JPS5965403A - thick film resistor - Google Patents
thick film resistorInfo
- Publication number
- JPS5965403A JPS5965403A JP57175716A JP17571682A JPS5965403A JP S5965403 A JPS5965403 A JP S5965403A JP 57175716 A JP57175716 A JP 57175716A JP 17571682 A JP17571682 A JP 17571682A JP S5965403 A JPS5965403 A JP S5965403A
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- printed resistor
- laser beam
- thick film
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明はアルミナ等のセラミック基板に互に対向する導
体層を形成し、これらの導体層間に抵抗ベーストを用い
て印刷抵抗体を形成したいわゆる厚膜の抵抗器に関する
。[Detailed Description of the Invention] Industrial Field of Application The present invention is a so-called thick film method in which conductor layers facing each other are formed on a ceramic substrate such as alumina, and a printed resistor is formed using a resistor base between these conductor layers. Regarding resistors.
従来例の構成とその問題点
一般に厚膜抵抗器は第１図に示すようにアルミナ等のセ
ラミック基板１に互に対向するように導体層２を形成し
、これらの導体層２，２間に所要の印刷抵抗体３を形成
することによって構成されている。そして、印刷抵抗体
３の抵抗値を正確に規定の値に調整する場合には、第１
図、第２図に示すように印刷抵抗体３の側方から印刷抵
抗体３の中央部までレーザ光線を当てここに切欠４を形
成するようにしている。ところでこの種のものではレー
ザ光線を当てるスタートポイントが直接アルミナ等の基
板１上になり、しだがって、レーザ光線のボンピング効
果により、第２図に示すように上記スタートポイントが
異常に深く切削加工され、セラミック基板１そのものの
強度が低下したリ、印刷抵抗体そのものの耐湿性が低下
したりするなど余り好ましいものではなかった。Conventional Structure and Problems In general, thick film resistors, as shown in FIG. It is constructed by forming the required printed resistor 3. In order to accurately adjust the resistance value of the printed resistor 3 to a specified value, the first
As shown in FIG. 2, a laser beam is applied from the side of the printed resistor 3 to the center of the printed resistor 3 to form a notch 4 there. By the way, in this type of device, the starting point to which the laser beam is applied is directly on the substrate 1 made of alumina, etc. Therefore, due to the bombing effect of the laser beam, the starting point is cut abnormally deeply as shown in Fig. 2. This was not very desirable, as the strength of the ceramic substrate 1 itself was reduced and the moisture resistance of the printed resistor itself was reduced.
発明の目的
本発明は以上のような従来の欠点を除去するものであり
、ｍ′ｊ単な構成で容易に優れた厚膜抵抗器を提供する
ものである。OBJECTS OF THE INVENTION The present invention eliminates the above-mentioned conventional drawbacks and provides an easily superior thick film resistor with a simple structure.
発明の構成
本発明は印刷抵抗体の側方に別に層を設け、この層から
印刷抵抗体に向けてレーザ光線による切欠を形成するよ
うに構成したものであシ、レーザ実施例の説明
第３図、第４図は本発明の厚膜抵抗器における一実施例
を示すものであり、図中第１図、第２図と同−付号を付
したものは第１図、第２図に示すものと同一の本のを示
している。そして、５は印刷抵抗体３を形成する前に上
記印刷抵抗体３を印刷する部分を含めて上記印刷抵抗体
３０仙１１方に突出するように上記セラミック基板１上
に印刷、乾燥、焼成して形成された低誘電率のガラス層
であシ、レーザ光線による切欠４は上記印刷抵抗体３の
側方に位１１すする上記ガラス肱１５から」二記印刷抵
抗体３に向けて形成するようにしている。Structure of the Invention The present invention is structured such that a separate layer is provided on the side of the printed resistor, and a notch is formed by a laser beam from this layer toward the printed resistor. Figures 1 and 4 show an embodiment of the thick film resistor of the present invention, and the same numbers as in Figures 1 and 2 in the figures refer to Figures 1 and 2. Shows the same book as shown. 5, before forming the printed resistor 3, prints, dries, and fires it on the ceramic substrate 1 so as to protrude toward the printed resistor 30 and 11, including the portion where the printed resistor 3 is printed. A notch 4 formed by a laser beam is formed from the glass collar 15 located on the side of the printed resistor 3 toward the printed resistor 3. That's what I do.
