JPS60187533A - Preparation of resin laminated wooden board - Google Patents

Abstract

PURPOSE:To obtain a resin laminated wooden board generating no gap nor pinhole in the resin layer thereof and prevented from the generation of warpage or deterioration, by a method wherein a thermoplastic resin powder is scattered on a thermoplastic resin film and thereafter melted under heating to form a molten layer of said powder while said film is subsequently bonded to a wooden board under pressure through said molten layer. CONSTITUTION:A thermoplastic resin film 1 is heated to a temp. from the softening point thereof to below the m.p. thereof by a film preheater 2 and a thermoplastic resin powder 3 is uniformly fallen and scattered onto the heated film from a hopper 4. The thermoplastic resin powder 3 pref. comprises a powder of modified polyolefin of which the adhesiveness is enhanced and scattering is generally performed in a range capable of obtaining a thickness of about 50- 200mum. Next, the powder 3 on the film 1 is heated to the m.p. thereof by a powder melting heater 5 and fusion bonded to the film 1. A wooden board 7 is preheated by a preheater 8 and the thermoplastic resin film 1 is superposed to the surface of the wooden board 7 transferred by a roller conveyor 9 and bonded and laminated to the board 7 under pressure by a press bonding roll group 10.

Description

DETAILED DESCRIPTION OF THE INVENTION Yuj Kinoe relates to a method of manufacturing an improved wood board by laminating a thermoplastic resin on the surface of the wood board.

Conventionally, a resin film has been laminated on the surface of a wooden board such as a sawn board, plywood, or laminated wood board in order to decorate or smooth the surface or to improve the surface hardness. Generally, when laminating a wood board and a resin film, methods are used such as stacking the resin film on the surface of the wood board and bonding it with heat, or using an adhesive to attach the resin film to the wood board. However, these methods do not provide sufficient adhesion of the resin film to the wood board. In order to improve this adhesion, for example, thermoplastic resin powder is sprinkled on a wooden board, this is melted in a heating bath, a thermoplastic resin film is supplied on top of this, and the thermoplastic resin is heated and then heated. A method has been proposed to improve adhesion by infiltrating the fine irregularities of a wooden board with a melted resin.
Publication No.).

However, this method has problems in that voids are likely to appear under the laminated film, hingholes are likely to occur in the laminated film, and warpage is likely to occur during lamination.

The present invention has been made to solve these problems of the conventionally known methods of manufacturing resin-laminated wood boards, and the method of manufacturing resin-laminated wood boards of the present invention includes
After scattering thermoplastic resin powder onto a thermoplastic resin film or sheet, the powder is melted in a heating bath, and then the film or sheet is transferred to a wooden board through the molten layer of the powder. It is crimped onto the top.

There are no particular restrictions on the thermoplastic resin used in Honkori J, and examples include old polyolefin resin, modified polyolefin obtained by adding unsaturated calphonium or its derivatives to a polyolefin resin, and polyvinyl chloride. , polyvinyritine chloride, polystyrene, ABS resin, AS resin, polyamide, polyester, polyurethane, polycarbonate, ionomer, etc., which can be formed into a film or sheet. Examples of the above 6U2 polyolefin resin include high density, medium density and low density polyethylene, linear low density polyethylene, holiflopyrene,
Examples include borifdene, enalene-propylene copolymer, ethylene-butene copolymer, propylene-butene copolymer, ethylene-vinyl acetate copolymer, ethylene-acrylic acid ether copolymer, and ionomer. Examples of modified polyolefins include the above-mentioned polyolefin resins and/or olefin-based nidistomers, such as polyimbutylene rubber, butyl rubber, ethylene propylene rubber, ethylene-propylene-diene terpolymer, ethylene-1-butene rubber, butane-ene rubber, and styrene-butylene rubber.
Butadiene rubber, ethylene-phtadiene rubber, etc. are blended with unsaturated carbonic acids or derivatives thereof, such as maleic acid, acrylic acid, methacrylic acid, endo-
Bicyclo-[2,1,1]-5-hebutene-2,6-dicarboxylic acid, cis-4-cyclohexene-1,2-dicarboxylic acid, or their acid anhydrides, esters, amides, salts, etc. Examples include those in which an unsaturated carboxylic acid or a derivative thereof is added in an amount of 0.001 to 15M by reaction. The method for producing this modified polyolefin is not particularly limited, and any known method such as a melt method or a solution method can be applied.

