JPS60119800A - Method of cutting lead of electronic part - Google Patents
Method of cutting lead of electronic partInfo
- Publication number
- JPS60119800A JPS60119800A JP58227754A JP22775483A JPS60119800A JP S60119800 A JPS60119800 A JP S60119800A JP 58227754 A JP58227754 A JP 58227754A JP 22775483 A JP22775483 A JP 22775483A JP S60119800 A JPS60119800 A JP S60119800A
- Authority
- JP
- Japan
- Prior art keywords
- blade
- lead
- leads
- cut
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005520 cutting process Methods 0.000 title claims description 10
- 238000000034 method Methods 0.000 title claims description 7
- 238000010008 shearing Methods 0.000 claims description 5
- 238000005452 bending Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Shearing Machines (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 この発明は電子部品リード切断方法に関する。[Detailed description of the invention] The present invention relates to a method for cutting electronic component leads.
コンデンサ。抵抗或いは各半導体装置のような電子部品
をプリント基板罠装填するとき一電子部品のリードを、
プリント基板に設けた装填孔に挿込み、その裏面りら突
抜けた足の部分を適当な長さに切断し、そのあと半田等
によって同市するよらＫしている。capacitor. When loading electronic components such as resistors or semiconductor devices into a printed circuit board trap, connect the leads of one electronic component to the printed circuit board trap.
It is inserted into the loading hole provided on the printed circuit board, the leg part that penetrates through the back side is cut to an appropriate length, and then fixed with solder or the like.
第１図〜第８図は従来のリードの切断方法を示し、ｌは
電子部品、２け複数の’Ｊ−）’、８はプリント基板等
の基板、４は基板８に設けられたリード権通用の装填孔
、５けカッタで上刃６と下刃７とによシ構成されてあり
、各月には貫通する刃部８．９を備えてしる。電子部品
ｌのリー）２は装填孔４のそれぞれに挿通される。そし
て抜き出たリード２は各月６．７の各刃部８．９に挿通
される。このときの状即を示したのガ第２図である。Figures 1 to 8 show a conventional lead cutting method, where l is an electronic component, two or more 'J-)'s, 8 is a board such as a printed circuit board, and 4 is a lead cutter provided on the board 8. It has a general-purpose loading hole, a 5-digit cutter, and is composed of an upper blade 6 and a lower blade 7, and each month is provided with a penetrating blade part 8.9. The lees 2 of the electronic components 1 are inserted into each of the loading holes 4. The extracted lead 2 is then inserted into each blade part 8.9 of each month 6.7. FIG. 2 shows the situation at this time.
そして基板８及び上刃６を同市したまま、下刃７を矢印
方向に移動させる。するとリード２０足は上刃６と下刃
７との摺接によす切断される。このとき第８図に示すよ
うに、リード２は刃部８内にｈｌ＜て下刃７の移動方向
に沿って（字状に屈曲する。Then, the lower blade 7 is moved in the direction of the arrow while keeping the base plate 8 and the upper blade 6 in the same position. Then, the 20 leads are cut by the sliding contact between the upper blade 6 and the lower blade 7. At this time, as shown in FIG. 8, the lead 2 is bent into the blade portion 8 in a shape along the moving direction of the lower blade 7.
ところでこのように切断したとき、リード２が屈曲して
ｂるので、リード２けこれが真直な場合より本抜けに（
（なり、した−ｈＸって簡単に電子部品１−Ａ！基板８
から離脱しないようになって都合がよいが、しかし図示
の状態から理解きれるように各リード２けｂずれも同じ
方向に屈曲して粘るので、その屈曲方向に沿って上方に
引上げたとすると、簡単に装填孔４から抜は出てしまう
ことがある。このような抜は出しは、リードを半田で同
市するまではできる限り阻止することが望ましｂことは
いうまでもない。By the way, when the lead 2 is cut in this way, the lead 2 is bent and curved, so it is cut more easily than if the lead 2 were straight.
(Yes, I did-hX is easy to use for electronic parts 1-A! Board 8
However, as you can clearly see from the diagram, each lead 2 is bent and sticky in the same direction, so if you pull it upward along the bending direction, it is easy to The ejector may come out from the loading hole 4. It goes without saying that it is desirable to prevent this kind of removal as much as possible until the leads are soldered together.
この発明はリードが基板から簡単には抜は出な論ような
形状に切断することを目的とする。The object of this invention is to cut the leads into a shape that cannot be easily pulled out from the substrate.
