JPS60201199A - Low-temperature receptacle - Google Patents
Low-temperature receptacleInfo
- Publication number
- JPS60201199A JPS60201199A JP5591084A JP5591084A JPS60201199A JP S60201199 A JPS60201199 A JP S60201199A JP 5591084 A JP5591084 A JP 5591084A JP 5591084 A JP5591084 A JP 5591084A JP S60201199 A JPS60201199 A JP S60201199A
- Authority
- JP
- Japan
- Prior art keywords
- heat exchanger
- temperature
- low
- heat
- refrigerator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 claims abstract description 26
- 239000007788 liquid Substances 0.000 claims abstract description 12
- 239000007789 gas Substances 0.000 claims description 30
- 239000001307 helium Substances 0.000 claims description 6
- 229910052734 helium Inorganic materials 0.000 claims description 6
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 5
- 238000007710 freezing Methods 0.000 abstract description 2
- 230000008014 freezing Effects 0.000 abstract description 2
- 230000006835 compression Effects 0.000 description 8
- 238000007906 compression Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Filling Or Discharging Of Gas Storage Vessels (AREA)
Abstract
Description
【発明の詳細な説明】
（発明の対象及び利用分野）
本発明は液体ヘリウム、水素、窒素などの低温液化ガス
（以下寒剤と称す）を用いた冷凍・寒剤の貯蔵を効果的
に行なう低温容器であり、特に低温容器外にある冷凍機
から低温液体又は低温気体を移送させて低温容器の真空
断熱層内にある２枚以」二の熱シールド板を冷却して内
部への熱侵入を減らすようにした低温容器に関するもの
である。Detailed Description of the Invention (Subject of the Invention and Field of Application) The present invention relates to a low-temperature container for effectively freezing and storing a cryogen using a low-temperature liquefied gas (hereinafter referred to as a cryogen) such as liquid helium, hydrogen, or nitrogen. In particular, by transferring low-temperature liquid or low-temperature gas from a refrigerator located outside the low-temperature container, two or more heat shield plates within the vacuum insulation layer of the low-temperature container are cooled to reduce heat intrusion into the interior. The present invention relates to a low temperature container.
（従来技術）
従来の低温容器は第１図の様に二系統の冷却回路を用い
るか、第２図のように一系統の冷却回路の中間部分の低
温液体又は低温気体をそのまま用いてそれぞれの温度レ
ベルの熱／−ルド板の冷却を行なっていた。(Prior art) Conventional cryogenic containers use two cooling circuits as shown in Figure 1, or use the low-temperature liquid or gas in the middle of one cooling circuit as is, as shown in Figure 2. Temperature level heat/cooling of the cold plate was performed.
ここで先ず本発明と同様に一系統の冷却回路を用いた第
２図について回路構成を詳細に説明すると、■は圧縮機
、２は圧縮熱放熱器で、該放熱器２は圧縮機１の吐出側
に隣接して設けられている。First, the circuit configuration will be explained in detail with respect to FIG. 2, which uses a single cooling circuit as in the present invention. It is provided adjacent to the discharge side.
３．５は第１、第２熱交換器、４ａ、６は冷凍機の低温
発生部に設けられた第１、第２冷凍機低温発生部熱交換
器で、それぞれ第１が高温側、第２が低温側である。3.5 are first and second heat exchangers; 4a and 6 are first and second refrigerator low temperature generation section heat exchangers provided in the low temperature generation section of the refrigerator; 2 is the low temperature side.
７．８は第２、第１熱シールド板、９．１０は第２、第
１熱シールド板をそれぞれ冷却するための第２、第１熱
シールド板冷却熱交換器である。7.8 is the second and first heat shield plates, and 9.10 is the second and first heat shield plate cooling heat exchangers for cooling the second and first heat shield plates, respectively.
この場合も第１が高温側、第２か低温側である。In this case as well, the first side is the high temperature side, and the second side is the low temperature side.