The above thermoplastic resins may be used in combination of two or more. Further, stabilizers, colorants, fillers, etc. can be added as desired.

The thermoplastic resin film or sheet-like material (hereinafter referred to as ')' film) in the present invention is one in which the above-mentioned thermoplastic resin is molded into a single layer or a layer, and is unstretched or -axially stretched. Alternatively, biaxially oriented films such as biaxially oriented polypropylene films (hereinafter referred to as OPP films) with excellent physical properties such as smoothness, strength, transparency, moisture resistance, and hardness are used. [Table]] II preferred for improvement. The thickness of these films or sheet-like materials is generally 10 to 500 μm.

Next, the thermoplastic resin powder in the present invention is a powder made of the above-mentioned thermoplastic resin, and particularly preferably a modified polyolefin powder with improved adhesiveness. Further, the particle size of the powder is preferably in the range of 50 to 250 μm.

If the particle size is 250 μm or more, it will be difficult to spread the powder to a uniform thickness and the adhesion to the wooden board will be poor, and if the particle size is less than 50 μm, it will be difficult to handle and workability will be poor, so it is not preferable. .

Furthermore, examples of the wooden board in the present invention include veneer made of various types of wood, plywood, particle board, fiberboard, and the like.

The present invention is useful for bamboo when a resin core layer wood board is manufactured continuously, and the case where the resin core layer is manufactured continuously will be explained below with reference to the drawings.

FIG. 1 is a schematic side view showing the steps of an embodiment of the present invention. In the figure, 1 is a thermoplastic resin film, which is continuously supplied from a rolled film.

A film preheating heater 2 heats the supplied thermoplastic resin film 1. In this case, the heating temperature is higher than the softening point of the thermoplastic resin and lower than the melting point. 6
4 is a hopper containing thermoplastic resin powder, and 4 is a hopper containing thermoplastic resin powder 6, which drops and disperses the powder 6 uniformly onto the heated thermoplastic resin film. In this case, the thickness of the spray is determined to be from m to 100 m so that it melts on the thermoplastic resin film and has sufficient adhesion to the wooden board. If the thickness of the spray is too thin, it will melt in the bath when heated, but the adhesion will not be sufficient, and if the thickness of the spray is too thick, the melting on the film will not be sufficient due to heating, which is not preferable. The amount of spraying is appropriately selected depending on the type of thermo-5J plastic resin film and powder, but is generally carried out within a range that provides a thickness of about 50 to 2001 tm. 5 is a melting heater for the thermoplastic resin powder 3, which heats the powder 3 on the film 1 above its melting point and melts it in a bath to form the film 1! r ooze.

Reference numeral 6 denotes a temperature control IJ1 roll for the film 1, which controls the temperature from the rolled surface of the film 10 heated by the powder bath melting heater 5 to prevent flat deformation of the film 1. The wood board 7 is preheated by a wood board heater 8, transported by a roller conveyor 9, and a thermoplastic resin film 1 is placed on the surface of the wood board 70.
are layered through the powder bath melting layer 1 on top of 7, and the outflow roll group 10
Crimp and laminate. The film 1 to be laminated on the wood board 7 is cut and separated by a cutting machine 11, and the resin laminated wood board 12 is separated.
The film is transported by a roller conveyor 9 and the edges of the film protruding from both sides of the wooden board are cut off (not shown).