この発明は各リードのうちの少くとも２本のリードを互
いに反対方向に屈曲させながら切断することを特徴とす
る。The present invention is characterized in that at least two of each lead are cut while being bent in opposite directions.
この発明の実施例を第４図以降の各図によって鮮明する
。な卦第１１ｆｆｉ〜第８図と同じ符号を附した部分は
同−又は対応する部分を示す。この発明において使用す
るカッタ５の上刃６は従来のものと大差はなりが、下刃
７けその各刃部９Ａ、９Ｂを方形状とし、 Ｌ２５”も
切断のためのせん断方向（矢印方向）に対して傾斜させ
である。そしてこの場合各刃部９Ａ、９Ｂの斜辺部９ａ
、９ｂけ互いに平行にならなりよらにしてあり、図の例
は矢印で示すせん断方向に沿うＭＬを対称線として互−
に対称となるように傾斜させである。そして前記線りけ
。Embodiments of the present invention will be clearly explained with reference to FIG. 4 and subsequent figures. Parts with the same reference numerals as in Figures 11ffi to 8 indicate the same or corresponding parts. The upper blade 6 of the cutter 5 used in this invention is not much different from the conventional one, but each blade part 9A, 9B of the lower blade 7 is square shaped, and L25'' is also in the shearing direction for cutting (direction of the arrow). In this case, the oblique side portion 9a of each blade portion 9A, 9B
, 9b are parallel to each other and are skewed.
It is tilted so that it is symmetrical. And the line above.
両！Ｊ−）’！ＩＩを結ぶ線に沿うように、たとえば互
すに平行するよりに設定されである。Both! J-)'! For example, they are set parallel to each other along a line connecting II.
リード２の切断は従来と同じく、リード２を基板８の装
填孔４に挿通ずる。そしてこれから抜き出た各リード２
を更に上刃６の刃部８及び下刃７の刃部９Ａ 、９Ｂ
Ｋ挿通する。そして下刃７を矢印方向すなわちせん断方
向に移動させる。第５図はこのときの切断の過程を順次
示したもので１人は当初の状態を示し、ここから下刃７
が矢印方向に移動すると、Ｂのようにリード２け刃部９
Ａの奥側の斜辺部９ａに及び刃部９Ｂの奥側の斜辺部９
ｂに接する。更に下刃７が移動するとリード２＃−ｉ斜
辺部９ａ、９ｂに沿って摺接しようとする。そして更に
下刃７≠ｔＳ動すればリード２の足は両刃部８゜９Ａ、
９Ｂによって切断される。このとき刃部９Ａに挿通され
たリード２にっｂては下刃７の移動方向をＰＩ、斜辺部
９ａの傾斜方向をｐｍとすれば両方向Ｐｉ、ＰＩの合成
方向Ｐ８ に向う方向にリード２は屈曲されながら切断
されて−（。同じように刃部９Ｂに挿通されたリード２
につｂても、斜辺部９ｂの傾斜方向をＰ窮′とすれば一
両方向ＰＩ、Ｐｌの合成方向ＰａＫ向ら方向にリード２
は屈曲されながら切断されていく、ｌ
そして両刃部９の斜辺部９ａ、９ｂは互すに反対方向に
傾斜してｂるので、した雀って両リード２け互−に反対
方向Ｋ（字状に屈曲する（第６図参照）６そのため電子
部品１を基板３から引抜こうとするカカ；働層ても、少
Ｘとも一方のリードが装填孔４に引掛るようにな抄、し
たがって簡単には引出すことができないようになる。The lead 2 is cut by inserting the lead 2 into the loading hole 4 of the board 8 in the same way as in the conventional case. And each lead 2 extracted from this
Furthermore, the blade part 8 of the upper blade 6 and the blade parts 9A and 9B of the lower blade 7
Insert K. Then, the lower blade 7 is moved in the direction of the arrow, that is, in the shearing direction. Figure 5 sequentially shows the cutting process at this time; one person shows the initial state, and from there, the lower blade 7
When the lead moves in the direction of the arrow, the lead double-edge part 9 moves as shown in B.
A and the back oblique side 9 of the blade part 9B.
touches b. When the lower blade 7 further moves, it attempts to come into sliding contact with the leads 2#-i along the oblique sides 9a and 9b. Then, if the lower blade 7≠tS moves further, the legs of the lead 2 will be at the double-edged part 8°9A,
Cut by 9B. At this time, if the moving direction of the lower blade 7 is PI and the inclination direction of the oblique side part 9a is pm, then the lead 2 b inserted into the blade part 9A is directed in both directions Pi, and in the direction toward the composite direction P8 of PI. The lead 2 is bent and cut.
