JPS60106689A - レ−ザ加工装置 - Google Patents

レ−ザ加工装置

Info

Publication number
JPS60106689A
JPS60106689A JP58213931A JP21393183A JPS60106689A JP S60106689 A JPS60106689 A JP S60106689A JP 58213931 A JP58213931 A JP 58213931A JP 21393183 A JP21393183 A JP 21393183A JP S60106689 A JPS60106689 A JP S60106689A
Authority
JP
Japan
Prior art keywords
solution
pattern
radiant energy
processing apparatus
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58213931A
Other languages
English (en)
Japanese (ja)
Other versions
JPH033551B2 (de
Inventor
Midori Imura
井村　みどり
Makoto Morijiri
誠 森尻
Masanobu Hanazono
雅信 華園
Shinichi Wai
伸一 和井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58213931A priority Critical patent/JPS60106689A/ja
Publication of JPS60106689A publication Critical patent/JPS60106689A/ja
Publication of JPH033551B2 publication Critical patent/JPH033551B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462—Nozzles; Features related to nozzles

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP58213931A 1983-11-16 1983-11-16 レ−ザ加工装置 Granted JPS60106689A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58213931A JPS60106689A (ja) 1983-11-16 1983-11-16 レ−ザ加工装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58213931A JPS60106689A (ja) 1983-11-16 1983-11-16 レ−ザ加工装置

Publications (2)

Publication Number Publication Date
JPS60106689A true JPS60106689A (ja) 1985-06-12
JPH033551B2 JPH033551B2 (de) 1991-01-18

Family

ID=16647409

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58213931A Granted JPS60106689A (ja) 1983-11-16 1983-11-16 レ−ザ加工装置

Country Status (1)

Country Link
JP (1) JPS60106689A (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0230393A (ja) * 1988-07-19 1990-01-31 Fujita Corp レーザ照射ビームの吸収安全装置
CN106181078A (zh) * 2016-07-19 2016-12-07 武汉华工激光工程有限责任公司 一种水冷治具装置及其使用方法
JP2018040033A (ja) * 2016-09-07 2018-03-15 株式会社スギノマシン レーザアブレーションによる金属ナノコロイド生成方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59225896A (ja) * 1983-06-06 1984-12-18 Semiconductor Energy Lab Co Ltd レ−ザ加工方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59225896A (ja) * 1983-06-06 1984-12-18 Semiconductor Energy Lab Co Ltd レ−ザ加工方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0230393A (ja) * 1988-07-19 1990-01-31 Fujita Corp レーザ照射ビームの吸収安全装置
CN106181078A (zh) * 2016-07-19 2016-12-07 武汉华工激光工程有限责任公司 一种水冷治具装置及其使用方法
JP2018040033A (ja) * 2016-09-07 2018-03-15 株式会社スギノマシン レーザアブレーションによる金属ナノコロイド生成方法

Also Published As

Publication number Publication date
JPH033551B2 (de) 1991-01-18

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