JPS5956739A - ウエハ装填装置 - Google Patents

ウエハ装填装置

Info

Publication number
JPS5956739A
JPS5956739A JP57166680A JP16668082A JPS5956739A JP S5956739 A JPS5956739 A JP S5956739A JP 57166680 A JP57166680 A JP 57166680A JP 16668082 A JP16668082 A JP 16668082A JP S5956739 A JPS5956739 A JP S5956739A
Authority
JP
Japan
Prior art keywords
wafer
arm
wafers
loaded
supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57166680A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6246062B2 (2
Inventor
Nobuhiro Yoshioka
吉岡　信博
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Nihon Shinku Gijutsu KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc, Nihon Shinku Gijutsu KK filed Critical Ulvac Inc
Priority to JP57166680A priority Critical patent/JPS5956739A/ja
Publication of JPS5956739A publication Critical patent/JPS5956739A/ja
Publication of JPS6246062B2 publication Critical patent/JPS6246062B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment

Landscapes

  • Physical Vapour Deposition (AREA)
JP57166680A 1982-09-27 1982-09-27 ウエハ装填装置 Granted JPS5956739A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57166680A JPS5956739A (ja) 1982-09-27 1982-09-27 ウエハ装填装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57166680A JPS5956739A (ja) 1982-09-27 1982-09-27 ウエハ装填装置

Publications (2)

Publication Number Publication Date
JPS5956739A true JPS5956739A (ja) 1984-04-02
JPS6246062B2 JPS6246062B2 (2) 1987-09-30

Family

ID=15835730

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57166680A Granted JPS5956739A (ja) 1982-09-27 1982-09-27 ウエハ装填装置

Country Status (1)

Country Link
JP (1) JPS5956739A (2)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63108713A (ja) * 1986-10-27 1988-05-13 Nec Kansai Ltd イオン注入方法
JPH0640517A (ja) * 1985-10-24 1994-02-15 Texas Instr Inc <Ti> ウェーハ移送方法及び集積回路ステーション

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0640517A (ja) * 1985-10-24 1994-02-15 Texas Instr Inc <Ti> ウェーハ移送方法及び集積回路ステーション
JPS63108713A (ja) * 1986-10-27 1988-05-13 Nec Kansai Ltd イオン注入方法

Also Published As

Publication number Publication date
JPS6246062B2 (2) 1987-09-30

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