JPS5986202A - Thick film resistance element - Google Patents

Thick film resistance element

Info

Publication number
JPS5986202A
JPS5986202A JP57196380A JP19638082A JPS5986202A JP S5986202 A JPS5986202 A JP S5986202A JP 57196380 A JP57196380 A JP 57196380A JP 19638082 A JP19638082 A JP 19638082A JP S5986202 A JPS5986202 A JP S5986202A
Authority
JP
Japan
Prior art keywords
thick film
resistor
resistance
wiring
trimmed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57196380A
Other languages
Japanese (ja)
Inventor
田口 康夫
中尾 悟至
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP57196380A priority Critical patent/JPS5986202A/en
Publication of JPS5986202A publication Critical patent/JPS5986202A/en
Pending legal-status Critical Current

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  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Non-Adjustable Resistors (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 〔発明の技術分野〕 本発明は、高電圧が印加される自動車用のハイブリッド
IC等に用いられる厚膜抵抗素子に関する。。
DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a thick film resistive element used in hybrid ICs for automobiles to which high voltage is applied. .

〔発明の技術的背景〕[Technical background of the invention]

、従来、厚膜抵抗素子としては第1図に示すものが知ら
れている。図中のJ 、 IVi夫々図示しない絶縁性
基板上に印刷された配線d’ターンである。この配線・
母ターン1,1間には一部が該配線・やターフ1,1を
被覆するように抵抗2が設けられている こうした構造の厚膜抵抗素子の抵抗値を微調整するとき
は、例えばレーザーにより抵抗2を右方にトリミングし
て切欠部3を設けることにより行なう。
2. Description of the Related Art Conventionally, as a thick film resistive element, one shown in FIG. 1 is known. J and IVi in the figure are wiring d' turns printed on an insulating substrate (not shown). This wiring/
A resistor 2 is provided between the main turns 1 and 1 so as to partially cover the wiring and the turfs 1 and 1. When finely adjusting the resistance value of a thick film resistor element having such a structure, for example, laser This is done by trimming the resistor 2 to the right to provide a notch 3.

〔背景技術の問題点〕[Problems with background technology]

しかしながら、前述した構造の厚膜抵抗素子においては
、第2図に示す如く、切欠部3に最も近いところで′電
流が一番多くなり電流集中が起こる。したがって、抵抗
2に大電圧やサージ電圧が印加される毎に切欠部3から
トリミング方向に抵抗2が焼は切れ、遂には第3図の矢
印で示す方向にオープンに至るという欠点があった。
However, in the thick film resistive element having the above-described structure, as shown in FIG. 2, the current is greatest at the point closest to the notch 3, causing current concentration. Therefore, each time a large voltage or surge voltage is applied to the resistor 2, the resistor 2 burns out in the trimming direction from the notch 3, and eventually opens in the direction shown by the arrow in FIG. 3, which is a drawback.

〔発明の目的〕[Purpose of the invention]

本発明は上記事情に鑑みてなされたもので、配線パター
ン間の抵抗が完全にオープンになるのを阻止した厚膜抵
抗素子を提供することを目的とするものである。
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a thick film resistive element that prevents the resistance between wiring patterns from becoming completely open.

〔発明の概要〕[Summary of the invention]

本発明は、絶縁性基板上の配線・ぐターン間に接続され
た抵抗に、分離部を前記抵抗のトリミングすべき方向と
略直交する方向に設けることによって、トリミング後の
大電圧やサージ電圧の印加により焼切れる抵抗部分を最
小限に押え、抵抗がオープンとなるのを阻止するもので
ある。
In the present invention, by providing a separating portion in a direction substantially perpendicular to the direction in which the resistor is to be trimmed, the resistor connected between the wiring and the pattern on the insulating substrate can be used to reduce large voltages and surge voltages after trimming. This is to minimize the resistance portion that burns out due to application of voltage, and prevent the resistance from becoming open.

〔発明の実施例〕[Embodiments of the invention]

以下、本発明の一実施例である厚膜抵抗素子を第4図に
基づいて説明する。
Hereinafter, a thick film resistive element which is an embodiment of the present invention will be explained based on FIG.

