JPS5983036U - Pellet mount structure - Google Patents

Pellet mount structure

Info

Publication number
JPS5983036U
JPS5983036U JP1982180161U JP18016182U JPS5983036U JP S5983036 U JPS5983036 U JP S5983036U JP 1982180161 U JP1982180161 U JP 1982180161U JP 18016182 U JP18016182 U JP 18016182U JP S5983036 U JPS5983036 U JP S5983036U
Authority
JP
Japan
Prior art keywords
pellet
mount structure
pellet mount
back side
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982180161U
Other languages
Japanese (ja)
Inventor
三雲　宏一
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP1982180161U priority Critical patent/JPS5983036U/en
Publication of JPS5983036U publication Critical patent/JPS5983036U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07321—Aligning
    • H10W72/07327—Aligning involving guiding structures, e.g. spacers or supporting members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、従来のペレットマウント構体の要部断面図、
第２図Ａ及びＢは従来のベレットマウント作業を示すた
めのベレットマウント工程の概略構成図、第３図は、こ
の考案の一実施例を示すペレットマウント構体の要部断
面図、第４図はその実施例に用いられ、突起形成予定の
リードフレームの要部平面図、第５図はリードフレーム
に突起形成させる真空スパツ多すング装讃の概念図、第
６図は、その実施例のベレットマウント作業を示す概略
構成図である。 ３・・・・・・基板（リードフレーム）、１０．　１０
゜−・・・・・・温度減磁し易い磁性体の突起、１１・
・・・・・半田、１２・・・・・・ペレット、１２′・
・・・・・厚膜の磁性体層（裏面）。 第３図 第４図Figure 1 is a sectional view of the main parts of a conventional pellet mount structure.
Figures 2A and B are schematic configuration diagrams of the pellet mounting process to show conventional pellet mounting work, Figure 3 is a sectional view of essential parts of a pellet mount structure showing an embodiment of this invention, and Figure 4 is a A plan view of the main part of the lead frame used in this example and on which protrusions are to be formed, FIG. 5 is a conceptual diagram of a vacuum spout mounting arrangement for forming protrusions on the lead frame, and FIG. 6 is a bellet of the example. FIG. 2 is a schematic configuration diagram showing mounting work. 3... Substrate (lead frame), 10. 10
゜-・・・Protrusions of magnetic material that are easily demagnetized by temperature, 11.
... Solder, 12 ... Pellet, 12'.
...Thick magnetic layer (back side). Figure 3 Figure 4

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ベレット固着基板に半田を介してペレットを固着するも
のにおいて、前記基板上に温度減磁し易い磁性体を突起
状に付着形成させるとともに、ペレットの固着裏面側に
厚膜の磁性体層を形成させたことを特徴とするペレット
マウント構体。In a device that fixes pellets to a pellet fixing substrate via solder, a magnetic material that is easily demagnetized by temperature is formed on the substrate in the form of a protrusion, and a thick magnetic layer is formed on the back side of the pellet to which the pellet is fixed. Pellet mount structure characterized by:
JP1982180161U 1982-11-29 1982-11-29 Pellet mount structure Pending JPS5983036U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982180161U JPS5983036U (en) 1982-11-29 1982-11-29 Pellet mount structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982180161U JPS5983036U (en) 1982-11-29 1982-11-29 Pellet mount structure

Publications (1)

Publication Number Publication Date
JPS5983036U true JPS5983036U (en) 1984-06-05

Family

ID=30390704

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982180161U Pending JPS5983036U (en) 1982-11-29 1982-11-29 Pellet mount structure

Country Status (1)

Country Link
JP (1) JPS5983036U (en)

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