JPS5954978A - Inspection of printed circuit board - Google Patents
Inspection of printed circuit boardInfo
- Publication number
- JPS5954978A JPS5954978A JP57163942A JP16394282A JPS5954978A JP S5954978 A JPS5954978 A JP S5954978A JP 57163942 A JP57163942 A JP 57163942A JP 16394282 A JP16394282 A JP 16394282A JP S5954978 A JPS5954978 A JP S5954978A
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- printed circuit
- inspected
- inspection
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007689 inspection Methods 0.000 title abstract description 26
- 239000010409 thin film Substances 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 14
- 239000000523 sample Substances 0.000 abstract 1
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 241000406668 Loxodonta cyclotis Species 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 210000003734 kidney Anatomy 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000035807 sensation Effects 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
- G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2805—Bare printed circuit boards
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
Description
【発明の詳細な説明】 本発明はプリント回路基板の検査方法に関する１１：１ ものである。[Detailed description of the invention] The present invention relates to an 11:1 inspection method for printed circuit boards. It is something.
一般にプリント回路基契においては、これにトランジス
タ、ダイオ−Ｐ、抵抗その他の機能素子が組み込まれる
前に、当該プリン、ト回路基板に、竺°期のリードが形
成されているか□否かを検査するこ（２）
と、が必然、で、あ、る・具体的には・この検亨は、・
、例えば：機能素子−７３植立され、るスルーホニルと
称する孔。In general, in printed circuit boards, before transistors, diodes, resistors, and other functional elements are installed, it is inspected to see if early leads are formed on the printed circuit board. (2) It is inevitable that...
For example: Functional element-73 is planted with a hole called sulfonyl.
に形成へれた。導、軍、部或いは他、？導電部を竺査、
η象−ｔ、部と、し１．その、相互間の、電気的な、導
通、状態また←絶縁性態、の、有岬を検出することによ
つ−５，、行、なわれる。It was formed poorly. Leadership, military, department or other? Inspect the conductive parts,
η elephant-t, part, and 1. This is done by detecting the presence of electrical continuity or insulation between them.
従来、斯かるプリント回路基板、の検査は１．第１図に
示すように、、検査、すべきゾリン＋） 、４．眸基、
板Ｐの検査対象導電ｓＴの配列バタ、−ンに対応したパ
ターンに従って多数の検査用ピン１４絶、縁、、性輝±
保持、板２にス、シリング８により退縮自在に設け。Conventionally, such printed circuit boards are inspected by 1. As shown in FIG. eyes,
A large number of test pins 14 are arranged according to patterns corresponding to the conductive conductors sT to be tested on the plate P.
Holder is provided on the plate 2 so that it can be retracted freely by the sill 8.
各、検査用、ピン１を、検査機番に接続して成る装、置
ケ用゛・端子保持板、２をシリ′ト回竺基板Ｐに、対腎
て押圧Ｊる。ことによ？て各検査用ビン１をそ、のるシ
リング：８の力によ、り対応する検査対象導電部、Ｔに
接触せしめて電気的に接、続させるように、し５．この
状態で前記検査機４に、おいて各検査対象導電部Ｔ、、
相互鼎の！気的な導通状態または、絶縁状、、態の有無
、を検査するこ仁により行、なわ、れる。 い 。Each terminal holding plate 2, which is made up of the test pin 1 connected to the test machine number, is pressed against the slotted circuit board P with a pin. Especially? 5. Move each test bottle 1 so that it comes into contact with the corresponding conductive part to be tested, T, and electrically connects it with a force of 8.5. In this state, each conductive part T to be inspected is placed in the inspection machine 4.
Mutual Ding! It is performed by inspecting the presence or absence of electrical continuity or insulation. stomach .
