JPS597436A - Press needle for printed substrate - Google Patents
Press needle for printed substrateInfo
- Publication number
- JPS597436A JPS597436A JP11533682A JP11533682A JPS597436A JP S597436 A JPS597436 A JP S597436A JP 11533682 A JP11533682 A JP 11533682A JP 11533682 A JP11533682 A JP 11533682A JP S597436 A JPS597436 A JP S597436A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- printed circuit
- press needle
- press
- needle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title abstract 2
- 238000004080 punching Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004744 fabric Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D28/00—Shaping by press-cutting; Perforating
- B21D28/24—Perforating, i.e. punching holes
- B21D28/34—Perforating tools; Die holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Punching Or Piercing (AREA)
Abstract
Description
【発明の詳細な説明】
この発明はプリント基板のスルホール用穴を打抜くのに
用いられるプリント基板用プレス針に関するものである
。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a press needle for printed circuit boards used for punching holes for through holes in printed circuit boards.
従来、プリント基板にスルホール用穴を設けるにはドリ
ルを用いている。しかし、ドリルを用いた場合には、ス
ルホール用穴を1つ1つ設けなけれはならないので、作
業が非常に面倒であり、プリント基板のコストが高面と
なり、量産用プリント基板を製造するのに適さない。そ
こで、プレス針を用いてプリント基板にスルホール用穴
を設ケることが行なわれている。Conventionally, a drill is used to make through-holes on printed circuit boards. However, when using a drill, each through-hole hole must be made one by one, which is very cumbersome and increases the cost of printed circuit boards, making it difficult to manufacture printed circuit boards for mass production. Not suitable. Therefore, through holes are formed in printed circuit boards using press needles.
第1図は従来のプリント基板用プレス針を示す図である
。このプレス針を用いてスルホール用穴を設けるには、
プレス装置にスルホール用穴を設けるべき位置に合わぜ
て金型にプレス針を取付け、その金型装置によりプリン
ト基板にスルホール用穴を設ける。このようにすれば、
l lxのプレスにより多数のスルホール用穴を設ける
ことができるから、作業が容易であり、プリント基板の
コストが安価となり、量産用プリント基板を製造するの
に適する。しかしながら、このプレス針を用いてスルホ
ール用穴を設けた場合には、スルホールの内壁が平滑で
なく、カラスクロス等のパリが生じるから、メッキ付が
悪く、また電子素子のリード線をスルホールに挿入して
半田付けするときの半田上りが悪い。さらに、スルホー
ルの穴径が均一でないので、電子素子のリード線をスル
ホールに挿入する作業を自動化できない。FIG. 1 is a diagram showing a conventional press needle for printed circuit boards. To make a hole for a through hole using this press needle,
A press needle is attached to the mold at the position where the through-hole hole is to be formed on the press device, and the through-hole hole is formed in the printed circuit board using the mold device. If you do this,
Since a large number of through-hole holes can be formed by using the llx press, the work is easy and the cost of the printed circuit board is low, making it suitable for manufacturing printed circuit boards for mass production. However, when making a hole for a through hole using this press needle, the inner wall of the through hole is not smooth and there are scratches such as crow cloth, which makes plating difficult to adhere to, and when inserting the lead wire of an electronic device into the through hole. Solder flow is poor when soldering. Furthermore, since the diameter of the through holes is not uniform, it is not possible to automate the process of inserting lead wires of electronic devices into the through holes.
この発明は上述の問題点を解決するためになされたもの
で、内壁が平滑で、かつ穴径が均一なスルホールを設け
ることができるプリント基板用プレス針を提供すること
を目的とする。The present invention was made to solve the above-mentioned problems, and an object of the present invention is to provide a press needle for printed circuit boards that has a smooth inner wall and can form through holes with uniform diameters.
この]」的を達成するため、この発明においてはプレス
剣の下部に凹凸部を設ける。In order to achieve this objective, in the present invention, a concave and convex portion is provided at the bottom of the press sword.
