JPS5979774A - Thermal head with plural heating element arrays - Google Patents

Abstract

PURPOSE:To enable to smoothly feed a transfer film and a recording paper, by fitting a semiconductor chip between a plurality of heating element substrates fitted to a supporting base, in a multicolor recording thermal head for a facsimile or the like. CONSTITUTION:The heating element substrates 1a having end parts 12 beveled are fitted to the supporting base 1b for the thermal head 1, and diode chips 6 are fitted between the substrates 1a. Bonding pads for leads 10 extended from the heating element arrays 5 are provided at the end parts 12, are wired to the diode chips 6 by bonding, and the assembly is protected by an insulating resin 13. While the thickness of the substrates 1a made of a ceramic is 1-2mm., and that of the diode chips 6 is about 0.4-0.6mm., so that the chips 6 can be provided to be lower than the heating elements 5, and the transfer film 3 and the recording paper 2 can be fed smoothly. In addition, since there is no projection making contact with platen rollers 4, the entire body can be reduced in size.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a multicolor recording device for facsimile, etc.
It is based on the structure of the Marhead (see Japanese Patent Application No. 57-62952).

[Technical background of the invention and its problems]

FIG. 1 shows the principle of a multicolor recording method using a thermal head. 1 is a thermal head, Ia is a heating element substrate, 1b is a support base that supports the heating element curtain plate 1a, 2 is a recording paper, 3 is a transfer film, 3a is a base film, 3b
4 is an ink layer, and 4 is a platen roller. FIG. 2 shows the structure of the thermal head 1, in which 5 is a heating element array and 6 is a diode chip.

FIG. 3 is an electrical connection diagram of the heating element 5' and the diode 9, where 7 is a heating element drive circuit, 8. -84 are heating element array selection terminals.

Next, the principle of Q1 operation shown in FIG. 1 (an example of four-color recording) will be briefly explained. The transfer film 3 is coated with ink of various colors in units of 1 m, 913. ~3b.

In this example, there are four colors. Also thermal head 1
There are also four of them, and the distance between them is L. When both signals are input to the thermal head, the desired heating element 5' generates heat, melting the ink directly below through the base film 3a,
Ink is transferred onto recording paper 2. Here, transfer film 3
Since the feeding speed v8 of is very slow compared to the paper feeding speed,
The thermal head 1 has a predetermined number of 4
The color ink is transferred to the recording paper 2 during the recording operation.

As a result, ink 311!・-Jb
A recorded image with 4 colors can be obtained.

Incidentally, when signals for four colors are mixed in the image signal of the (2) line, the signals for each color may be delayed in accordance with the paper feed speed Vp. Also, Figure 1 shows an example of four colors, and the thermal head 1
It is possible to create more colors than this by adding the above color and the color of the transfer filter, and it is also easy to create multiple colors by mixing colors.

However, in the configuration shown in FIG. 2, the projections caused by the diode chip 6 as shown in FIG. 4 cause the transfer films A, ? This is also unfavorable for the running of the recording paper 2. In addition, the need to avoid contact between the platen roller 4 and the diode depth 6 limited the reduction in the dimension 4 of the heating element substrate 1a, resulting in a large dimension between the arrays, resulting in an overall large normal head. .

[Purpose of the invention]

In order to eliminate these drawbacks, the present invention disposes a semiconductor chip such as a diode chip in the gap between the heating element substrate;
This is a 1-maru head without a convex portion on the recording surface, and the drawings will be described in detail below.

[Embodiments of the invention]

FIG. 5 shows an embodiment of the present invention, in which 1o is an individual side lead;
1 is the common side lead. As is clear from the figure, the semiconductor chip, that is, the diode chip 6 is mounted on the support base 1b.
The end portion 12 of the heating element substrate 1a is cut diagonally, and the bonding pad of the lead 1o is formed on the diagonally cut end portion 12.
It is connected to the diode chip 6 by bonding.

FIG. 6 is a sectional view of FIG. 5, and 13 is a protective material made of insulating resin. The heating element substrate 1a is usually made of ceramics and has a thickness of 1 to 2 mm, whereas the thickness of the diode chip 6 is about 0.4 to 0.6 mys. Therefore, the diode chip 6 can be installed lower than the heating element 5 as shown in FIG. In addition, support base 1 made of iron, aluminum, etc.
A wiring pattern to a heating element drive circuit is formed on b through an insulating film.

(Not shown). Also diagonally cut heating element group 11
*When forming the edge 12 of J, l, Nishinomiya's optical pattern exposure may cause blurring, but
It is possible to form a pattern with high precision on the diagonal end 12 by using a 7-beam, etc.
It is the f ijth one. Furthermore, since there is no contact with the platen roller 4 due to protrusions, the dimension e of the heating element substrate 1a can be reduced, and an overall compact thermal head can be realized.

FIG. 7 is an overall view of the present invention, and unlike the case in FIG. 4, projections on the running surface of the transfer film 3 and the recording paper 2)
+ (There is no such thing, so the running is smooth.

〔Effect of the invention〕

As explained above, according to the present invention, since the diode chip can be installed lower than the surface of the heating element, there is an advantage that the transfer film and the recording paper can be moved/bussed. Furthermore, since the heating element substrate can be formed small, the entire thermal head can be made smaller, and the heating element substrate is also advantageous in that it can be mass-produced in small quantities and manufacturing costs can be reduced.

By the way, in the embodiment of the present invention? A diode matrix as shown in Figure 'a3 prevents the current from flowing between the heating element arrays, but the shift resistor,
The diode chip 6 may be replaced with a semiconductor chip such as an integrated circuit (see Japanese Patent Application No. 138482/1982) containing a latch, gate/buffer, etc.

[Brief explanation of drawings]

Fig. 1 is an explanatory diagram of the principle of multicolor recording using a thermal head, Fig. 2 is a perspective view of the structure of a conventional thermal head having a plurality of heating element arrays, Fig. 3 is an electrical connection diagram of Fig. 2,
4 is a sectional view of FIG. 2, FIG. 5 is a partially cutaway perspective view of an embodiment of the present invention, and FIGS. 6 and 7 are sectional views of FIG. 5. 1...Thermal head, 1a...Heating element board, 1b
...Support base, 2...Recording paper, 3...Transfer film, 4...Platen roller, 5...Heating element array,
6. Diode chip, 7. Heating element drive circuit,
8, to 84...Heating element array selection screw, 9...Diode, 10.11...Lead, 12...Diagonally cut I-, emitted 7. ．． +ht body board end, 13.
··Protective layer. Part 1, 16th Patent Attorney Suzue Takehiko 3rd
Figure 4

Claims (1)

[Claims] A thermal head in which a plurality of heating element substrates on which a heating element array consisting of a large number of heating elements is formed is attached to a support base, characterized in that a semiconductor dip is attached between the substrates of the plurality of heating element substrates. A thermal head with a plurality of heating element arrays.