Also, if the inclination direction of the hypotenuse portion 9b is P', then the lead 2 will be directed in both directions PI and in the composite direction PaK of Pl.
is cut while being bent, and since the oblique sides 9a and 9b of the double-edged part 9 are inclined in opposite directions, the two leads are cut in the opposite direction K (letter 9). (See Figure 6) 6 Therefore, the force of trying to pull out the electronic component 1 from the board 3; You will not be able to withdraw it.
なおリードを８本以上備えた電子部品については、その
うちの２本につ−てこの発明にしたがって切断すればよ
く、残りのリードにつｂては従来と同じ形状の刃部で切
断するようにすればより０或すは残りのリードにつｂて
も前記した２本と同じようにそれぞれ屈曲方向が異なる
ように切断するようにしてもよりこともちろんである。For electronic components with eight or more leads, two of them need only be cut according to the present invention, and the remaining leads can be cut with a blade of the same shape as before. In this case, it is of course possible to cut the remaining leads so that they bend in different directions, as in the case of the two leads described above.
そのためにけ残りのリードにっｂてこれを切断する刃部
を、異なる角度で傾斜させておけばより０以上詳述した
よりにこの発明によれば、Ｗ子部品の少（とも２木のり
一ドを、基板に挿通した状態でこれより抜き出た部分か
ら互込に反対方向に屈曲させて切断するようにしたので
、その切断後におりて、リードは基板の装填孔に引掛っ
て抜けに（（なり、これにより基板からの離脱を確実に
防止できるとｂつた効果を奏する。For this purpose, if the blade part that cuts the remaining lead is inclined at different angles, it will be possible to reduce the number of W child parts (total of two wood parts). The lead is cut by inserting it into the board and bending it in the opposite direction reciprocally from the part that comes out. (() This has the effect of reliably preventing separation from the substrate.
第１図は従来方法の実施状況を示す斜視図、第２図はそ
の断面図、第８図は切断後の断面図、第４甲けこの発明
の実施例方法を説明するための分解斜視図、第５図は動
作詩明図、第６図は切断後の断面図である。Fig. 1 is a perspective view showing the implementation status of the conventional method, Fig. 2 is a cross-sectional view thereof, Fig. 8 is a cross-sectional view after cutting, and Fig. 4 is an exploded perspective view for explaining the embodiment method of the present invention. , FIG. 5 is a diagram showing the operation, and FIG. 6 is a cross-sectional view after cutting.
Claims (1)
挿通された電子部品の少くとも２本のり−Ｆの足を切断
する方法において、前記下刃の前記各リード切断用の刃
部を、前記下刃のせん断方向に対して互すに反対方向に
傾斜せしめておき、前記２本のリードを結ぶ線に沿ら方
向を前記せん断方向として前ｉｅ上刃の刃部と下刃の傾
斜した刃部とによって前記リードの足をせん断してなる
電子部品用リード切断方法。In a method for cutting at least two lead-F legs of an electronic component inserted into a loading hole of a board using a cutter having an upper blade and a lower blade, the blade portion of the lower blade for cutting each lead is , the lower blade is tilted in directions opposite to each other with respect to the shearing direction, and the blade portion of the upper blade and the lower blade are tilted with the shearing direction being along a line connecting the two leads. A method for cutting leads for electronic components, the method comprising shearing the legs of the leads with a blade section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58227754A JPS60119800A (en) | 1983-11-30 | 1983-11-30 | Method of cutting lead of electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58227754A JPS60119800A (en) | 1983-11-30 | 1983-11-30 | Method of cutting lead of electronic part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60119800A true JPS60119800A (en) | 1985-06-27 |
| JPH0216040B2 JPH0216040B2 (en) | 1990-04-13 |
Family
ID=16865849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58227754A Granted JPS60119800A (en) | 1983-11-30 | 1983-11-30 | Method of cutting lead of electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60119800A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6230478U (en) * | 1985-08-02 | 1987-02-24 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6320650A (en) * | 1986-07-15 | 1988-01-28 | Nec Corp | Tss command batch job processing system |
-
1983
- 1983-11-30 JP JP58227754A patent/JPS60119800A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6320650A (en) * | 1986-07-15 | 1988-01-28 | Nec Corp | Tss command batch job processing system |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6230478U (en) * | 1985-08-02 | 1987-02-24 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0216040B2 (en) | 1990-04-13 |
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