第2図はこの発明に係るプリント基板用プレス剣を示す
図である。このプレス針においては、下部に横目状の凹
凸部■が設けられているから、このプレス剣を用いてス
ルホール用穴を設けたときには、スルホールの内壁が平
滑になり、パリが生ずることがなく、またスルホールの
穴径が均一となる。FIG. 2 is a diagram showing a press sword for printed circuit boards according to the present invention. This press needle has a cross-grained concavo-convex portion (2) at the bottom, so when a through-hole hole is made using this press sword, the inner wall of the through-hole becomes smooth and no cracks occur. Also, the diameter of the through holes becomes uniform.
なお、第2図の場合には横目状の凹凸部lを設けたが、
プリント基板の材質によって、第3図、第4図に示すよ
うなドリル状の凹凸部2、ヤスリ状の凹凸部3を設けて
もよい。また、プレス針の材質としては、硬くかつねば
りけのあるものを用いるのが望ましく、プレス針の表面
に硬質メッキを行なってもよい。In addition, in the case of Fig. 2, the cross-grained concavo-convex portion l was provided, but
Depending on the material of the printed circuit board, a drill-like uneven portion 2 or a file-like uneven portion 3 as shown in FIGS. 3 and 4 may be provided. Further, it is desirable to use a hard and sticky material for the press needle, and the surface of the press needle may be hard plated.
以」−説明したように、この発明に係るプリント基板用
プレス針を用いてスルホール用穴を設けた場合には、ス
ルホールの内壁が平滑で、パリが生じないから、メツ、
キ付が良く、また電子素子のリード線をスルポールに挿
入して半UJ付けするときの半田上りが良好である。さ
らに、スルホールの穴径が均一となるから、電子素子の
リード線をスルホールに挿入する作業を自動化すること
ができる。しかも、スルホール用穴を設ける作業が非常
に容易であり、量産用プリント基板を製造するのに適し
ており、プリント基板を安価に製造することができる。- As explained above, when a through-hole is formed using the press needle for printed circuit boards according to the present invention, the inner wall of the through-hole is smooth and no cracks occur, so it is easy to
It has a good grip, and the solder rises well when inserting the lead wire of an electronic device into the Surpole and attaching it with half-UJ. Furthermore, since the diameters of the through-holes are uniform, the work of inserting lead wires of electronic devices into the through-holes can be automated. Moreover, the work of providing through-holes is very easy, making it suitable for manufacturing printed circuit boards for mass production, and making it possible to manufacture printed circuit boards at low cost.
このように、この発明の効果は顕著である。As described above, the effects of this invention are remarkable.
第1図は従来のプリント基板用プレス針を示す図、第2
図ないし第4図はそれぞれこの発明に係るプリント基板
用プレス針を示す図である。
■・・・横目状の凹凸部 2・・・ドリル状の凹凸部3
・・・ヤスリ状の凹凸部
代理人弁理士 中村純之助
矛 1 図
矛 2 図Figure 1 shows a conventional press needle for printed circuit boards, Figure 2 shows a conventional press needle for printed circuit boards.
4 through 4 are diagrams each showing a press needle for printed circuit boards according to the present invention. ■...Horizontal uneven part 2...Drill-like uneven part 3
...File-like unevenness Patent attorney Junnosuke Nakamura 1 Illustration 2 Diagram
Claims (1)
プリント基板用プレス針において、下部に凹凸部を設け
たことを特徴とするプリント基板用プレス釧。A press needle for a printed circuit board, which is used for punching holes for through holes in a printed circuit board, and is characterized by having an uneven portion at the bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11533682A JPS597436A (en) | 1982-07-05 | 1982-07-05 | Press needle for printed substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11533682A JPS597436A (en) | 1982-07-05 | 1982-07-05 | Press needle for printed substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS597436A true JPS597436A (en) | 1984-01-14 |
Family
ID=14660022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11533682A Pending JPS597436A (en) | 1982-07-05 | 1982-07-05 | Press needle for printed substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS597436A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0417336U (en) * | 1990-05-31 | 1992-02-13 | ||
| US5706786A (en) * | 1994-12-28 | 1998-01-13 | Cummins Engine Company, Inc. | Distortion reducing load ring for a fuel injector |
-
1982
- 1982-07-05 JP JP11533682A patent/JPS597436A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0417336U (en) * | 1990-05-31 | 1992-02-13 | ||
| US5706786A (en) * | 1994-12-28 | 1998-01-13 | Cummins Engine Company, Inc. | Distortion reducing load ring for a fuel injector |
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