JPS5984500A - Part inserting method - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a method for inserting components into a jig that aligns and supports a large number of components when soldering them to a lead frame of an integrated circuit component. .

[Technical background of the invention and its problems]

The applicant of the present invention has previously developed a jig (1
1 and also proposes a method of pushing this part (II) from the package between the support rods +21131 of the holder (1).

In other words, from the integrated circuit component %l ht package through the guide body (4) to the jig3Nil+, the lead frame (/l) protruding downward from between the components is slid at each part. It is common sense to place the jig (II) on the stand (5) used for insertion in the same posture as when soldering, and
2) In order to protrude the lead frame (C) downward from the lead frame (C), it is necessary that the lead frame (Il+) is placed under the main body of the component W [
It was common sense since it was ranked 111th, but it has a drawback. For example, as shown in Figure 2, inside the cuff (1), a guide body (7) having a step (6) that can be adapted to various dimensions and an anti-float body (8) are installed along the support frame 121+31. Since this is a method in which the component (4) is inserted using the two support rods (2) or the guide body (7) as a guide when inserting the component W between the support rods i21 +31, the component (3) Maintaining the posture is t'! IKit:, and due to variations in the length and spacing dimensions of the lead frame AC/1, this lead frame (ll) comes off the step (6) of the guide body (7) and the main body of M supports the part! i!
121, or the parts W in the package may fall off the lead frame (when the part is facing downwards, it may be unevenly tilted to either the left or right side of the package, so it may fall off from the package through the guide body (4). During the delivery of parts up to 111, there was a risk that the lead frame A (11) on the sliding side would get caught, and the delivery would not go smoothly, causing part W to come off or stop midway. .

For this reason, the part W is limited to one type of size, or
Otherwise, strict dimensional control was required.

[Purpose of the invention]

The present invention makes it possible to smoothly slide and transfer the integrated circuit component when inserting the integrated circuit component from the package into the jig or from the jig into the package.
The purpose is to prevent parts from coming off the support rods, etc.

[Summary of the invention]

A feature of the component insertion method of the present invention is that when soldering to the lead frame of an integrated circuit component, the main body of the component is "
r, i7 The jig H, which is aligned and supported by several support rods, and the package, which is continuously provided in the component insertion opening of this jig and which continuously stores the pf (st) circuit components, are integrated by reverse entrainment. By tilting the VC, the t% product circuit component is slid on the back side of the main body of the component and transferred between the package and the support rod #4f of the jig.

[Embodiments of the invention]

Hereinafter, the present invention will be described in detail with reference to one embodiment shown in Figs. 3 to 12 and other embodiments shown in Figs. 13 to 17.

As shown in Fig. 3 and Fig. 4, the jig aυ consists of a titanium frame (131) that is attached from above to the soldering line's feed holder a7J, and the frame (131). A set of two upper 4A11 copper IJ (14) made of tungsten as support rods and I
Each set of upper steel wires Q41 supporting the lower side of the main body of
Nine tungsten copper wires (15) as lower support frames are attached to each set of two lower steel threads Vi!
A gate body (16) that supports the other end of a51 and is freely movable downward with respect to the frame body 03), and a component insertion slot that is provided with the frame body 10 opposite to this gate body (16). It is formed by the IC insertion port aη. Note that the transport holder (121
is pulled by the pin OI protruding from one side of the soldering barrel, and moves the automatic soldering in along the guide rails (A) on both sides.

]・As shown in Fig. 5, the gate body aO of the gate body (16) fits into the concave surfaces cut out on both sides of the frame body (16), and Fixed l, L engraving n (A tension spring Q61 is fixed between 24+ and the bent part 12'31 of the frame Qm, and
0, the gate body a0 is pulled in the direction of closing each IC insertion port aD.

Note that the bent portion Q5) is partially cut out so that the L-carved metal fitting Q4) can be seen, as shown in Figure 3.

Also, in Fig. 5, (27) is a tilting table, and this tilting table (271) has a jig 0υ that is controlled in the opposite direction.
The lever Q mark that fixes the axis C! The tip of this lever is fixed by pressing it against the bent part Q of the frame 03) by a spring 3υ, and the gate body (1υ is pushed up to insert each IC). The air cylinder (c) that opens the port a7) is fixed to both lul+, and the piston rod of this air cylinder ■ C341/JZ L engraving j
It is opposed to the tip 65) of i +241. Further, the tilting table (2) is provided with an elongated hole 07) into which the grip portion 06) of the jig R, C11) is inserted.