しかしながらこ、のような方法においては、検査（８）
用ビン↓：と、シ、天、１．各々、をス、シリング８に
よ：・り構格・−せしめたものを備えた。１．従、つて
相当に高価な検査装置を用ごな誇五ば殖□’ｂｆＱい欠
点が、 、、−’１１：ｌ：１−１：、’ｌ、、、、”
′このよ、うな事情や・ら、最）近、 ：、ｊ 、ｊ４
さ方向に圧力を 。However, in this method, inspection (8) bin ↓: and, shi, heaven, 1. Each of them was equipped with a shilling 8:・ri construction・-. 1. Therefore, the disadvantage of using quite expensive inspection equipment is ,,-'11:l:1-1:,'l,,,,,'
'This kind of situation...recently:, j, j4
Apply pressure in the opposite direction.
加えるとその部分が導電性となる感圧導電性弾性 □体
シートを用いる方ｉ提率、さ五声。この方法は、■第２
図に示すように、検査すべきプリント回路基板Ｐの表面
に感圧導電性弾性体シート（以下、「感圧シート」とい
う。）１１を位置させ、シリンド回路基′Ｍ′Ｐ、の検
査対象導電部Ｔ、Ｔの配列パターンに、叩応し≠７！タ
ー、ンに穫つ千絶縁性端子保持板１１に固定して設けた
検査用端子である検査用ぎン１８により感圧シート１１
を押圧して導電路ａを生じさせ、この導電路ａにより検
査用ピン１８と検査対象導電部Ｔとの電気的接続を得る
ようにして検査を行なうものである。１４は受は板、１
５は緩衝材層である。When added, that part becomes conductive.Pressure-sensitive conductive elastic □How to use a body sheet. This method is
As shown in the figure, a pressure-sensitive conductive elastic sheet (hereinafter referred to as "pressure-sensitive sheet") 11 is placed on the surface of the printed circuit board P to be inspected, and the cylinder circuit board 'M'P, to be inspected. The response to the arrangement pattern of the conductive parts T and T is ≠7! The pressure-sensitive sheet 11 is connected to the test pin 18, which is a test terminal fixed to the insulating terminal holding plate 11, at the turn.
is pressed to create a conductive path a, and the test is performed by establishing an electrical connection between the test pin 18 and the conductive portion T to be tested through the conductive path a. 14 is a plate, 1
5 is a buffer material layer.
この方法によれば、検査用ピン１３はスプリングによら
ずに端子保持板１ｚに直接的に固定して成る、従ってコ
ストの低い装置を用いることがで、寿、十は・か、感圧
シート１１がプリント回路基板Ｐ、、・、、：、、、、
（７）、、、！、、、・１−一“６２１”７゛“（Ｄ
＊ ｔｒ ｔｘ ｆ！Ｉ 、ａ”−得 ・れ′乞・・。According to this method, the test pin 13 is directly fixed to the terminal holding plate 1z without using a spring. Therefore, a low-cost device can be used, and a pressure-sensitive sheet can be used. 11 is a printed circuit board P,...
(7),,,! ,,,・1-1 “621”7゛”(D
* tr tx f! I, a”-obtain, beg.
′シ：かしながら、、ピの方法において用いられる感傅
■シー）１１は、例えば第り図に←す木う１直、、径、
、、Ｈの円形の検査用ピン１８によって厚さ方向に押圧
力を加えたとき、斜線を付して示したように。11 is, for example, the 1st diameter of the tree shown in the diagram below.
When a pressing force is applied in the thickness direction by the circular inspection pin 18 of ,,H, as shown with diagonal lines.
厳密には、検査用ピン１８が当接している領域よ１１１
１１１１１１１１１１１１１１
多大きい直径比′の、導電性領堺、Ｅが形成されること
となる。この直径Ｒの領域の周辺におけるいわば誘起導
電性部分は：１．当該部分も歪を不可避的に受１
１ ：１
けることに：よ、シ、預生ずるもので、ちるが、その幅
ｄは相当に大きなものでおる。 □ 。Strictly speaking, the area 111 is in contact with the inspection pin 18.
11111111111111 A conductive region E having a large diameter ratio' is formed. The so-called induced conductive portion around this area of diameter R is:1. This part also inevitably suffers from distortion.
1:1 To begin with: It's a deposit, but its width d is quite large. □.