１１は液体ヘリウム等を入れる寒剤容器で、これらは低
温容器外箱１２に包含されている。また第１熱シールド
板８は低源、容器外箱１２と第２シールド板７０間、第
２熱シールド板７は第１熱シールド板８と寒剤容器１１
０間の真空断熱層空間に、それぞれ第２熱シールド板７
、寒剤容器１１を覆℃・包むように配設されている。そ
してこれらの圧縮機１、圧縮熱放熱器２、第】、第２熱
交換器３．５、第１、第２冷凍機低温発生部熱交換器４
ａ、６、第２、第１熱シールド板冷却熱交換器９．１０
が、往路管路１３ａ、１５ａ及び復路管路１４ａ、＋６
ａによって連結され、動作気体循環回路が構成されてい
る。Reference numeral 11 denotes a cryogen container containing liquid helium, etc., which is included in the outer box 12 of the cryogenic container. Further, the first heat shield plate 8 is connected between the low source, the container outer box 12 and the second shield plate 70, and the second heat shield plate 7 is connected between the first heat shield plate 8 and the cryogen container 11.
A second heat shield plate 7 is provided in the vacuum insulation layer space between 0 and 0, respectively.
, are arranged so as to cover and wrap the cryogen container 11. These compressor 1, compression heat radiator 2, second heat exchanger 3.5, first and second refrigerator low temperature generation section heat exchanger 4
a, 6, second, first heat shield plate cooling heat exchanger 9.10
However, the outgoing pipes 13a, 15a and the returning pipes 14a, +6
a to form an operating gas circulation circuit.
次に第１図の二系統の冷却回路を用いた場合の回路構成
を説明すると、第２図の回路の他に、圧縮機１７、圧縮
熱放熱器１８、熱交換器１９、冷凍機低温発生部熱交換
器２０を往路管路２３、復路管路２４で連結してなる動
作気体循環回路を併設してなるものである。Next, to explain the circuit configuration when the two-system cooling circuit shown in Fig. 1 is used, in addition to the circuit shown in Fig. 2, the compressor 17, compression heat radiator 18, heat exchanger 19, refrigerator low temperature generator A working gas circulation circuit is also provided in which the partial heat exchanger 20 is connected by an outgoing pipe line 23 and a returning pipe line 24.
（従来技術の問題点）
先ず第１図の二系統の冷却回路を用いた場合は装置が複
雑となり、かつ大型となる欠点があった。(Problems with the Prior Art) First, when the two-system cooling circuit shown in FIG. 1 is used, there is a drawback that the device becomes complicated and large.
また一系統の第２図の場合は、高温側の熱シールド板の
温度が高くなるか、又は低温側の熱交換器入口の低温液
体又は低温気体の温度が高くなるかして、冷凍機の低温
側の低温発生部への負荷が太き（なるため、冷凍機を大
型にする必要があった。In the case of one system shown in Figure 2, the temperature of the heat shield plate on the high temperature side increases, or the temperature of the low temperature liquid or low temperature gas at the inlet of the heat exchanger on the low temperature side increases, causing the refrigerator to cool down. The load on the low-temperature generating section on the low-temperature side was heavy, so it was necessary to make the refrigerator larger.
（技術的課題）
本発明は前記従来の欠点を解消するために提案されたも
ので、冷凍機低温側の低温発生部の負荷を低減して装置
を小型化することを目的とするものである。(Technical Problem) The present invention was proposed to eliminate the above-mentioned conventional drawbacks, and its purpose is to reduce the load on the low temperature generation section on the low temperature side of the refrigerator and downsize the device. .
（技術的手段）
この目的を達成するために本発明は、液体へリーウムな
どの寒剤を月見・た真空断熱層内に２層以上の熱シール
ド板を用いてなる低温容器において、熱シールド板の冷
却回路を一系統とし、高温側の熱シールド板を冷却した
低温液体又は気体を再度冷凍機の高温側の低温発生部で
冷却１−るようにした構成となっている。(Technical Means) In order to achieve this object, the present invention provides a heat shield plate in a cryogenic container that uses two or more heat shield plates in a vacuum insulation layer in which a cryogen such as liquid helium is added. The cooling circuit is one system, and the low-temperature liquid or gas that has cooled the heat shield plate on the high-temperature side is cooled again in the low-temperature generation section on the high-temperature side of the refrigerator.