In addition, as shown in Fig. 6 and Fig. 7, the tilting table system n
is rotatably supported on the upper end of the column (41), and is rotated by a rotary actuator (421) and locked by stoppers +431 and +441. is a package in which a large number of tube-shaped IC packages [F] (shown in Fig. 9) are held in multiple rows by a pair of supports (4"3) and a pair of presser bars (4n) pulled down by springs (46). A fixed part (481) is provided, and the left side of this joint joint supports a pair of abutments (depending on the machine, a guide l!liI and a floating prevention body 1!51), and a fixed part (481) is provided continuously with these. ) is provided with a jig fixing part 63 for fixing it as shown in Fig. 5. In addition to the lever ta and air cylinder (to), this jig fixing part 63 has a positioning part 6J6a and a shaft e+!i! A floating prevention body (5G1 is provided, which is rotatably supported by
Reference numeral 19 denotes an IC locking means for inserting ICs to (1) in the package [F] into the jig (11) in two steps.

Therefore, as shown in Figure 5, the soldering pots are fixed in the opposite direction when soldering. (141(1
5) Open the IC package [F
] is fixed on the abutment (451) in the opposite direction so that the lead frame CIA of ICpi"H faces upward, and the piston rod (341) of the air cylinder (33) is fixed to the gate as shown in FIG. 10. Push up the body aO and IC
When the insertion slot a7) is opened and the tilting table (2η) is tilted from the upper left position to the lower left position, the IC1'lq slides inside the package (P) with the back surface Cα of its main body, and then the fangs 11 Slide 1-1 on the guide body 61 as shown in the figure.
Then enter the frame (13) through the KIC insertion slot (L) and slide the upper copper wire (141-H) as shown in FIG.

When this jig R (+9 is removed from the tilting table D, the gate body a
O is completely inserted into the groove by the spring, and each IC insertion port 17) is closed.

Next, other embodiments of the present invention will be described.
To explain based on the figure, the jig (11,
For soldering, a plurality of IC insertion openings 12 as component insertion openings are drilled at certain intervals in one part of the υ of the frame body to be transported on the line. In addition, as shown in Figure 14, there are teeth on the lower side and upper side of each IC insertion slot. Support 1. Fix one end of the round steel bar i1 (631 (64)) and
(b3 The other end of (64) is fixed to the other side of the frame 61). The frame body υ is made of titanium, and the fA line is made of tungsten.

In addition, as shown in Fig. 13, a pair of elongated holes (2) are vertically drilled in the 1111 part of the Ikitaihi.
Insert the stepped screw marrow (from inner II + 11) into the inner part II + 11 so that it can move vertically so that its tip protrudes outward, and insert a recess into the groove η formed at the tip of the stepped screw 6j0 on both sides from the outside. Fit the holes F31 on both sides of the plate-shaped gate body side, and tighten the gate body to the end face of the large diameter part qυ of the stepped screw with the nut συ screwed onto this screw NUη from the outside. Obe (71) is K so that it can freely slide inside the long hole. By applying pressure in this way, a gate body is provided on the outer surface of one side of the frame so that each IC insertion slot 10 can be opened and closed simultaneously. It is a bending part for engaging a moving transport holder (not shown) from above, and C3 is a gripping part.

Then, as shown in Fig. 15, this jig (11a)
When it is inverted and fixed on the top surface of the tilting table σ, the gate body O'i mark will slide downward under its own weight and close to each IC insertion slot (
(goods) completely open. Each IC insertion slot (621 is
The guide bodies σ0 having a concave cross section are fixed to the support σω on the tilting table ca, and are opposed to the IC packages σ in several rows fixed on the support (7 rows).

This IC package (b) is, as shown in Figure 16,
It is a long container with a square-shaped cross section, and a large number of ICMLs are housed in series inside, and can be taken out from an opening at one end. Internal IC7p4 is connected to its lead frame J
A (Package (with 11 facing upward and protruding)
It is set on top of the base (7 places).

