides of the bonding tool, and there is a problem in that the uniformity of the temperature distribution on the bonding tool working surface 1 causes some variation in the front, rear, left and right sides.

The present invention provides a novel punch ink tool that solves the problems of the conventional pulse heat type bonding tools.

That is, according to the present invention, the cross-sectional area of the four sides at the tip of the tool is made equal by providing through holes parallel to the working surface of the honing tool symmetrically on the four sides of the front, back, left, and right. This is a new bonding tool.

The bonding tool of the present invention will be explained in detail below using the drawings.

FIG. 2 is a perspective view of the punch ink tool of the present invention.

The through hole 2 parallel to the working surface 1 of the bonding tool is made so that the cross-sectional areas of the four sides of the front, rear, left, and right sides of the tool tip are equal.
There are multiple pieces on the sides.

This allows the tip side corner 4 to be adjusted to each corner (
4 locations).

That is, according to the present invention, heat is generated at each of the four corners of the tip side corner 4, which has the smallest cross-sectional area, instead of the two places on the left and right of the side surface of the tip, which conventionally generate the most heat. This results in an excellent effect on the uniformity of temperature distribution. In addition, compared to conventional bonding tools, the set temperature can be reached faster than conventional bonding tools, which results in high thermal efficiency. This also results in a structure that does not reduce the mechanical strength of the bonding tool.

As described above, the present invention has a through hole parallel to the bonding ink working surface of a pulse heat type Hongte ink tool used in the process of simultaneously bonding each electrode of a circuit element to an external lead at multiple points. Dogs contribute to the production of the integrated circuit device of the bonding tool, which is characterized by having a plurality of bonding tools on the four sides so as to equalize the cross-sectional area of the front, rear, left, and right sides of the tip.

[Brief explanation of drawings]

FIG. 1 is a schematic perspective view showing a conventional bonding tool, and FIG. 2 is a schematic perspective view showing an embodiment according to the present invention. 1... Bonding tool action surface, 2.2
......Through hole, 3...Separation slit, 4
...Side surface of tool tip, 4...Side corner of tool tip, 5...Pulse heat current. Ge) / Mistake? Times 4' 129-

Claims (1)

[Claims] In a pulse heat type bonding tool used to connect a lead and a chip electrode at the same time, through-holes parallel to the bonding action surface of the bonding tool are formed on the four sides of the tip of the tool. A bonding tool characterized by having multiple pieces.