図中のJl、11は、夫々絶縁性基板(図示せず)上に
形成された2つの平行な配線パターンである3、これら
配線パターン11.11間には、抵抗12が配線ノ母タ
ーン11.11上に延在するように接続されている。ま
た、前記抵抗12にはトリミングすべき方向と略直交す
る方向、つまり配線・やターン11.11をまたぐ方向
に分離部′13が設けられている。そして、この分・准
部13により前記抵抗12がトリミシグすべき抵抗領域
14m とトリミングしない抵抗領域142とに分離さ
れている。こうした構造の厚膜抵抗素子において、配線
パターン1ノ。
Jl and 11 in the figure are two parallel wiring patterns formed on an insulating substrate (not shown) 3. Between these wiring patterns 11 and 11, a resistor 12 is connected to the wiring mother turn 11. .11. Further, the resistor 12 is provided with a separating portion '13 in a direction substantially perpendicular to the direction in which trimming is to be performed, that is, in a direction that straddles the wiring and the turns 11.11. The resistor 12 is divided into a resistance region 14m to be trimmed and a resistance region 142 not to be trimmed by this portion 13. In the thick film resistor element having such a structure, the wiring pattern 1.

11間の抵抗値を微調整するときは、例えばトリミング
すべき抵抗領域141のみをレーザー等により配線パタ
ーン11.11と平行して右方向にトリミングし、切欠
部15を設けることによって行う。
When finely adjusting the resistance value between the wiring patterns 11 and 11, for example, only the resistance region 141 to be trimmed is trimmed to the right in parallel with the wiring patterns 11 and 11 using a laser or the like, and a notch 15 is provided.

しかして、かかる構造の厚膜抵抗素子によれば、配線・
ぐターン11.11間の抵抗12に、分離部13がトリ
ミング方向と直交する方向に設けられているため、トリ
ミングすべき抵抗領域141’k)リミング後、大電圧
の印加等によって該抵抗値f141が切欠部15の長手
方向に焼は切れた場合、その焼は切れは分離部13で停
止され、トリミングしない抵抗領域14冨までその影□
響が及ぶのを阻止できる。したがって、配線パターン1
1、l1間の抵抗値は多少変動するものの、致命不良に
なることを回避できる。
However, according to the thick film resistor element having such a structure, wiring and
Since the separating portion 13 is provided in the resistor 12 between the first and second turns 11 and 11 in a direction perpendicular to the trimming direction, the resistance value f141 is removed by applying a large voltage after trimming the resistor region 141'k) to be trimmed. If the burnout breaks in the longitudinal direction of the notch 15, the breakage is stopped at the separation part 13, and its influence extends to the depth of the resistance area 14 that is not trimmed.
You can prevent the effects from spreading. Therefore, wiring pattern 1
Although the resistance value between 1 and 11 fluctuates somewhat, fatal defects can be avoided.

なお、上記実施例では分離部13を1つ設ける場合につ
いて述べたが、これに限らず、分離部13を複数個設け
てトリミングすべき抵抗領域1匂を細分化してもよい。
In addition, although the case where one isolation|separation part 13 is provided was described in the said Example, it is not limited to this, and the resistance area|region 1 which should be trimmed may be divided into multiple isolation|separation parts 13 by providing multiple isolation|separation parts 13.

このようにすれば、焼き切れた場合の配線パターン11
.11間の抵抗値の変動を少なくすることができる1、
本発明に係る厚膜抵抗素子としては、第4図図示の構造
のものに限らず、例えば、第5図に示す如く抵抗12に
分離部としてのスリット16を設けた構造のもの、又は
肩6図に示す如く抵抗12に分離部としての細長な開孔
部17を設けた構造のもの、あるいは第7図に示す如く
抵抗12に分離部13′ヲ複数設けた構造のもの、その
他図示しないが抵抗のトリミング方向に対応する箇所付
近に分離部としての開孔部を設けた構造のもの等種々の
ものが挙げられる。
In this way, the wiring pattern 11 in case of burnout
.. 1, which can reduce the fluctuation in resistance value between 11 and 11;
The thick film resistor element according to the present invention is not limited to the structure shown in FIG. 4, but for example, as shown in FIG. As shown in the figure, the resistor 12 has a structure in which an elongated opening 17 is provided as a separation part, or as shown in FIG. There are various types, such as those having a structure in which an opening is provided as a separation part near a location corresponding to the trimming direction of the resistor.

また、本発明の厚膜抵抗素子の変形例として、第8図に
示す如く、一方の配線パターン21の2つの平行な配線
部221,22.間に他方の配線A?ターン23を、前
記配線部221 e 22□と平行となるように設け、
かつ前記配線部221゜222と配線パターン23とを
跨設するように抵抗24を設けた構造のものでもよい。
Further, as a modification of the thick film resistive element of the present invention, as shown in FIG. 8, two parallel wiring portions 221, 22 . Is the other wire A in between? The turn 23 is provided so as to be parallel to the wiring portion 221e 22□,
Further, a structure may be adopted in which a resistor 24 is provided so as to straddle the wiring portions 221 and 222 and the wiring pattern 23.

