JPS5970363U - circuit board - Google Patents
circuit boardInfo
- Publication number
- JPS5970363U JPS5970363U JP16665482U JP16665482U JPS5970363U JP S5970363 U JPS5970363 U JP S5970363U JP 16665482 U JP16665482 U JP 16665482U JP 16665482 U JP16665482 U JP 16665482U JP S5970363 U JPS5970363 U JP S5970363U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- pattern
- base material
- area
- release paper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の離型紙付きの回路基板における離型紙の
剥離方法を示す説明図、第2図は水溝案F係る回路基板
の一実施例の概念的に示す平面図、第3図は第2図中■
−■線断面図、第4図は第2−図の回路基板の製造工程
の一部を示す平面図、第5図は本考案に係る回路基板の
他の実施例を概念的に示す一部省略平面口、第6図は第
5図中■−■線断面図、第7図は第5図の回路基板の製
造工程の一部を示す部分省略平面図である。
8.13・・・・・・ベース材、8A、 13A・・
・・・・スリット、9.14・・・・・・導電性のパ9
−7.10゜15・・・・・・離型紙、11.16・・
・・・・粘着剤。
第1図
第3図Fig. 1 is an explanatory diagram showing a method of peeling off a release paper from a circuit board with a conventional release paper, Fig. 2 is a conceptual plan view of an embodiment of a circuit board according to the water groove plan F, and Fig. 3 is ■ in Figure 2
4 is a plan view showing part of the manufacturing process of the circuit board shown in FIG. 2, and FIG. 5 is a part conceptually showing another embodiment of the circuit board according to the present invention FIG. 6 is a sectional view taken along the line ■--■ in FIG. 5, and FIG. 7 is a partially omitted plan view showing a part of the manufacturing process of the circuit board shown in FIG. 5. 8.13...Base material, 8A, 13A...
...Slit, 9.14 ... Conductive pad 9
-7.10゜15...Release paper, 11.16...
...adhesive. Figure 1 Figure 3
Claims (1)
ース材の周縁部の区域であって導電性のパターン形成区
域以外の区域の一部に形成されたスリットにより前記ベ
ース材が導電性のパターン形成区域とパターン非形成区
域とに分割され、該パターン非形成区域を前記スリット
部分より折返し引張ることにより前記ベース材より前記
離型紙を剥離せしめることを特徴とする回路基板。In a circuit board to which a release paper is attached via an adhesive, a slit formed in a part of the peripheral area of the base material other than the area where the conductive pattern is formed allows the base material to become conductive. 1. A circuit board comprising: a pattern-forming area and a non-pattern-forming area; the release paper is peeled from the base material by folding and pulling the non-pattern-forming area from the slit portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16665482U JPS5970363U (en) | 1982-11-01 | 1982-11-01 | circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16665482U JPS5970363U (en) | 1982-11-01 | 1982-11-01 | circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5970363U true JPS5970363U (en) | 1984-05-12 |
| JPH0346512Y2 JPH0346512Y2 (en) | 1991-10-01 |
Family
ID=30364801
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16665482U Granted JPS5970363U (en) | 1982-11-01 | 1982-11-01 | circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5970363U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5152858U (en) * | 1974-10-17 | 1976-04-22 | ||
| JPS5788969U (en) * | 1980-11-20 | 1982-06-01 |
-
1982
- 1982-11-01 JP JP16665482U patent/JPS5970363U/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5152858U (en) * | 1974-10-17 | 1976-04-22 | ||
| JPS5788969U (en) * | 1980-11-20 | 1982-06-01 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0346512Y2 (en) | 1991-10-01 |
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