JPS59816A - Key structure - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a key structure whose construction is significantly simplified.

2. Description of the Related Art Recently, keys have been used as input units for a large number of electronic devices such as calculators and word processors, and each component of these electronic devices is required to be smaller, lighter, and simpler.

Therefore, keys are also required to be smaller, lighter, and simpler.

As shown in Fig. 4, the conventional general-purpose key is provided with a spacer 0 with through holes formed at predetermined intervals below the key wiring 0, and a carbon electrode (D) below the spacer (D).
E) is arranged to form the key wiring part O), and letters, numbers, etc. are printed on the upper surface of the key rubber at a predetermined position.
Furthermore, the key top (F) is formed by making the lower surface of the printed letters, numbers, etc. hang down and providing a key wiring suppression part flash.

That is, the key is configured by configuring the key top (F) and the key wiring section 0 separately, and by setting the key top (F) above the key wiring section 0.

Therefore, by pressing the desired characters, numbers, etc. printed part of the key top, the key wiring (q) can be brought into contact with the carbon electrode (E), and the signal corresponding to the desired characters, numbers, etc. can be input. It is possible.

However, with such a configuration, the key wiring section 0 has an overlapping structure of the key wiring 0 and the carbon electrode, and also has a key top (F) on the top surface of the key wiring section 0. Not only does it have a thick wall overall, but also the manufacturing process of the key wiring part 0, the manufacturing process of the key top (F), and the assembly process of mutually positioning and assembling the key top (F) and the key wiring part 0. This has drawbacks such as increased manufacturing costs.

The present invention solves the above-mentioned drawbacks by providing a lower key contact and an upper key contact vertically facing each other through a hole in an insulating plate, and by recessing letters, numbers, etc. in the center of the upper key contact. This will be explained in detail below with reference to the accompanying drawings showing embodiments.

FIG. 1 is a plan view of a key according to the present invention, and FIG. 2 is a cross-sectional view of the key shown in FIG. Insulating part inserted between parts (
3).

The upper key wiring section (1) is mainly composed of three leads (II) (Ill) made of conductive thin metal plates, and each lead has a disk-shaped control panel at a predetermined position. A key (12) (1'lQ (12)) is provided, and a lead pullout part (13) (13) is provided at a predetermined position of each lead.
)(13) is provided.

(141 is a pattern of letters, numbers, etc. formed by recessing the center part of the operation key (121).

The lower key wiring section (2) consists of a conductive metal thin plate (3).
Honolide (221 (21+ (21) as a living body,
Each lead consists of (21) (21) (21)
are arranged in parallel so as to face the three leads (11) (II) (Ill) in a direction perpendicular to the leads, and rectangular key contacts (
22) (221 (support) is provided, and a part of the lead drawer 1 ((5) (23) (n) is provided at a predetermined position of each lead.

In addition, the lead drawer part (731 (231 (23)) is pre-fertilized and the lead drawer part (131 (131 (131)
Moreover, by providing them close to each other, connection to a connector (not shown) can be easily performed.

The insulating part (3) is mainly composed of, for example, a Mylar board, and has a through hole Oυ0υ... with a diameter larger than the operating key, formed at a position directly facing the operating key and the key contacts, and further has a through hole Oυ0υ... on the upper and lower surfaces. Adhesive layer consisting of hot melt agent (up to 0)
has been established.

The thickness of the Mylar board is such that when an operation key is pressed, the operation key and the key contacts come into contact and conduct a predetermined electronic circuit, sending signals corresponding to the letters, numbers, etc. on the operation key to the electronic device itself. I am trying to load it into .

Figure 3 shows an upper key wiring section (1) and a lower key wiring section (
2) is a plan view showing a state in which the lead (Il
l (IllFIll (211 (211CI!Between 11 and frame (151) and the lead extraction part (13)
(131031 problems) (Connection parts (16) (16)... are provided between η and frame 09, respectively. Furthermore, (
171 (171 is the center hole, +181 f18)... is the alignment hole.

Therefore, the square frame +151 is inserted into the center hole (17).
(Fold back around the straight line connecting 19, and sandwich the insulating part (3) with 0 adhesive layer on the upper and lower surfaces between the upper key wiring part (1) and the lower key wiring part (2). A key can be manufactured by doing the following. Thereafter, the connecting portion (161 (161...) is cut out and the frame 09 is removed.

In the keys having the above configuration, for example, if the "'1" operation key (121) is pressed, the lead (11z) and the lead (211) are electrically connected, and the "2"1 operation key (122) is pressed.
), lead Q 12) and lead (21+)
Similarly, if any operation key is pressed, the leads determined by the operation key and the key contacts directly facing each other will be electrically connected. Therefore, a signal corresponding to the operation key is selected and input in the electronic device.

Although an embodiment using a conductive metal thin plate has been described above, it goes without saying that a plate body made of an insulating plate covered with metal foil may also be used.

Further, if it is necessary to increase the number of operation keys, for example, a large number of leads may be used.

Further, a hot melt agent was used as the adhesive because it has strong adhesive properties at room temperature and can improve work efficiency, but adhesives made of other materials may also be used.

As described above, the present invention allows the key to be made thinner as a whole, thereby reducing the bulk of the electronic device as a whole.Also, since the upper key wiring section also serves as the key top, the manufacturing process is simplified. It has unique effects such as being able to reduce costs.

[Brief explanation of drawings]

FIG. 1 is a plan view of the key of the present invention, FIG. 2 is a cross-sectional view of the key shown in FIG. FIG. 4 is a longitudinal sectional view showing a conventional key. ■... Upper key wiring section, 2... Lower key wiring section,
3...Insulation part, 11.21...Lead,
12... Operation key, 22... Key contact, 31
...Through hole, 32...Adhesive layer. Applicant Atsushi Sharp Corporation 1 Atsushi 21! l 75- Figure 4!

Claims (1)

[Claims] 1. Set multiple leads on the top and bottom surfaces of the insulating board, and set the leads on the top surface of the insulating board and the leads on the bottom surface at right angles to each other. The operation key provided at a predetermined position and the key contact provided at a predetermined position on the lead on the underside of the insulating plate are directly facing each other through a through hole drilled at a predetermined position in the insulating plate. ,
A key structure characterized by recessed numbers, etc.