・→方、現在のプリント回路基板においては、小型化の
要請が非常に強く、例えば検査対象導電部とすべきスル
ーホール部相互間の距離を小さくすること、或いはスル
ーホール部相互間にリードを配置すること等が現実に行
なわれており、このようなプリント回路基板に対しては
、上述の感圧シートによる検査方法を適用することがで
きない。・→On the other hand, there is a strong demand for miniaturization of current printed circuit boards. For example, it is necessary to reduce the distance between through-holes that are conductive parts to be inspected, or to connect leads between through-holes. The above-mentioned inspection method using a pressure-sensitive sheet cannot be applied to such printed circuit boards.
即□ち１例刻は第４図□に示すようにＪ検査対象導電部
Ｔと電気的接続を得るために検査用ピン１８帖葎庄−ｆ
７ｚ ｌ 、 ’７Ｅ’ｙ −ｌｌ、１に！１．−ζ検
査用ｔ ＞” １ ａ”” （７）直播Ｒよシ大きい直
径の導電性領域□Ｅ′が形成され、この導電性領域Ｅに
対応するプリント回路基板Ｐの位置に他の導電部りが形
成され１て（ミるとムは、検□査用でン１８は検査対象
導電部Ｔのみではなく当該他の導電部′Ｄとも電気的に
接□
続されるよう゛になり、結局信頼性の高い検査を行なう
ことができない。 ′□゛′ □勿論、□検査
ｍ＝ン１□８の直径を小殻なもあｉすればそ□のよ□う
な麦障を伴わず′に′検査□を６去”５ ｔｒが可能で
あ□るが、１そのように□す□ると′門には検査前“ピ
ンのコストが夫幅に為くなる等の問題力ｘ’ある□。In other words, in one example, as shown in Figure 4□, 18 test pins are connected to the conductive part T to be tested.
7z l, '7E'y -ll, to 1! 1. -ζ Inspection t >"1a"" (7) A conductive region □E' with a larger diameter than the direct seeding R is formed, and another conductive part is placed at the position of the printed circuit board P corresponding to this conductive region E. The conductive part 18 is electrically connected not only to the conductive part T to be inspected but also to the other conductive part 'D', In the end, it is not possible to perform a highly reliable test.' It is possible to remove the inspection by 6 tr, but if you do so, there will be problems such as the cost of the pin will increase before the inspection. There is□.
□本発□萌は以□上必如き事情に基□いそな□されたも
のであって、そ□の目的と与る□とこ元はン□検□査鉛
゛ｉ導″室部が密に配置夕ｉｊされた複数の導電部群内
に位置伊る□ときに□も丁感圧シ」トヲ介□しそｉ−に
五つ′容易に検査用ビシを当該□検査対象導“室部に対
しソー藩電気的に接続することができ、高い信頼性をも
つ（６）
て′りてト、回、路芦！９検査を行なう２との１きる方
法を提供するにある。□This publication □was inspired □ based on the above □ inevitable circumstances, and its purpose and origin are □ inspection □ where the lead-conducting chamber is tightly sealed. When placed in a group of multiple conductive parts, it is easy to place the five conductors into the conductive chamber to be inspected. (6) To provide a two-and-one method for conducting circuit and circuit inspections, which can be electrically connected to the circuit and has high reliability.
”本発明の特徴とするところは、検＊大べき、フ］リン
ト回路基板の表面に、当該表面における検査対象導電部
を露出ｉしめる孔を有大る絶縁性薄膜マスク□を位ム姦
し込、この−ヘタ上に□、−その厚さ男高Ｊ圧力が力１
えら”ｈた部分力；導電性となる感圧・−トを位置せし
め、前記７スクの孔に相やする位、置において前記感圧
シートを検査用端子によシ押圧己Ｊこれにｈ当該検査用
端子と前記検査対象導電部、部とを電不的に接続させる
工程を含む点にある。``The present invention is characterized by placing an insulating thin film mask □ on the surface of a printed circuit board with large holes that expose the conductive parts to be inspected on the surface. Including, this - on the bottom □, - that thick man high J pressure is force 1
Position the conductive pressure-sensitive sheet, and press the pressure-sensitive sheet against the test terminal at a position that matches the hole in the seven holes. The method includes a step of electrically connecting the test terminal and the conductive part to be tested.