The coating of the thermoplastic resin powder 6 is performed by applying a negative high pressure to the powder electrostatic coating machine 13 and a positive high pressure to the grounded temperature control roll B, as shown in FIG. It is also possible to apply electricity and scatter the powder 3 in the heating direction of the film 1 by electrostatic attraction.

According to this spreading method, the powder B is not scattered and the thickness of the spreading can be precisely adjusted.

As described above, according to the method of the present invention, there is no occurrence of voids under the resin layer laminated on the wooden board or pinholes in the laminated resin, and the heating process of the wooden board is short and the heating temperature is low. Therefore, a resin-laminated wood board can be obtained which prevents warping and deterioration of the wood board and has excellent bond strength. In addition, the resin layer lamination process does not require molten powder presses or resin lamination heating rollers, making it simple, energy-saving, and energy-saving. It is something that can be done.

The resin laminated wood board obtained by the method of the present invention can be used for various purposes such as decorative plywood and concrete form board.

Next, the present invention will be explained in detail with reference to examples.

Example 1 Using the continuous resin laminated wood board manufacturing apparatus shown in FIG.
211 with a thickness of 50 μm! A stretched polypropylene film (hereinafter referred to as OPP film 5) 1 is heated to a temperature of 140°C with a film preheating heater 2, and a modified polypropylene (polypropylene is coated with anhydrous male monolayer) having a particle size of 100 to 200 μηL is heated in the heating direction of the OPP film. Powder 3 of the above was dropped from the ompper 4 to a thickness of approximately 40 μyet. The feeding speed of this 1 Samurai OPP film was 6 m/min. Next, the powder bath was heated to a temperature of 180° C. using a powder bath melting heater 5, and the modified polyethylene powder was bath-deposited on the OPP film.

At this time, the temperature control roll 6 of the film adjusts the temperature to 140°C.
was held at

The surface of the plywood 70 with a thickness of 12 mm is heated 9 times with a wood board heater 8.
After heating to 5°C, the powder-welded surfaces of the OP I) film were joined together, crimped with a group of pressure rolls, and the film was cut! *Opp film laminated plywood with a resin layer thickness of 90 μm was obtained. No voids or pinholes were observed in the resulting OPP film layer, gold layer, plywood layer, or resin layer, and no warping of the plywood occurred. 18 of JJ Ho
0° peel strength (peel speed 7α/min, same below) is 5 m
/5.5 cln.

In addition, when PP film laminated plywood was used as a concrete formwork board, it showed good peelability from contourite (no peeling of the film or adhesion of concrete, and the number of repeated uses was much improved compared to conventional products. It was one thing.

Accidental Example 2 A QPP film laminate was prepared in the same manner as in Example 1, except that the modified polypropylene powder 3 was sprayed using an electrostatic coating machine 16 as shown in FIG. Obtained. In the obtained O, P film laminated plywood, no voids or pinholes were observed, and no warping of the plywood occurred.

The 180° peel strength of the laminated resin is 51<g/3.5.7
It was F+.

[Brief explanation of drawings]

FIG. 1 is a schematic side view showing one embodiment of the present invention, and FIG. 2 is a schematic diagram showing the state of the n-electronic coating process, which is another embodiment. 1. Atsumachi plastic tree IId film, 2. Film preheating heater, filter, thermo oJ plastic resin powder, 4.-Hopper, 5
・・Powder bath melting heater, 6・Film temperature 1=j m
I'-Lar, 7...Wood board, 8 Wood board heat heater, 9 - Roller conveyor, 10-...Crimping roll, 1
1. Cutting machine, 12... Resin anti-layer wood board 13... Powder static 'ttJ, m equipment representative 1) Akira representative Ryo Hagihara - Figure 2

Claims (1)

[Claims] After scattering thermoplastic resin powder onto a thermoplastic resin film or sheet, the powder is heated and melted, and then the film or sheet is placed on a wooden board through the melting process. A method for producing resin-laminated wood boards that is characterized by being crimped to a material.