（技術的手段の作用）
多層の熱シールド板の冷却を、一系統の作動気体循環回
路で行ない、なおかつ比較的温度の高い側の熱シールド
板冷却熱交換器を通った作動気体を、再度同じ温度レベ
ルの冷凍機低温発生部を通過させることにより、冷凍機
の負荷を低減させる。(Effect of technical means) The multilayer heat shield plate is cooled by a single working gas circulation circuit, and the working gas that has passed through the heat shield plate cooling heat exchanger on the relatively high temperature side is recirculated in the same way. By passing the temperature level through the refrigerator low temperature generating section, the load on the refrigerator is reduced.
（本発明によって生じた特有の効果）
本発明によると、冷凍機の低温側より高温側に大きな負
荷がかかるので、冷凍機の効率がよくなり、消費電力が
少なく、小さな冷凍機ですむ等の効果がある。(Special effects produced by the present invention) According to the present invention, a larger load is applied to the high temperature side of the refrigerator than to the low temperature side, so the efficiency of the refrigerator is improved, power consumption is low, and a small refrigerator is required. effective.
（実施例）
以下本発明の実施例を図面について説明すると、第３図
は本発明の第１実施例を示し、１は圧縮機、２は圧縮機
］の吐出側に隣接して設けられた圧縮熱放熱器である。(Embodiment) Below, an embodiment of the present invention will be described with reference to the drawings. Fig. 3 shows a first embodiment of the present invention, in which 1 is a compressor, 2 is a compressor installed adjacent to the discharge side of the compressor. It is a compression heat radiator.
３．５は第１、第２熱交換器、４．６は冷凍機の低温発
生部に設けられた第１、第２冷凍機低温発生部熱交換器
で、それぞれ第１が高温側、第２が低温側である。７．
８は第２、第１熱シールド板、９．１０は第２、第１熱
シールド板７．８をそれぞれ冷却するための第２、第１
熱シールド板冷却熱交換器て、それぞれ第１が高温側、
第２が低温側である。3.5 are the first and second heat exchangers, and 4.6 are the first and second refrigerator low temperature generation section heat exchangers provided in the low temperature generation section of the refrigerator, the first being the high temperature side and the first being the high temperature side heat exchanger, respectively. 2 is the low temperature side. 7.
8 are second and first heat shield plates; 9.10 are second and first heat shield plates for cooling the second and first heat shield plates 7.8, respectively;
In the heat shield plate cooling heat exchanger, the first side is the high temperature side,
The second is the low temperature side.
１１は液体ヘリウム等を入れる寒剤容器で、これらは低
温容器外箱１２に包含されている。また第１熱シールド
板８は低温容器外箱１２と第２熱シールド板７０間、第
２熱シールド板７は第１熱シールド板８と寒剤容器１１
０間の真空断熱層空間に、それぞれ第２熱シールド板７
と寒剤容器用を覆い包むように配設されている。そして
これら圧縮機１、圧縮熱放熱器２、第１、第２熱交換器
３．５、第１、第２冷凍機低温発生部熱交換器４．６、
第２、第１熱シールド板冷却熱交換器９．１゜が、第２
、第１往路管路１３．１５及び第２、第１復路管路１４
．１６によって連結されて、動作気体循環回路が構成さ
れている。そして低温容器は低温容器外箱１２、第２、
第１熱シールド板７．８、寒剤容器１１、第２、第１熱
シールド板冷却熱交換器９、］０かも構成されている。Reference numeral 11 denotes a cryogen container containing liquid helium, etc., which is included in the outer box 12 of the cryogenic container. Further, the first heat shield plate 8 is between the low temperature container outer box 12 and the second heat shield plate 70, and the second heat shield plate 7 is between the first heat shield plate 8 and the cryogen container 11.
A second heat shield plate 7 is provided in the vacuum insulation layer space between 0 and 0, respectively.
It is arranged to cover and wrap the cryogen container. These compressor 1, compression heat radiator 2, first and second heat exchangers 3.5, first and second refrigerator low temperature generation section heat exchangers 4.6,
The second and first heat shield plate cooling heat exchangers 9.1°
, the first outbound pipe line 13.15, and the second and first return pipe line 14.
．． 16 to form a working gas circulation circuit. The low-temperature container is a low-temperature container outer box 12, a second
A first heat shield plate 7.8, a cryogen container 11, a second heat shield plate cooling heat exchanger 9, ]0 are also constructed.