直下□図面によって本発明の一実施、例について説：
・：′ □ ・
、１ 。Immediately below □Explanation of one embodiment and example of the present invention with reference to drawings:
・：′ □ ・
, 1.
明する。I will clarify.
本発明においては、第５図ＶＣ，基すよ′殊、検讐等べ
きプリント回路基板かと感圧シート（例えは門査□対□
象導一部Ｔ、 Ｔの位置に相当する位置に当該−一対”
”ｉｉ”−警部□Ｔに１合４る犬き夜の孔２０ 、２０
□ ・ ５′１
番形晟１七成る絶縁性薄膜マスク（以下単に「マ。In the present invention, as shown in FIG.
The elephant part T, the corresponding pair at the position corresponding to the position of T.
"ii"-Inspector
□ ・An insulating thin film mask (hereinafter simply referred to as "Ma") consisting of a 5'1 type 晝17.
スフ」という。）２１を位置せしめ、前記検査対象（７
）
導電部Ｔ、Ｔの位置に５相１当する位置において、端子
保持板１ｚに固定せしめた検査用ピン１８．１８を前記
感圧シート１１に押圧し、これにより感圧シート１１の
対応部分を、前記マス（２１の孔２０゜２０を介して検
査対象導電ｍ” ’、’、’Ｔ”’： Ｔメの□間で挾
圧し、以ってこれらと、対応する検査用ギン１８．１８
とを電気的に接続せしめ、この状態で検査を行なう。It's called "Sufu." ) 21, and the inspection object (7) is positioned.
) Press the test pins 18 and 18 fixed to the terminal holding plate 1z against the pressure-sensitive sheet 11 at positions corresponding to the positions of the conductive parts T and T, and thereby the corresponding portions of the pressure-sensitive sheet 11 are clamped between the squares of the conductive objects m"', ', 'T"': T's through the holes 20 and 20 of the mass (21), and the corresponding test pins 18. 18
Electrically connect them and perform the inspection in this state.
以上において、マスク２′１における孔ｚＯの形状およ
び寸法は、これを通して検査対象導電部に感圧シートを
介し□て導通状態埴得るために必要な最小限の面積が確
保されるものであればよい。In the above, the shape and dimensions of the hole zO in the mask 2'1 are determined as long as the minimum area necessary to obtain a conductive state through the pressure-sensitive sheet to the conductive part to be inspected is determined. good.
また、マスク２１は、藤圧１ｉ−１−１１のプリント回
路基板Ｐ側の表面に絶縁性塗料、を印刷技術を用いて層
状に一体的に形成すること□もでき、この場合には、当
該マスク２１の半纏が□容易であるほか、その位置決め
を感圧シート青□を介して行なうことができるので便利
であ求。勿論絶縁性樹脂フィルムによシ独立のマスク２
１を作製し、これをプリント回路基板Ｐと感圧シート１
１との間に位置決めをして介挿するようにしてもよく、
或いは・該樹脂フィルムのマスクを接瘤’ｍｊ等により
感圧シートに貼着してもよい。The mask 21 can also be formed by integrally forming an insulating paint in a layered manner on the surface of the printed circuit board P side of the Fujitsu 1i-1-11 using printing technology. In addition to being easy to wear the mask 21 in half, it is also convenient because its positioning can be done via the pressure-sensitive sheet blue □. Of course, there is also an independent mask 2 using an insulating resin film.
1 is made, and this is attached to the printed circuit board P and the pressure sensitive sheet 1.
It may be positioned and inserted between 1 and 1.
Alternatively, the resin film mask may be attached to the pressure-sensitive sheet using a butt joint or the like.
