JPS6020152U - Connection structure of hybrid integrated circuit - Google Patents
Connection structure of hybrid integrated circuitInfo
- Publication number
- JPS6020152U JPS6020152U JP1983112157U JP11215783U JPS6020152U JP S6020152 U JPS6020152 U JP S6020152U JP 1983112157 U JP1983112157 U JP 1983112157U JP 11215783 U JP11215783 U JP 11215783U JP S6020152 U JPS6020152 U JP S6020152U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- connection structure
- hybrid integrated
- board
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の接続構造例を示す斜視図、第２図は本考
案の接続構造実施例を示す斜視図、第３図は第２図Ａ−
Ａ指標線切断の断面図、第４図は□ コネクタソケット
嵌人後の混成集積回路接続状態図である。
図中、１は接続ピン端子、２は回路組立の外装本体、３
は凹部、４はセラミック等の回路基板、５は上蓋ケース
、６は回路基板の余白面、７は４と５の接着シール、８
は４に装着された半導体１．９は厚膜のコンタクト導体
パターン、及び１０は突起である。 ′Fig. 1 is a perspective view showing an example of a conventional connection structure, Fig. 2 is a perspective view showing an embodiment of the connection structure of the present invention, and Fig. 3 is Fig. 2A-
A sectional view taken along the A index line, and FIG. 4 is a diagram of the hybrid integrated circuit connection state after the connector socket is fitted. In the figure, 1 is the connection pin terminal, 2 is the exterior body of the circuit assembly, and 3
is a recess, 4 is a ceramic circuit board, 5 is a top cover case, 6 is a margin surface of the circuit board, 7 is an adhesive seal between 4 and 5, 8
4 is a semiconductor 1, 9 is a thick film contact conductor pattern, and 10 is a protrusion. ′
Claims (1)
着脱可能な厚膜コンタクトからなるコネクタ接続部とし
たことを特徴とする混成集積回路の接続構造。A connection structure for a hybrid integrated circuit, characterized in that the board margin surface of the integrated circuit board to which the upper cover case is attached is a connector connection part made of a removable thick film contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983112157U JPS6020152U (en) | 1983-07-19 | 1983-07-19 | Connection structure of hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983112157U JPS6020152U (en) | 1983-07-19 | 1983-07-19 | Connection structure of hybrid integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6020152U true JPS6020152U (en) | 1985-02-12 |
Family
ID=30260115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1983112157U Pending JPS6020152U (en) | 1983-07-19 | 1983-07-19 | Connection structure of hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6020152U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5487474A (en) * | 1977-12-23 | 1979-07-11 | Nec Corp | Semiconductor device |
| JPS5632752A (en) * | 1979-08-23 | 1981-04-02 | Seiko Instr & Electronics Ltd | Parts of segmented electrode |
-
1983
- 1983-07-19 JP JP1983112157U patent/JPS6020152U/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5487474A (en) * | 1977-12-23 | 1979-07-11 | Nec Corp | Semiconductor device |
| JPS5632752A (en) * | 1979-08-23 | 1981-04-02 | Seiko Instr & Electronics Ltd | Parts of segmented electrode |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS60140374U (en) | connector terminal | |
| JPS59152776U (en) | Connection structure between multilayer printed board and connector | |
| JPS59104562U (en) | flexible circuit board | |
| JPS5837157U (en) | hybrid integrated circuit | |
| JPS60129146U (en) | integrated circuit socket | |
| JPS59128744U (en) | Hybrid circuit electrode structure | |
| JPS62116383U (en) | ||
| JPS58146371U (en) | Terminal structure for external line connection | |
| JPS6090846U (en) | hybrid integrated circuit | |
| JPS59171350U (en) | Semiconductor element mounting structure | |
| JPS59101425U (en) | electronic components | |
| JPS6076058U (en) | Electronic component mounting structure | |
| JPS59112489U (en) | connector | |
| JPS60174253U (en) | Hybrid integrated circuit device | |
| JPS58175661U (en) | Highly integrated hybrid integrated circuit | |
| JPS5990191U (en) | integrated circuit socket | |
| JPS59168982U (en) | socket for electrical equipment | |
| JPS59104540U (en) | Ceramic chip carrier | |
| JPS60169901U (en) | Adhesive structure of microwave integrated circuit board | |
| JPS5929043U (en) | microwave integrated circuit | |
| JPS59154788U (en) | integrated circuit socket | |
| JPS6073277U (en) | hybrid integrated circuit board | |
| JPS58124958U (en) | Sealing structure of hybrid integrated circuit | |
| JPS58179765U (en) | Connection structure of terminals on housing board | |
| JPS58135948U (en) | Sealing lid structure for hybrid integrated circuits |