低温容器から離れて配設された圧縮機１、該圧縮機１の
吐出側に隣接した圧縮熱放熱器２と同様に、低温容器か
ら離れて配設された第１冷凍機低温発生部熱交換器４と
、第１熱シールド板冷却熱交換器１０とを直列に管路で
連絡して動作気体の第１往路管路１５を形成し、更に第
１熱シールド板冷却熱交換器」０と前記熱交換器４とを
管路で連絡して第１復路管路】６を形成している。Similar to the compressor 1 disposed away from the low temperature container and the compression heat radiator 2 adjacent to the discharge side of the compressor 1, the first refrigerator low temperature generation section heat exchanger disposed away from the low temperature container 4 and the first heat shield plate cooling heat exchanger 10 are connected in series through a pipe line to form a first outbound pipe line 15 for the working gas, and furthermore, the first heat shield plate cooling heat exchanger 10 and the first heat shield plate cooling heat exchanger 10 are connected in series. The heat exchanger 4 is connected to the heat exchanger 4 by a pipe to form a first return pipe 6.
また前記熱交換器４．６．９を直列に管路で連絡して第
２往路管路１３を、前記熱交換器９と圧縮機】の吸入口
とを管路で連絡して第２復路管路１４を形成ずろ。更に
圧縮熱放熱器２と前記熱交換器４とを連絡する第１往路
管路】５と、前記熱交換器９と圧縮機１の吸入側を連絡
する第２復路管路１４相互間で、第１往路管路１５と第
２復路管路１４とを熱的に連結する第１熱交換器３を、
また前記熱交換器４と６を連絡する第２往路管路１３と
、前記熱交換器９と第１熱交換器３とを連絡する第２復
路管路１４相互間で、第２往路管路１３と第２復路管路
］４とを熱的に連結する第２熱交換器５をそれぞれ配設
して前記動作気体循環回路を構成している。なお、以上
の構成において、熱交換器３．５．４．６、熱シールド
板７．８、熱シールド板冷却熱交換器９．１０、寒剤容
器１］及びこれらを連絡している往路管路１３．１５、
復路管路１４．１６等は全て真空容器又は真空配管中に
置かれて真空断熱されていることは言うまでもなし・。Further, the heat exchanger 4.6.9 is connected in series with a pipe line to form a second outgoing pipe line 13, and the heat exchanger 9 and the suction port of the compressor are connected via a pipe line to form a second return line. Form the conduit 14. Further, between a first outgoing pipe line 5 that connects the compression heat radiator 2 and the heat exchanger 4, and a second return pipe line 14 that connects the heat exchanger 9 and the suction side of the compressor 1, A first heat exchanger 3 that thermally connects the first outbound pipe line 15 and the second return pipe line 14,
Further, between a second outgoing pipe line 13 that connects the heat exchangers 4 and 6 and a second return pipe line 14 that connects the heat exchanger 9 and the first heat exchanger 3, a second outgoing pipe line 13 and the second return pipe] 4 are respectively disposed to form the working gas circulation circuit. In the above configuration, the heat exchanger 3.5.4.6, the heat shield plate 7.8, the heat shield plate cooling heat exchanger 9.10, the cryogen container 1] and the outbound pipe connecting these 13.15,
It goes without saying that the return pipes 14, 16, etc. are all placed in vacuum containers or vacuum piping and are vacuum insulated.