本発明方法は以上の：ように七□で１プリント回路基板
の検査を行なうため、感圧シート１１において検査対象
導電部Ｔに対してこれよりも大きな導電性領域が形成さ
れることとなっても、マスク２１の孔ｚＯによシ当該検
査対象導室部Ｔのみがこの導電性領域に対して露出し接
触することとなると共に、マスク９１の孔２０以外の部
分は絶縁性マスク、部分により覆われて感圧シート１１
と電気的に絶縁されるため、当該検査対象導電部Ｔに接
近して他の導電部りが存在するときにもこれが感圧シー
ト１１の導電性領域と接触することがなく、この結果検
査用ぎン１３の直径が大きく従って感圧シート１１に大
きな導電性領域が形成される場合においても、当該検査
用ピン１８を対応する検査対象導電部Ｔにのみ電気的に
接続することができ、従って高い信頼性をもってプリン
ト回路基板Ｐの検査を行なうことができる。Since the method of the present invention inspects one printed circuit board in seven squares as described above, a conductive area larger than this is formed on the pressure sensitive sheet 11 with respect to the conductive part T to be inspected. Also, due to the hole zO of the mask 21, only the conducting chamber part T to be inspected is exposed to and comes into contact with this conductive region, and the portion of the mask 91 other than the hole 20 is covered by an insulating mask. Covered with pressure sensitive sheet 11
Therefore, even if there is another conductive part close to the conductive part T to be inspected, it will not come into contact with the conductive area of the pressure sensitive sheet 11. Even when the diameter of the pin 13 is large and therefore a large conductive area is formed on the pressure sensitive sheet 11, the test pin 18 can be electrically connected only to the corresponding conductive part T to be tested. The printed circuit board P can be inspected with high reliability.
また上記の説明からも理解されるように検査用（９）
ピン１３の直径ン小さくすることが不要であるから、そ
の製作が容易でコストが高くなることはない。Furthermore, as can be understood from the above description, it is not necessary to reduce the diameter of the inspection pin 13 (9), so its manufacture is easy and the cost does not increase.
な２．検査丁べざプリント１路□基板と端子保持板とは
、前者の検査対象導電部と後者の対応するピンとの間の
精雷な位置合、−￥が達成されφよう、相互に位置合せ
することが必要であるが、そのＫ・めには、例えば第６
図に示すように、検査対象導電部とされるスルーホール
Ｈ，に、対応：する位’！・に？。2. □The board and the terminal holding plate are aligned with each other so that the precise alignment between the conductive part to be inspected on the former and the corresponding pin on the latter, -￥, is achieved. For example, the 6th
As shown in the figure, it corresponds to the through hole H, which is the conductive part to be inspected.・Ni? .
（・て感圧シー）１１にスルーホールＨと同径の位置合
せ用孔３０を形成し、対応するｐ／１３Ａの頂部に当該
スルーホールＨと一合する径の挿入用突出部３１を形成
してこれを感圧シー−１１の位置合せ用孔１７ケ介して
スルーホールＨ内に挿入し、これによって電気的接続ヶ
確保しながら位置合せを行なうようにすることがでさ、
斯ρ）る位置合せ部を全体の２個所に設けて？けは完全
な位置合せン達成することがでざる。(Pressure sensitive sea) A positioning hole 30 with the same diameter as the through hole H is formed in 11, and an insertion protrusion 31 with a diameter that matches the through hole H is formed at the top of the corresponding p/13A. Then, insert this into the through hole H through the 17 positioning holes of the pressure sensitive seam 11, thereby performing positioning while ensuring electrical connection.
Is it possible to provide such alignment parts at two locations throughout? However, perfect alignment cannot be achieved.
以上のよ５に不発明方法によれば、腎に配列きれた複数
の導電部群内に検査対象導電！部が位置丁（１０）
るプリント回路基板について、感圧シートを利用してそ
の利点を減殺することなく、確実に且つ容易に検査用ピ
ンを対応する検査対象導電部に対してのみ電気的に接続
することができ、高い信頼性をもつ来プリント回路基板
の検査を行なうことができる。According to the uninvented method described in 5 above, there is a conductivity to be tested in a group of conductive parts arranged in the kidney! (10) For printed circuit boards whose parts are located, the use of a pressure-sensitive sheet makes it possible to reliably and easily connect the test pins electrically only to the corresponding conductive parts to be tested, without reducing its advantages. It is possible to test printed circuit boards with high reliability.
