JPS599563U - infrared light emitting device - Google Patents

infrared light emitting device

Info

Publication number
JPS599563U
JPS599563U JP1982103007U JP10300782U JPS599563U JP S599563 U JPS599563 U JP S599563U JP 1982103007 U JP1982103007 U JP 1982103007U JP 10300782 U JP10300782 U JP 10300782U JP S599563 U JPS599563 U JP S599563U
Authority
JP
Japan
Prior art keywords
light emitting
emitting device
infrared light
package
end surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982103007U
Other languages
Japanese (ja)
Inventor
平野 正夫
高岡 元章
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corp filed Critical Omron Corp
Priority to JP1982103007U priority Critical patent/JPS599563U/en
Publication of JPS599563U publication Critical patent/JPS599563U/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの考案の第1の実施例に係る発光装置の構成
図、第2図は同じく第2の実施例に係る発光装置の構成
図、第3図は同じく第3の実施例に係る発光装置の構成
図、第4図は同上発光装置の動作を説明するためのスペ
グトル特性図である。 1・・・・・・リード端子、2・・・・・・赤外発光素
子(赤外    −発光ダイオード)、3・・川すぐツ
ケージ、3a・・・・・・出射部、4・・・・・・孔、
5・・・用赤外/可視変換螢光体、6・・・・・・光導
体(光ファイバ)、8・・・・・・赤外線、9・・・・
・・可視光。
Fig. 1 is a block diagram of a light emitting device according to a first embodiment of this invention, Fig. 2 is a block diagram of a light emitting device according to a second embodiment, and Fig. 3 is a block diagram of a light emitting device according to a third embodiment. FIG. 4 is a block diagram of the light emitting device, and is a spectral characteristic diagram for explaining the operation of the light emitting device. 1...Lead terminal, 2...Infrared light emitting element (infrared light emitting diode), 3...River straight cage, 3a...Emission part, 4... ...hole,
5... infrared/visible conversion phosphor, 6... light guide (optical fiber), 8... infrared rays, 9...
··visible light.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 赤外発光素子チップを出射部を有するパッケージ内にマ
ウントしたものにおいて、上記パッケージ内に上記チッ
プに近接してその主光軸の側方に配置され、上記チップ
より生じる赤外線の一部を受けて可視光を発生する赤外
/可視変換螢光体と、一端面が上記螢光体に近接して配
置されるとともに他端面が上記パッケージの外部に引き
出されて該パッケージに取付けられ、上記螢光体から生
じた可視光を上記一端面から他端面に導いて外部に出射
させる光導体とを備えることを特徴なする赤外発光装置
In a device in which an infrared light emitting element chip is mounted in a package having an emission part, an infrared light emitting device is disposed in the package in close proximity to the chip and on the side of its main optical axis, and receives part of the infrared rays generated by the chip. an infrared/visible conversion phosphor that generates visible light; one end surface is disposed close to the phosphor, the other end surface is drawn out of the package and attached to the package; An infrared light emitting device comprising: a light guide that guides visible light generated from the body from the one end surface to the other end surface and emits it to the outside.
JP1982103007U 1982-07-07 1982-07-07 infrared light emitting device Pending JPS599563U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982103007U JPS599563U (en) 1982-07-07 1982-07-07 infrared light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982103007U JPS599563U (en) 1982-07-07 1982-07-07 infrared light emitting device

Publications (1)

Publication Number Publication Date
JPS599563U true JPS599563U (en) 1984-01-21

Family

ID=30242531

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982103007U Pending JPS599563U (en) 1982-07-07 1982-07-07 infrared light emitting device

Country Status (1)

Country Link
JP (1) JPS599563U (en)

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