JPS60167351U - 表示素子用ホ−ルダ - Google Patents

表示素子用ホ−ルダ

Info

Publication number
JPS60167351U
JPS60167351U JP1984056236U JP5623684U JPS60167351U JP S60167351 U JPS60167351 U JP S60167351U JP 1984056236 U JP1984056236 U JP 1984056236U JP 5623684 U JP5623684 U JP 5623684U JP S60167351 U JPS60167351 U JP S60167351U
Authority
JP
Japan
Prior art keywords
display element
holder
element holder
tip
abstract
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984056236U
Other languages
English (en)
Inventor
修 石原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP1984056236U priority Critical patent/JPS60167351U/ja
Publication of JPS60167351U publication Critical patent/JPS60167351U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１因は発光ダイオード素子の一例を示す斜視図、第２
図はそのホールダの断面図、第３図及び第４図は夫々ホ
ールダのパネルへの挿着状態を示す断面図、第５図はこ
の考案に係るホールダの一例を示す縦断面図、第６図は
他の縦断面図、第７図及び第８図はホールダのパネルへ
の挿着状態を示す断面図である。 １０はホールダ、１は発光ダイオード素子、１３はパネ
ル、１４は窓孔、２４は素子固定部、２７はテーパー、
１１は基板である。

Claims (1)

  1. 【実用新案登録請求の範囲】 表示素子を取付ける表示素子用のホールダにおいて、こ
    の表示素子の平面がホールダの先端部より突出しないよ
    うに素子固定部が設けられると共に、上記先端部の外面
    には所定のテーパーが設けられた表示素子用ホールダ。 、
JP1984056236U 1984-04-17 1984-04-17 表示素子用ホ−ルダ Pending JPS60167351U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984056236U JPS60167351U (ja) 1984-04-17 1984-04-17 表示素子用ホ−ルダ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984056236U JPS60167351U (ja) 1984-04-17 1984-04-17 表示素子用ホ−ルダ

Publications (1)

Publication Number Publication Date
JPS60167351U true JPS60167351U (ja) 1985-11-06

Family

ID=30579639

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984056236U Pending JPS60167351U (ja) 1984-04-17 1984-04-17 表示素子用ホ−ルダ

Country Status (1)

Country Link
JP (1) JPS60167351U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8927900B2 (en) 2000-09-13 2015-01-06 Hamamatsu Photonics K.K. Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device
US8969752B2 (en) 2003-03-12 2015-03-03 Hamamatsu Photonics K.K. Laser processing method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8927900B2 (en) 2000-09-13 2015-01-06 Hamamatsu Photonics K.K. Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device
US8933369B2 (en) 2000-09-13 2015-01-13 Hamamatsu Photonics K.K. Method of cutting a substrate and method of manufacturing a semiconductor device
US8946589B2 (en) 2000-09-13 2015-02-03 Hamamatsu Photonics K.K. Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor device
US8969761B2 (en) 2000-09-13 2015-03-03 Hamamatsu Photonics K.K. Method of cutting a wafer-like object and semiconductor chip
US8969752B2 (en) 2003-03-12 2015-03-03 Hamamatsu Photonics K.K. Laser processing method

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