Returning to Fig. 15, when the tilting table σ4) is rotated counterclockwise to tilt the left frill 1 part downward, each CW in each row of package cages will be aligned with the bottom surface of the package. , slide it on the guide CO, and insert it between the 6 identified steel wires from each rc insertion port Qi21,
(ii Slide on the h's IC and load tightly between the button ring ICs as shown in Figure 17. At that time,
ICttl) slides stably with its back side (a) down inside the package ff'l, on the guide ae and on the steel all, so that the lead frame A
(Compared to when sliding with Jl down, the lateral vibration force (
The transfer from the package ■ to the field wire handlers β and υ can be carried out smoothly, and the posture when sleeping between the steel wires (64) can be maintained reliably in the same way as inside the package fT'), and the lead frame (l There is no risk that it will interfere with the insertion between the flag line fI3 due to the accuracy of the shape of the ICH.In addition, above the guide body a0, there is a
C (A guide member surface is provided to prevent LQ from floating.

Finally, as shown in FIG. The IC (IV) between the lines will not be extracted to the outside.

In addition, in the above embodiment, lCf1 is a package (goods).
The case has been described in which the scissors are transferred from the jig (If) (11,) to the jig (If) (11,), but if M is taken out from the jig (If) (11,) to the rc into the package (2), the present invention can be carried out in the same way for the scissors.

[Efficacy of invention]

According to the present invention, a jig that aligns and supports a large number of integrated circuit components using several 1M support rods and a package that continuously stores integrated circuit components are set in opposite directions, and the integrated circuit components are 1. Slide it on the back of the main body and transfer it between the package and the support rod of the jig. Therefore, it is possible to stably and smoothly slide the parts in each part over the entire back surface of the main body of the part, and it is also possible to smoothly transfer the parts between the parts. For example, even if there are variations in the length and spacing of the lead frames of parts, parts of various sizes can be slid smoothly at each part regardless of this, and they can be stably supported by the support rod of the jig on the back of the main body of the part. As a result, the parts do not come off from this support rod, and by setting the package in the reverse lock, the parts can be placed inside the package while maintaining a stable posture without tilting, with the entire back surface touching the opposite flat surface of the package. The parts can be slid in alignment and transferred smoothly, and there is no fear that the lead frame will get caught in the gaps between parts during transfer, and the parts can be inserted securely onto the support rod of the jig or vice versa. It can be collected and inserted into the package.

[Brief explanation of drawings]

Fig. 1 is a sectional view showing a conventional component insertion method, Fig. 2 is an enlarged sectional view of the interior of the jig, and Figs. 3 to 12 are related to an embodiment of the component insertion method of the present invention. Example: Figure 3 is a plan view of the holder and the jig, Figure 4 is a partially cutaway front view of the holder, Figure 5 is a perspective view of the jig in the opposite direction, but fixed on the moving table. , Fig. 6 is a front view of the first moving device, Fig. 7 is a plan view thereof, Fig. 8 is a perspective view of the IC aligned and supported by the support rod, and Fig. 9 shows the internal pressure of the package. The GIA diagram of the stored IC, Figure 10 is a sectional view showing how to insert the IC into the jig, Figure 11 is a sectional view taken along line 1-1 of Figure 10, Figure 12 is a cross-sectional view of Figure 10. ■-xma
The sectional views, Fang 13 to Fang 17 are related to other embodiments of the present invention, λ.13 is a perspective view of the jig, Fang 14 is a front view of its substitute S, and Fang 15 is a jig. A cross-sectional view showing a method of inserting an IC into the tool, a tooth 16 is a perspective view showing an IC package, and a fan 17 is a perspective view of an IC' inserted between support rods. To■・Reference integrated circuit component (IC), (A@・Lead frame, (α)@1 back, penalty・1 package, Qll (11
a) - jig, (+4) (1!i) (goods) (goods)... @ wire as a support rod, 07) (r; 21... IC insertion port as a component insertion port.

Claims (1)

[Claims] (11) When soldering an integrated circuit component to a lead frame, there is a jig that aligns and supports the main body of the component with a plurality of support rods, and a jig that is continuously installed in the component insertion opening of this jig to hold the integrated circuit component. A package that stores continuously,
A component insertion method characterized in that the integrated circuit component is transferred between the package and the support rod of the jig by sliding the integrated circuit component on the back side of the main body of the component by integrally tilting the component in the opposite direction.