JPS60184843A - Laminating device for film - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a film G laminating device for laminating a film onto the surface of a printed circuit board.

Conventionally, a laminating device feeds a long resist film, laminates it with a laminating roller pressed against the substrate, and then cuts the film to a predetermined length during lamination. The structure was such that the feeding of the film and substrate was temporarily stopped, and the film was cut while the film remained pressed by the laminating roller.

If the rotation of the laminating roller is temporarily stopped in order to cut the film, the local part of the film that is in contact with the laminating roller will be heated, making it easier for air bubbles to occur in this area, which will reduce the adhesion of the film. had the problem of lowering the

To provide a laminating device in which there is no fear of overheating of a local part of a film by continuously rotating the film. Therefore, the present invention provides a device that improves the operating efficiency of the laminating device since the device can be operated continuously without stopping the laminating roller when cutting the film.

The present invention comprises: a film feed roller that feeds the leading end of the film cut by a cutter to the position of the laminating roller; a laminating roller that presses the film onto a printed circuit board; a printed circuit board feeding device that transports the printed circuit board; A film suction guide that holds the edges,
This is a film laminating device equipped with a lower blade cutter for continuous crimping of films and a film suction slide guide with a film suction mechanism.

An embodiment of the present invention will be described based on the drawings. 1 is a printed circuit board, this printed circuit board 1 is held by left and right clamp holders 2, and when the holder 2 moves downward,
The printed circuit board 1 is transferred to a predetermined position while being held by the holder 2. 3 is a resist film roll;
The film 4 is first set through the guide 1''-ra 5 to the position of the film feed rollers 6, 7. The film feed rollers 6 and 7 are formed by a feed roller 6 and a clamp roller 7, and the clamp roller 7 contacts and separates from the feed roller 6 at set times. Reference numeral 8 denotes a protective film peeling guide attached to the resist film 4.

The protective film 9 is separated by this peeling guide 8 and collected into a protective film winding coil 10.

Reference numeral 11 denotes a film suction slide guide, which is partially provided with a lower blade cutter 12, and has a suction port 13 suitably opened on the top surface for suctioning the film 4. Connected to a vacuum device (not shown).

A solenoid valve is provided in the middle of the piping, and the vacuum effect is turned on and off at predetermined timing. Note that 15 is an upper blade cutter that moves up and down, and when the lower blade cutter 12 and its blades meet, the film 4 is cut.

Reference numeral 20 denotes a film adsorption guide, and this guide 20 has a curved part 21 that changes the feeding direction of the film 4 and a guide surface 23 that guides the same number film 4 to the laminating roller 30. film 4
It has a vacuum port 24 for adsorbing. This vacuum boat 24 is connected to a vacuum device (not shown) through a wiring 25, and a solenoid valve is provided in the middle of the connection so that the solenoid valve is operated at a predetermined timing to switch between vacuum operation and atmospheric pressure operation. .

The laminating roller 30.31 is located below this suction guide 20, and the combined rollers 30.31 and 32.33 have a structure that allows them to come into contact and separate, similar to the substrate ejection rollers 32 and 33. .

To explain the operation of the apparatus of the present invention, FIG. 2 shows the state after the leading end 4A of the film 4 has been cut by the cutter 12.degree. 15.

The protective film 9 is separated by a peeling guide 8 and wound onto a roll 10.

When laminating the film 4 on both sides of the printed circuit board 1, a laminating mechanism for the film 1 is provided at a symmetrical position with respect to the circuit board 1, as shown in FIG. 1, but the drawing and explanation of the operation are omitted for one side. and do it. The same effect will occur on the opposite side.

In FIG. 3, the film feed rollers 6 and 7 are brought into contact with each other, and by the rotation of a dedicated motor, the film 4 is fed in the direction of the arrow until it reaches the laminating roller 30 position.

The printed circuit board 1 is already held by the clamp holder 2, and as the film 4 is fed out, the board 1 held by the holder 2 moves vertically downward with the holder 2, and stops at a predetermined position. . At the stopped position, the leading end 1A of the printed circuit board 1 is slightly protruded from the leading end 4A of the film. This positional relationship can be achieved by adjusting the stopping position of the printed circuit board 1 (FIG. 4). At this time, the slide guide 11 is in a position where the cutters 12 and 15 are aligned, and the laminating roller 30 is opened. When the feeding of the printed circuit board 1 is stopped, the laminating roller 30 presses the film 4 onto the printed circuit board 1 while pressing the leading end of the film 4.