かかる構成によれば、配線パターン23を境として配線
部221側と配線部22鵞側とに夫々独立して抵抗領域
251,25.が形成されることになるため、一方の抵
抗領域251を配線部221に平行にトリミングした場
合、その後の大電圧等の印加による焼は切れの有無に関
係なく、他の抵抗領域25:のオープンを回避できる。
According to this configuration, the resistance regions 251, 25. Therefore, if one resistor region 251 is trimmed in parallel to the wiring section 221, burning due to the subsequent application of a large voltage, etc. will cause an open in the other resistor region 25, regardless of whether there is a break or not. can be avoided.

〔発明の効果〕〔Effect of the invention〕

以上詳述した如く本発明によれば、配線ノやターン間の
抵抗が完全にオープンになるのを阻止しうる信頼性の高
い厚膜抵抗素子を提供できるものである。
As described in detail above, according to the present invention, it is possible to provide a highly reliable thick film resistive element that can prevent the resistance between wiring lines and turns from becoming completely open.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の厚膜抵抗素子の抵抗をトリミングした状
態を示す平面図、第2図は第1図図示の厚膜抵抗素子の
抵抗に電圧を印加したときの電流の流れを説明するため
の平面図、第3図は同厚膜抵抗素子の抵抗がオープンと
なるところを説明するための平面図、第4図は本発明の
一実施例である厚膜抵抗素子の抵抗ヲトリミングした状
態を示す平面図、第5図〜第7図は本発明の他の実施例
である厚膜抵抗素子の平面図、第8図は本発明の厚膜抵
抗素子の変形例を示す平面図である。 ノ1,21.23・・・配線パターン、12.24・・
・抵抗、13.13’・・・分離部、141・・・トリ
ミングすべき抵抗領域、142・・・トリミングしない
抵抗領域、15・・・切欠部、16・・・スリット、1
7・・・細長な間孔部、221 + 222・・・配線
部、251.252・・・抵抗領域1、 出願人代理人  弁理士 鈴 江 武 画才 1 図 を 2 μs ★3 図 才4氏 ス 二。
Figure 1 is a plan view showing a state in which the resistance of a conventional thick film resistance element has been trimmed, and Figure 2 is for explaining the flow of current when a voltage is applied to the resistance of the thick film resistance element shown in Figure 1. FIG. 3 is a plan view for explaining where the resistance of the thick film resistor element is open, and FIG. 4 is a state where the resistance of the thick film resistor element according to an embodiment of the present invention has been trimmed. FIGS. 5 to 7 are plan views of thick film resistive elements according to other embodiments of the present invention, and FIG. 8 is a plan view showing a modification of the thick film resistive element of the present invention. . No. 1, 21.23... Wiring pattern, 12.24...
- Resistance, 13.13'... Separation part, 141... Resistance area to be trimmed, 142... Resistance area not to be trimmed, 15... Notch, 16... Slit, 1
7...Elongated hole part, 221 + 222...Wiring part, 251.252...Resistance area 1, Applicant's agent Patent attorney Takeshi Suzue Artist 1 Diagram 2 μs ★3 Artist 4 Suni.

Claims (1)

【特許請求の範囲】[Claims] 絶縁性基板上の配線パターン間に接続された抵抗に、分
離部を前記抵抗のトリミングすべき方向と略直交する方
向に設けたことを特徴とする11膜抵抗素子。
11. An 11-film resistance element, characterized in that a resistor connected between wiring patterns on an insulating substrate is provided with a separating portion in a direction substantially perpendicular to the direction in which the resistor is to be trimmed.
JP57196380A 1982-11-09 1982-11-09 Thick film resistance element Pending JPS5986202A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57196380A JPS5986202A (en) 1982-11-09 1982-11-09 Thick film resistance element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57196380A JPS5986202A (en) 1982-11-09 1982-11-09 Thick film resistance element

Publications (1)

Publication Number Publication Date
JPS5986202A true JPS5986202A (en) 1984-05-18

Family

ID=16356902

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57196380A Pending JPS5986202A (en) 1982-11-09 1982-11-09 Thick film resistance element

Country Status (1)

Country Link
JP (1) JPS5986202A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5994801A (en) * 1982-11-22 1984-05-31 松下電器産業株式会社 Printed resistance part
JPS6139505A (en) * 1984-07-31 1986-02-25 沖電気工業株式会社 Method of trimming thick film resistor

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56153756A (en) * 1980-04-22 1981-11-27 Fujikura Ltd Trimming method for resistor body

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56153756A (en) * 1980-04-22 1981-11-27 Fujikura Ltd Trimming method for resistor body

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5994801A (en) * 1982-11-22 1984-05-31 松下電器産業株式会社 Printed resistance part
JPS6139505A (en) * 1984-07-31 1986-02-25 沖電気工業株式会社 Method of trimming thick film resistor

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