JPS6016558U - board circuit device - Google Patents
board circuit deviceInfo
- Publication number
- JPS6016558U JPS6016558U JP8860384U JP8860384U JPS6016558U JP S6016558 U JPS6016558 U JP S6016558U JP 8860384 U JP8860384 U JP 8860384U JP 8860384 U JP8860384 U JP 8860384U JP S6016558 U JPS6016558 U JP S6016558U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- electrode layer
- ceramic
- printed
- conductive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は基板回路装置の従来例を適用したテレビジョン
のチューナ装置の縦断面図、第２図及び第３図は夫々本
考案になる基板回路装置の１実施例を適用したテレビジ
ョンのチューナ装置の縦断面図及び斜視図、第４図は上
記チューナ装置の回路部品を基板へ取付ける状態を示す
斜視図、第５図Ａ−Ｃは夫々上記基板の種々の取付孔の
平面図、第６図は上記チューナ装置を構成する枠板の斜
視図、第７図及び第８図は夫々上記チューナ装置のセラ
ミック基板の下面にコンデンサ及び抵抗体を順次形成し
た後更に他の回路素子を取付ける工程を示す図である。
１・・・・・・チューナケース、２・・・・・・セラミ
ック基板、３、 １３（１３１，１３２）・・・・・・
シールド板１，４゜１７・・・・・・回路部品、５，１
８・・・・・・基板エレメント、６・・・・・・入力端
子、１１・・・・・・膜状素子、１２・・・・・・トラ
ンジスタチップ、１５・・・・・・コイル、１６・・・
・・・インダクタ、１９・・・・・・トリマコンデンサ
、２１・・曲枠板、２２． ２３． ３５・・・・・・
半田、２４・・四ケース蓋、２５・・・・・・配線パタ
ーン、２６１，２６２・・・・・・極板パターン、２７
・・曲セラミック誘電層、２８・・・・・・コンデンサ
、２９・・・・・・セラミック絶縁層、３０・・・・・
・電極板部、３１・・・・・・抵抗体。
第１図
【
第３図FIG. 1 is a vertical cross-sectional view of a television tuner device to which a conventional example of a board circuit device is applied, and FIGS. A vertical sectional view and a perspective view of the device, FIG. 4 is a perspective view showing how the circuit components of the tuner device are attached to the board, FIGS. The figure is a perspective view of a frame plate constituting the tuner device, and FIGS. 7 and 8 show the process of sequentially forming capacitors and resistors on the lower surface of the ceramic substrate of the tuner device, and then attaching other circuit elements. FIG. 1... Tuner case, 2... Ceramic board, 3, 13 (131, 132)...
Shield plate 1,4゜17...Circuit parts, 5,1
8... Substrate element, 6... Input terminal, 11... Membrane element, 12... Transistor chip, 15... Coil, 16...
... Inductor, 19 ... Trimmer capacitor, 21 ... Curved frame plate, 22. 23. 35...
Solder, 24... Four case lids, 25... Wiring pattern, 261, 262... Plate pattern, 27
... Curved ceramic dielectric layer, 28 ... Capacitor, 29 ... Ceramic insulating layer, 30 ...
- Electrode plate portion, 31...Resistor. Figure 1 [ Figure 3
Claims (1)
夫々タングステン−モリブデンペースト状の導電層をそ
の間にセラミック製誘電材料を介在して順次印刷し更に
その表面にセラミック製絶縁材料を印刷した後焼成して
形成されたコンデンサと、該絶縁材料表面に印刷形成さ
れた電極層と、該基板の他方の面側に配設され、リード
端子を、該基板に形成しである軸直交方向断面の角部に
丸みを有する孔に挿通して該基板の上記一方の面側で上
記導電層及び電極層のうちの少なくともひとつに電気的
機械的に固着されたリード端子付き回路素子と、該基板
の上記一方の面側に配設されて該一方の面側で上記導電
層及び電極層のうち少なくともひとつに電気的機械的に
固着されたチップ状能動素子又は受動素子とよりなる構
成の基板回路装置。A tungsten-molybdenum paste-like conductive layer is sequentially printed on a ceramic substrate and only one side of the ceramic substrate with a ceramic dielectric material interposed therebetween, and then a ceramic insulating material is printed on the surface and then fired. an electrode layer printed on the surface of the insulating material; and a corner of the cross section in the direction perpendicular to the axis, the electrode layer being arranged on the other side of the substrate, and the lead terminal being formed on the substrate. a circuit element with lead terminals inserted into a rounded hole and electrically and mechanically fixed to at least one of the conductive layer and the electrode layer on the one side of the substrate; and the one side of the substrate. A substrate circuit device comprising a chip-shaped active element or a passive element disposed on a surface side of the substrate and electrically and mechanically fixed to at least one of the conductive layer and the electrode layer on the one surface side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8860384U JPS6016558U (en) | 1984-06-14 | 1984-06-14 | board circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8860384U JPS6016558U (en) | 1984-06-14 | 1984-06-14 | board circuit device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6016558U true JPS6016558U (en) | 1985-02-04 |
| JPH021869Y2 JPH021869Y2 (en) | 1990-01-17 |
Family
ID=30218511
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8860384U Granted JPS6016558U (en) | 1984-06-14 | 1984-06-14 | board circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6016558U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4914975A (en) * | 1972-05-22 | 1974-02-08 | ||
| JPS4967149A (en) * | 1972-11-02 | 1974-06-28 | ||
| JPS5162360A (en) * | 1974-11-29 | 1976-05-29 | Hitachi Ltd |
-
1984
- 1984-06-14 JP JP8860384U patent/JPS6016558U/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4914975A (en) * | 1972-05-22 | 1974-02-08 | ||
| JPS4967149A (en) * | 1972-11-02 | 1974-06-28 | ||
| JPS5162360A (en) * | 1974-11-29 | 1976-05-29 | Hitachi Ltd |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH021869Y2 (en) | 1990-01-17 |
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