JPS60101774U - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPS60101774U JPS60101774U JP19282383U JP19282383U JPS60101774U JP S60101774 U JPS60101774 U JP S60101774U JP 19282383 U JP19282383 U JP 19282383U JP 19282383 U JP19282383 U JP 19282383U JP S60101774 U JPS60101774 U JP S60101774U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- semicircular
- holes
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
−第１図はこの考案のプリント基板を構成するための１
枚のプリント基板のみを表わした捨て基板を有する状態
の斜視図、第２図はその側断面図、第一はその捨て基板
を折り取った状態を示す斜 、親図、第４図は第１
のプリント基板と第２のプリント基板を重ね合わせて電
気的接続を行なったこの考案にムるプリント基板の斜視
図、第５図はその側ｉ面図である。
１・・・プリント基板、２・・・捨て基板、３・・・Ｖ
字状のカット溝、４・・叩形状スルーホール、５・・・
パターン、６・・・部品、７・・・導電箔パターンや部
品の取付は面、８・・・片面、９・・・絶縁膜、１０・
・・半円状スルーホール、１１・・・第１のプリント基
板、１２・・・第２のプリント基板、１４・・・半円状
スルーホールの壁面、１１５・・・半田。-Figure 1 shows a diagram for configuring the printed circuit board of this invention.
FIG. 2 is a side sectional view of the disposable board showing only one printed circuit board; the first is a perspective view showing the state in which the disposable board is broken off; FIG. 4 is the main view;
FIG. 5 is a perspective view of a printed circuit board according to this invention in which the printed circuit board and the second printed circuit board are superimposed and electrically connected, and FIG. 5 is a side view thereof. 1...Printed board, 2...Disposable board, 3...V
Letter-shaped cut groove, 4... Tap-shaped through hole, 5...
Pattern, 6... Parts, 7... Conductive foil pattern and parts are mounted on one side, 8... One side, 9... Insulating film, 10.
... Semicircular through hole, 11... First printed circuit board, 12... Second printed circuit board, 14... Wall surface of semicircular through hole, 115... Solder.
Claims (1)
の半円状スルーホールを有し片面に絶縁膜を施した第１
のプリント基板と、この第１のプリント−基板と同じ位
置に設けた複数個の半円状スルーホールを有し片面に絶
縁膜を施した第２のプリント基板とよりなり、かつ、上
記第１のプリント基板と第２プリント基板の各々の絶縁
横面を合、 わすて第１めプリント基板と第２のプリン
ト基板の各々の複数個の半円状スルーホールとを半田付
などにより連続的に電気的接続したことを特徴とするプ
リント基板。 、The first one has a plurality of semicircular through holes connected to a conductive foil pattern forming an electric circuit, and has an insulating film coated on one side.
a second printed circuit board having a plurality of semicircular through holes provided at the same position as the first printed circuit board and an insulating film coated on one side; Align the insulating lateral surfaces of each of the printed circuit boards and the second printed circuit board, and then connect the plurality of semicircular through holes of each of the first printed circuit board and the second printed circuit board continuously by soldering or the like. A printed circuit board characterized by electrical connections. ,
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19282383U JPS60101774U (en) | 1983-12-14 | 1983-12-14 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19282383U JPS60101774U (en) | 1983-12-14 | 1983-12-14 | Printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60101774U true JPS60101774U (en) | 1985-07-11 |
Family
ID=30414868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19282383U Pending JPS60101774U (en) | 1983-12-14 | 1983-12-14 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60101774U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63102397A (en) * | 1986-10-20 | 1988-05-07 | フアナツク株式会社 | Multilayer printed interconnection board |
-
1983
- 1983-12-14 JP JP19282383U patent/JPS60101774U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63102397A (en) * | 1986-10-20 | 1988-05-07 | フアナツク株式会社 | Multilayer printed interconnection board |
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