At the same time, the slide guide 11 is moved to the film feed roller 6.7.
Move horizontally to the right toward , and stop at a predetermined position. Note that the upper blade cutter 15 moves only up and down, and does not move left and right (FIG. 5).

With the film feed roller 3 in an open state, the laminating roller 30 rotates while pressing the film 4 against the printed circuit board 1, so the film 4 is moved while pulling the film 4.
is thermocompression bonded to the printed circuit board 1. Laminating roller 3
When printed circuit board 1 is pressed at 0, printed circuit board 1
The clamp holder 2 is released and returns to its original position.

When the printed circuit board 1 is sent downward by the laminating roller 30 and the terminal end IB of the board is detected by the first detection means 40, which is a phototube, the film suction slide guide 11 and the film suction guide 20 are vacuum operated, and the suction port 13 and the vacuum boat 24 suck the film 4. The slide guide 11 moves to the left to the position shown in FIG. 2 while sucking the film. Slide guide 1 at this time
1 is faster than the feeding speed at which the laminating roller 30 is pulling the film 4, so when the slide guide 11 stops at a predetermined position as shown in FIG. Can be done.

Next, the upper cutter 15 moves downward and meets the lower cutter 12 to cut the film 4 (FIG. 8). Since the vacuum operation of the film adsorption guide 20 continues until the rear end 4B of the cut film has passed, it is ensured that the film 4 is pressed onto the substrate 1 by the laminating roller 30.

Reference numeral 41 denotes a second detection means for detecting the end portion IB of the printed circuit board 1 using a phototube. When the second detection means 41 detects the rear end portion 1B of the printed circuit board 1, the laminating roller 30 is released, and only the substrate discharge roller 32 is released. Then, the substrate 1 is ejected. By repeating the above action, the film 4 on the substrate 1 is
The lamination is carried out continuously.

The film laminating device of the present invention is capable of cutting the film while the conventional device is in the process of cutting the film by temporarily stopping the lamination. In order to prevent deterioration of adhesion due to causes such as bubble generation when the film is stopped, once lamination of the film to the substrate is started,
This device allows continuous application of film until the end of the film application process. Therefore, since the film is not locally overheated, it is now possible to perform lamination with excellent adhesion, and a good lamination can now be obtained. This has made it possible to fully respond to the refinement of printed circuit board circuits. Furthermore, this invention has the effect of improving the operating rate of equipment, and will greatly contribute to the development of industry.

[Brief explanation of the drawing]

Fig. 1 is a front view showing an outline of the apparatus of the present invention, Figs. 2 to 10 are partial front views for explaining the invention in detail, and Fig. 2 shows a state in which the film is cut with a cutter. Figure 3 is a front view of the film being fed to a predetermined position, Figure 4 is a front view of the printed circuit board being fed to a predetermined position, and Figure 5 is a front view of the film being fed as the laminating roller rotates. Figure 6 is a front view when the slide guide and suction guide are in close contact with the substrate, and Figure 6 is a front view when the suction ports of the slide guide and suction guide are vacuumed and the film is suctioned. Figure 7 is a front view when the slide guide moves and the film is attracted. The front view does not show the walnut being made, Figure 8 is the front view when the film is cut with a cutter, and Figure 9 is the front view with the rear end of the film attached to the board. , FIG. 10 is a front view when the rear end of the substrate is detected and the laminating roller is retracted. In the drawings, 1 is a printed circuit board, 2 is a clamp boulder 1, 3 is a resist film roll, 4 is a film, 6.7 is a film feed roller, 11 is a film suction slide guide, 12 is a lower blade cutter, 13 is a suction port, 15 is the upper blade cutter, 20G is the film suction guide, 2
4 is a vacuum boat, 30.31 is a laminating roller, and 32.33 is a substrate discharge roller. Patent applicant Hitachi Capacitor Co., Ltd.

Claims (1)

[Claims] (1) A device that feeds out printed circuit boards, a film feed roller that feeds out the film to be pasted onto the printed circuit board, a film laminating roller that presses and pastes the film onto the board, and a film placed on top of the film laminating roller that adsorbs the film. This film laminating device is equipped with a suction guide, a film slide guide that includes a lower blade cutter and slides in the film feeding direction while suctioning the film, and an upper blade cutter that moves up and down.