したがって、上記実施例によれば、第４図に示すように
レーザ光線による切欠４をスタートポイントから印刷抵
抗体３の中央部まではソ均一に形成することができ、セ
ラミック基板そのものの切削がきわめて少なくなるとい
う利点を有する。すなわち、上記実施例によればレーザ
光線の切欠４のスター１−ポイントにガラス層５が別に
形成されているだめ、仮にここでレーザ光線のボンピン
グ効果による異常な加工深さが生じたとしても上記層５
によってこれを吸収することができ、セラミック基板１
そのものの切欠けきわめて浅いものになシ、その強度が
極端に低下したシ、印刷抵抗体の耐湿性を悪化させたり
するということがほとんどないという利点を有する。Therefore, according to the above embodiment, as shown in FIG. 4, the notch 4 formed by the laser beam can be uniformly formed from the starting point to the center of the printed resistor 3, making it extremely easy to cut the ceramic substrate itself. It has the advantage of being less. That is, according to the above embodiment, since the glass layer 5 is separately formed at the star 1 point of the notch 4 of the laser beam, even if an abnormal machining depth occurs here due to the bumping effect of the laser beam, the above-mentioned layer 5
This can be absorbed by the ceramic substrate 1
It has the advantage that the notch itself is extremely shallow, its strength is extremely reduced, and the moisture resistance of the printed resistor is hardly deteriorated.
尚、第３図、第４図に示す実施例では印刷抵抗体３の下
面と側方に一体にレーザ光線のボンピング効果による異
常な加工深さの影響を小さくするガラス層５を形成して
いるが、ガラス層５は印刷抵抗体３の側方にのみ形成す
るようにしても良い。In the embodiment shown in FIGS. 3 and 4, a glass layer 5 is integrally formed on the lower surface and the sides of the printed resistor 3 to reduce the influence of abnormal processing depth due to the bombing effect of the laser beam. However, the glass layer 5 may be formed only on the sides of the printed resistor 3.
まだ、第５図〜第７図に示すようにガラス層５に代えて
印刷抵抗体３の側方にこの印刷抵抗体３と一体に突出部
６を形成し、この突出部６によってレーザ光線のボンピ
ング効果による異常な加工深さの影響を小さくするよう
にしても良い。このようにした場合には突出部６を印刷
抵抗体３と同時に一体に印刷し、乾燥、焼成することが
でき、その製造がよシ簡単になるという利点を有する。Still, as shown in FIGS. 5 to 7, a protrusion 6 is formed on the side of the printed resistor 3 integrally with the printed resistor 3 instead of the glass layer 5, and the protrusion 6 blocks the laser beam. The influence of abnormal machining depth due to the bombing effect may be reduced. In this case, the protrusions 6 can be printed simultaneously with the printed resistor 3, dried and fired, which has the advantage of simplifying its manufacture.
尚、第５図〜第７図に示すように突出部６を形成した場
合には切欠４を突出部６から一旦外に出し、再び突出部
６に入れて印刷抵抗体３の中央部に至 −るようにはＭ
Ｌ字状に形成する必要がある。□このようにすると切欠
４のそれぞれの断面が第６図、第７図に示すようにはソ
全体に亘って均一になり、第３図・第４図に示す実施例
と同様の効果を得ることができる。In addition, when the protruding part 6 is formed as shown in FIGS. 5 to 7, the notch 4 is once removed from the protruding part 6, and then put back into the protruding part 6 until it reaches the center of the printed resistor 3. - M
It is necessary to form it in an L shape. □By doing this, the cross section of each of the notches 4 becomes uniform over the entire length as shown in FIGS. 6 and 7, and the same effect as the embodiment shown in FIGS. 3 and 4 is obtained. be able to.
発明の効果
本発明は上記実施例より明らかなように基板上に形成さ
れた互に列内する肩体Ｊ、ｙη間に印刷抵抗体を形成す
ると共にこの印刷抵抗体の側方にレーザ光線のボンピン
グ効果による異常な加工深さの影響を小さくする層を形
成し、この層をスタートポイントとして上記印刷抵抗体
に抵抗値を調整するレーザ光線による切欠を形成したも
のであり、したがって、本発明によればレーザ光線のボ
ンピング効果による基板の異常な加工深さによる影響を
効果的に阻止することができ、実用上きわめて有利なも
のである。Effects of the Invention As is clear from the above embodiments, the present invention forms a printed resistor between shoulder bodies J and yη formed on a substrate in mutually arranged rows, and also irradiates a laser beam on the side of this printed resistor. A layer is formed to reduce the influence of abnormal processing depth due to the bombing effect, and a notch is formed in the printed resistor using a laser beam to adjust the resistance value using this layer as a starting point. According to this method, it is possible to effectively prevent the influence of abnormal machining depth of the substrate due to the bombing effect of the laser beam, which is extremely advantageous in practice.
