JPS60181025U - Boat for heat treatment of semiconductor device substrates - Google Patents

Boat for heat treatment of semiconductor device substrates

Info

Publication number
JPS60181025U
JPS60181025U JP6939184U JP6939184U JPS60181025U JP S60181025 U JPS60181025 U JP S60181025U JP 6939184 U JP6939184 U JP 6939184U JP 6939184 U JP6939184 U JP 6939184U JP S60181025 U JPS60181025 U JP S60181025U
Authority
JP
Japan
Prior art keywords
boat
semiconductor device
heat treatment
device substrates
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6939184U
Other languages
Japanese (ja)
Inventor
健太郎 久原
Original Assignee
セイコーインスツルメンツ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by セイコーインスツルメンツ株式会社 filed Critical セイコーインスツルメンツ株式会社
Priority to JP6939184U priority Critical patent/JPS60181025U/en
Publication of JPS60181025U publication Critical patent/JPS60181025U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａは、従来のボートの断面図、第１図すは、従来
のボートの側面図である。第２図は、本考案による一実
施例の断面図である。第３図は、本考案による一部を拡
大したボートの断面図、第４図は、第３図のＡ　−Ａ’
線に沿った断面図である。第５図は、本考案によるボー
トの使用方法を説明する為の図である。 １．１０１・・・ウェハ、２，１０２・・・ボート、２
１．１２１・・・ウェハ固定棒、１０３・・・排気管、
１０４・・・排気。FIG. 1a is a sectional view of a conventional boat, and FIG. 1a is a side view of the conventional boat. FIG. 2 is a sectional view of an embodiment of the present invention. FIG. 3 is a partially enlarged sectional view of a boat according to the present invention, and FIG. 4 is a cross-sectional view taken along line A-A' in FIG.
It is a sectional view along the line. FIG. 5 is a diagram for explaining how to use the boat according to the present invention. 1.101...Wafer, 2,102...Boat, 2
1.121... Wafer fixing rod, 103... Exhaust pipe,
104...Exhaust.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体ウェハを熱処理する際に用いるボートにおいて、
ウェハを支える支柱が一端を閉管とした中空管に溝を設
けたことを特徴とする半導体装置基板熱処理用ボート。In the boat used when heat treating semiconductor wafers,
A boat for heat treatment of semiconductor device substrates, characterized in that the strut supporting the wafer is a hollow tube with one end closed and grooved.
JP6939184U 1984-05-11 1984-05-11 Boat for heat treatment of semiconductor device substrates Pending JPS60181025U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6939184U JPS60181025U (en) 1984-05-11 1984-05-11 Boat for heat treatment of semiconductor device substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6939184U JPS60181025U (en) 1984-05-11 1984-05-11 Boat for heat treatment of semiconductor device substrates

Publications (1)

Publication Number Publication Date
JPS60181025U true JPS60181025U (en) 1985-12-02

Family

ID=30605023

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6939184U Pending JPS60181025U (en) 1984-05-11 1984-05-11 Boat for heat treatment of semiconductor device substrates

Country Status (1)

Country Link
JP (1) JPS60181025U (en)

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