次に第３図の実施例について作用を説明すると、動作気
体循環回路内には、例えば動作気体として液体ヘリウム
などが封入されるが、この動作気体は、先ず圧縮機１で
圧縮され、圧縮機１の吐出口より第１往路管路］５へ吐
出されるが、その前に第１熱交換器３を通過し、更に第
１冷凍機低温発生部熱交換器４を通過して第１熱シール
ド板冷却熱交換器１０へ送られる。この時先ず第１熱交
換器３ては、第２熱交換器５から圧縮機】の吸入口側へ
低温、例えば８０に以下の温度で戻って来る動作気体に
よって、圧縮機】の吐出口から第１冷凍機低温発生部熱
交換器４へ送り込む。なお、圧縮機１で発生する圧縮熱
は、圧縮熱放熱器２で除去されるので、第１熱交換器３
へ流入する動作気体の温度は０〜５０°Ｃ位である。Next, to explain the operation of the embodiment shown in FIG. 3, for example, liquid helium or the like is sealed as a working gas in the working gas circulation circuit.This working gas is first compressed by the compressor 1, and It is discharged from the discharge port of No. 1 to the first outgoing pipe] 5, but before that, it passes through the first heat exchanger 3, and further passes through the first refrigerator low temperature generation section heat exchanger 4, and then the first heat It is sent to the shield plate cooling heat exchanger 10. At this time, first, the first heat exchanger 3 uses the working gas that returns from the second heat exchanger 5 to the suction side of the compressor at a low temperature, for example, 80°C or less, from the discharge port of the compressor. It is sent to the first refrigerator low temperature generating part heat exchanger 4. Note that the compression heat generated by the compressor 1 is removed by the compression heat radiator 2, so the first heat exchanger 3
The temperature of the working gas flowing into the chamber is about 0 to 50°C.
次に第１冷凍機低温発生部熱交換器４では、冷凍機で発
生した冷凍によって、第】熱交換器３で予じめ冷却され
た動作気体は、更に冷却されて第１往路管路１５に送り
出され、前記の如く熱交換器】Ｏに至る。ここで第１熱
シールド板８で冷却した動作気体は、第１往路管路１５
を通過した時より温度が」二昇して、該熱交換器１０か
ら前記熱交換器４へ第１復路管路１Ｇを通して送られる
。Next, in the first refrigerator low temperature generating section heat exchanger 4, the working gas pre-cooled in the first refrigerator heat exchanger 3 is further cooled by the refrigeration generated in the refrigerator, and is further cooled in the first outgoing pipe 15. and reaches the heat exchanger ]O as described above. Here, the working gas cooled by the first heat shield plate 8 is transferred to the first outgoing pipe 15.
The temperature of the heat increases by 2' after passing through the heat exchanger 10, and the heat is sent from the heat exchanger 10 to the heat exchanger 4 through the first return pipe 1G.
また動作気体は該熱交換器４で再度冷却されて、第２熱
交換器５を通り、第２冷凍機低温発生部熱交換器６へ送
られる。第２熱交換器５では、第２熱シールド板冷却熱
交換器９から第１熱交換器３へ、更に低温、例えば３０
Ｋ以下の温度で戻って来る動作気体によって、前記熱
交換器４から前記熱交換器６へ流出ずろ動作気体を冷却
し、この冷却した動作気体を該熱交換器６へ送り込む。Further, the working gas is cooled again by the heat exchanger 4, passes through the second heat exchanger 5, and is sent to the second refrigerator low temperature generating section heat exchanger 6. In the second heat exchanger 5, from the second heat shield plate cooling heat exchanger 9 to the first heat exchanger 3, the temperature is lowered to a lower temperature, e.g.
The working gas returning at a temperature below K cools the working gas flowing out from the heat exchanger 4 to the heat exchanger 6, and the cooled working gas is fed into the heat exchanger 6.
次に第２冷凍機低温発生部熱交換器６ては、冷凍機で発
生した冷凍によって第２熱交換器５で冷却された動作気
体は、更に冷却されて第２往路管路１３に送り出され、
前記熱交換器９に至る。また動作ガスは第２熱シールド
板７を冷却して第２往路管路１３を通った時より温度上
昇して、該熱交換器９から第２熱交換器５へ第２復路管
路１４を通って送られる。そして第２熱交換器５で第２
往路管路１３の動作気体と熱交換し、更に第１熱交換器
３に−送られ、ここで第１往路管路１５の動作気体と熱
交換して常温近傍の温度に戻され、圧縮機１の吸入側へ
送り込まれて１サイクルが終了する。Next, in the second refrigerator low temperature generating section heat exchanger 6, the working gas cooled in the second heat exchanger 5 by the refrigeration generated in the refrigerator is further cooled and sent to the second outgoing pipe line 13. ,
The heat exchanger 9 is reached. Further, the temperature of the working gas increases after cooling the second heat shield plate 7 and passing through the second outgoing pipe line 13, and the working gas passes through the second return pipe line 14 from the heat exchanger 9 to the second heat exchanger 5. sent through. And the second heat exchanger 5
It exchanges heat with the working gas in the outgoing pipe line 13, and is further sent to the first heat exchanger 3, where it exchanges heat with the working gas in the first outgoing pipe line 15, and is returned to a temperature close to normal temperature, and is then sent to the compressor. 1 is sent to the suction side of No. 1, and one cycle ends.