第１図は従来の厚膜抵抗器の概略正面図、第２図は同抵
抗器のＡ−Ａ’断面図、第３図は本発明の厚膜抵抗器に
おける一実施例の概略正面図、第４図は同実施例のＢ
−Ｂ’断面図、第５図は他の実施例の概略正面図、第６
図、第７図は同実施例のＣ−ｃ’断面図及びＤ−Ｄ’断
面図である。
１・・・・・・基板、２・・・・・・導体層、３・・・
・・・印刷抵抗体、４・・・・・・切欠、５・・・・・
・ガラス層、６・・・・・・突出部。
第１図
第４図
第５図
第６図
／
第７図
１１FIG. 1 is a schematic front view of a conventional thick film resistor, FIG. 2 is a sectional view taken along line AA' of the same resistor, and FIG. 3 is a schematic front view of an embodiment of the thick film resistor of the present invention. Figure 4 shows B of the same example.
-B' sectional view, FIG. 5 is a schematic front view of another embodiment, and FIG. 6 is a schematic front view of another embodiment.
7 are a C-c' cross-sectional view and a D-D' cross-sectional view of the same embodiment. 1...Substrate, 2...Conductor layer, 3...
...Printed resistor, 4...Notch, 5...
-Glass layer, 6... protrusion. Figure 1 Figure 4 Figure 5 Figure 6/ Figure 7 11
Claims (3)
抵抗体を形成すると共にこの印刷抵抗体の側方にレーザ
光線のボンピング効果による影響を小さくする層を形成
し、この層から上記印刷抵抗体に向けて上記印刷抵抗体
の抵抗値を調整するためのレーザ光線による切欠を形成
して成る厚膜抵抗器。(1) A printed resistor is formed between mutually opposing core layers formed on a substrate, and a layer is formed on the side of this printed resistor to reduce the influence of the bombing effect of the laser beam, and from this layer A thick film resistor comprising a notch formed by a laser beam toward the printed resistor for adjusting the resistance value of the printed resistor.
さくする層を低誘電率のガラス層によって形成したこと
を特徴とする特許請求の範囲第１項記載の厚膜抵抗器。(2) The thick film resistor according to claim 1, wherein the layer for reducing the influence of the bombing effect of the laser beam is formed of a glass layer with a low dielectric constant.
さくする層を互に対向する導体層間に形成された印刷抵
抗体と同一材料で一体に形成して成る特許請求の範囲第
１項記載の厚膜抵抗器。(3) A thick film resistor according to claim 1, wherein a layer for reducing the effect of the bombing effect of a laser beam is integrally formed of the same material as the printed resistor formed between mutually opposing conductor layers. vessel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57175716A JPS5965403A (en) | 1982-10-06 | 1982-10-06 | thick film resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57175716A JPS5965403A (en) | 1982-10-06 | 1982-10-06 | thick film resistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5965403A true JPS5965403A (en) | 1984-04-13 |
| JPS644642B2 JPS644642B2 (en) | 1989-01-26 |
Family
ID=16000982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57175716A Granted JPS5965403A (en) | 1982-10-06 | 1982-10-06 | thick film resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5965403A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4522109A (en) * | 1983-11-21 | 1985-06-11 | J. I. Case Company | Leak-detecting hydraulic system |
-
1982
- 1982-10-06 JP JP57175716A patent/JPS5965403A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4522109A (en) * | 1983-11-21 | 1985-06-11 | J. I. Case Company | Leak-detecting hydraulic system |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS644642B2 (en) | 1989-01-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH04209501A (en) | Substrate for semiconductor device | |
| JPS6027104A (en) | Method of producing chip resistor | |
| JPS644642B2 (en) | ||
| JPS62169301A (en) | Temperature coefficient regulation of thick film resistance element | |
| JPH03211784A (en) | Printed board | |
| JPH02122594A (en) | Circuit board device | |
| JP3248294B2 (en) | Chip inductor and manufacturing method thereof | |
| JPS6290901A (en) | square chip resistor | |
| JPS6165465A (en) | Manufacture of film resistor in thick film multilayer substrate | |
| JP3065743B2 (en) | Manufacturing method of ceramic insulating substrate for electronic components | |
| JPH0864403A (en) | Rectangular chip resistor with circuit inspection terminal | |
| JPH02191304A (en) | Manufacture of chip resistor | |
| JPS6074501A (en) | thick film resistor | |
| JPH11176603A (en) | Chip resistor | |
| JP3229473B2 (en) | Manufacturing method of chip resistor | |
| JP2653981B2 (en) | Manufacturing method of ceramic circuit board | |
| JPH0274007A (en) | Trimming method for thick film resistor | |
| JPS60171281A (en) | Glazed ceramic substrate | |
| JPS6373501A (en) | Resistor | |
| JPS5678147A (en) | Manufacture of thick film hybrid integrated circuit board | |
| JPS58210612A (en) | Composite electronic part | |
| JPH11168002A (en) | Chip component and manufacture thereof | |
| JPS62256406A (en) | Multi-element parts for surface mount | |
| JPH0714668U (en) | Circuit board device | |
| JPS5965409A (en) | Method of producing multilayer thick film resistor |