第１図は従来のプリント１路□板の検査方法の説明用断
面図、第２図は感圧導電性弾性体シートを利用した検査
方法の説明用断面図、第３図は感圧シート体におけ予−
電、！領域についての説明図、第４図は感圧導電性弾性
体シートによる検査方法の問題点についての呼明用断面
図、第５図は本発明方法の一実施例の説明、用断面図、
第６図は本発明において好ましい位置合せ手段の説明図
である。
１．１３−・・検査用、ピン ２．１２・・・端子保持
板３・・・スプリング ４・・・検査機Ｐ・・・プ
リント回路基板 Ｔ・・・検査対象導電部１１−・・感
圧シー） １４・・・受は板１５・・・緩衝材層
Ｄ・・・導電部（１１）
Ｅ・・・導電性領域 ２１−・・絶縁性薄膜マスク
２０ ・・・孔 ３ｏ・・・位置合せ用孔３
１−・・挿入用突出部 Ｈ−・・スルーホール、１１１
１
、 ４声、１．図
、 堂２図
第３ａ″
第４「 −
′Ｔ ′
１／Figure 1 is a cross-sectional view for explaining the conventional inspection method for a printed one-way board, Figure 2 is a cross-sectional view for explaining the inspection method using a pressure-sensitive conductive elastic sheet, and Figure 3 is a pressure-sensitive sheet body. Preparation in
Electric! 4 is a cross-sectional view explaining the problems of the inspection method using a pressure-sensitive conductive elastic sheet, and FIG. 5 is a cross-sectional view explaining an embodiment of the method of the present invention.
FIG. 6 is an explanatory diagram of a preferable positioning means in the present invention. 1.13-- Pin for inspection 2.12... Terminal holding plate 3... Spring 4... Inspection machine P... Printed circuit board T... Conductive part to be inspected 11-... Sensation Pressure sea) 14...The receiver is a plate 15...Buffer material layer
D... Conductive part (11) E... Conductive region 21-... Insulating thin film mask 20... Hole 3o... Positioning hole 3
1--Protrusion for insertion H--Through hole, 111
1, 4 voices, 1. Figure, Hall 2 Figure 3a"4" - 'T' 1/
Claims (1)
お！ｊ７３竺査対象導電部をｉ出番しめる孔を有する絶
縁性薄膜マスクを位置せしめ、このマスク上に、その厚
さ方向に圧力が加えられた部分が導電性となる感、圧導
電性弾←シートを位置寝しめ・前記？ Ｘ Ｚ、Ｏ孔に
相当すｔ位、置腎ゝＩｖ゛下剪記感圧導電性弾性体シー
トを検査用端子によシ押圧し□、これ醍よシ当該検専ツ
端、字と、、前記′竺査対竺導電部とを電気的に接続さ
せる工程を含もことを特徴とするプリント回路基板の検
査方法。1) On the surface of the printed circuit board to be inspected! j73 Place an insulating thin film mask with a hole that exposes the conductive part to be inspected, and place a piezoconductive elastic sheet on top of the mask, where pressure is applied in the thickness direction so that the part becomes conductive. Position the bed and said? Place the pressure-sensitive conductive elastic sheet at position t, which corresponds to the O hole, and press the pressure-sensitive conductive elastic sheet against the test terminal. . A method for inspecting a printed circuit board, comprising the step of electrically connecting the conductive portion to the conductive portion.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57163942A JPS5954978A (en) | 1982-09-22 | 1982-09-22 | Inspection of printed circuit board |
| US06/506,617 US4571542A (en) | 1982-06-30 | 1983-06-22 | Method and unit for inspecting printed wiring boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57163942A JPS5954978A (en) | 1982-09-22 | 1982-09-22 | Inspection of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5954978A true JPS5954978A (en) | 1984-03-29 |
Family
ID=15783744
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57163942A Pending JPS5954978A (en) | 1982-06-30 | 1982-09-22 | Inspection of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5954978A (en) |
-
1982
- 1982-09-22 JP JP57163942A patent/JPS5954978A/en active Pending
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