第４図は第３図と異なる本発明の第２実施例を示し、第
３図における第２冷凍機低温発生部熱交換器６と、第２
熱シールド板冷却熱交換器９を連絡する第２往路管路１
３中に、第３冷凍機低温発生部熱交換器２２を追設する
と共に、第２冷凍機低温発生部熱交換器６と該熱交換器
２２を連絡づ−る第２往路管路１３と、前記熱交換器９
と第２熱交換器５とを連絡づ−る往路管路１４の相互間
で第２往路管路１３と第２復路管路１４とを熱的に連絡
する第３熱交換器２］をそれぞれ追設したものであるが
、第３図の実施例と作用効果において差異はない。 ゛FIG. 4 shows a second embodiment of the present invention different from FIG. 3, in which the second refrigerator low temperature generating section heat exchanger 6 in FIG.
Second outgoing pipe line 1 connecting heat shield plate cooling heat exchanger 9
3, a third refrigerator low temperature generating section heat exchanger 22 is additionally installed, and a second outgoing pipe line 13 connecting the second refrigerator low temperature generating section heat exchanger 6 and the heat exchanger 22 is added. , the heat exchanger 9
and the third heat exchanger 2 which thermally communicates the second outgoing pipe line 13 and the second return pipe line 14 between the outgoing pipe line 14 which connects the second outgoing pipe line 13 and the second return pipe line 14, respectively. Although this is an additional feature, there is no difference in operation and effect from the embodiment shown in FIG.゛
第１図及び第２図はそれぞれ従来の低温容器の異なる構
成の回路図、第３図及び第４図はそれぞれ本発明の第１
、第２実施例を示す低温容器の回路図である。
図の主要部分の説明
ｌ ・・圧縮機 ４ ・第１冷凍機低温発生部熱交換器
７ 第２熱シールド板 ８ 第１熱シールド板９ 第２
熱シールド板冷却熱交換器1 and 2 are circuit diagrams of different configurations of conventional cryogenic containers, and FIGS. 3 and 4 are circuit diagrams of the first embodiment of the present invention, respectively.
FIG. 2 is a circuit diagram of a low temperature container showing a second embodiment. Explanation of the main parts of the diagram: Compressor 4 - First refrigerator low temperature generation section heat exchanger 7 Second heat shield plate 8 First heat shield plate 9 Second
heat shield plate cooling heat exchanger
Claims (1)
に２層以」二の熱７−ルド板を用いてなる低温容器にお
いて、該熱／−ルド板の冷却回路を一系統とし、高温側
の熱／−ルド板を冷却した低温液体又は気体を再度冷凍
機の高温側の低温発生部で冷却するようにしたことを特
徴とする低温容器。In a low-temperature container that uses two or more layers of thermal conductive plates within a vacuum insulation layer using low-temperature liquefied gas such as liquid helium, the cooling circuit for the thermal conductive plates is one system, and the high-temperature side A low-temperature container characterized in that the low-temperature liquid or gas that has cooled the heat/hold plate is cooled again in a low-temperature generating section on the high-temperature side of the refrigerator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5591084A JPS60201199A (en) | 1984-03-23 | 1984-03-23 | Low-temperature receptacle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5591084A JPS60201199A (en) | 1984-03-23 | 1984-03-23 | Low-temperature receptacle |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60201199A true JPS60201199A (en) | 1985-10-11 |
| JPH0366558B2 JPH0366558B2 (en) | 1991-10-17 |
Family
ID=13012264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5591084A Granted JPS60201199A (en) | 1984-03-23 | 1984-03-23 | Low-temperature receptacle |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60201199A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49121497A (en) * | 1973-03-19 | 1974-11-20 |
-
1984
- 1984-03-23 JP JP5591084A patent/JPS60201199A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49121497A (en) * | 1973-03-19 | 1974-11-20 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0366558B2 (en) | 1991-10-17 |
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