JPS6020168U - hybrid integrated circuit - Google Patents
hybrid integrated circuitInfo
- Publication number
- JPS6020168U JPS6020168U JP11215483U JP11215483U JPS6020168U JP S6020168 U JPS6020168 U JP S6020168U JP 11215483 U JP11215483 U JP 11215483U JP 11215483 U JP11215483 U JP 11215483U JP S6020168 U JPS6020168 U JP S6020168U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- shows
- guide
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の部品実装方法、第２図は本考案の一実施
例であり、第１図ａは正しく実装された例、第１図すは
不良の例、第２図ａは基板の構造、第２図すは部品を実
装した例である。図において１は基板、２は導体パター
ン、３は部品、４は部品の端子、５は位置ずれ矯正用ガ
イド、６はガラスダムパターンを示す。Fig. 1 shows a conventional component mounting method, Fig. 2 shows an example of the present invention, Fig. 1a shows an example of correct mounting, Fig. 1 shows a defective example, and Fig. 2a shows an example of a board mounted correctly. Structure: Figure 2 shows an example of mounting parts. In the figure, 1 is a substrate, 2 is a conductor pattern, 3 is a component, 4 is a terminal of the component, 5 is a guide for correcting positional deviation, and 6 is a glass dam pattern.
Claims (1)
けたことを特徴とする混成集積回路。A hybrid integrated circuit characterized in that a guide for correcting misalignment is provided at the center of a component mounting position on a board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11215483U JPS6020168U (en) | 1983-07-19 | 1983-07-19 | hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11215483U JPS6020168U (en) | 1983-07-19 | 1983-07-19 | hybrid integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6020168U true JPS6020168U (en) | 1985-02-12 |
Family
ID=30260109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11215483U Pending JPS6020168U (en) | 1983-07-19 | 1983-07-19 | hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6020168U (en) |
-
1983
- 1983-07-19 JP JP11215483U patent/JPS6020168U/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6020168U (en) | hybrid integrated circuit | |
| JPS5929068U (en) | Positioning structure for chip-type parts | |
| JPS5878682U (en) | electronic components | |
| JPS58162662U (en) | Printed board | |
| JPS6088576U (en) | printed wiring board | |
| JPS5840857U (en) | Shape of backside terminals of hybrid integrated circuits | |
| JPS5920674U (en) | printed wiring board | |
| JPS60167363U (en) | Thin film CR chip | |
| JPS58150857U (en) | printed wiring board | |
| JPS59111100U (en) | electronic components | |
| JPS6083273U (en) | Component mounting structure | |
| JPS6022764U (en) | Connector for printed circuit board mounting | |
| JPS6081674U (en) | Ceramic hybrid integrated circuit device | |
| JPS6076058U (en) | Electronic component mounting structure | |
| JPS6085866U (en) | Printed board | |
| JPS59146978U (en) | printed wiring board | |
| JPS60179065U (en) | printed circuit board | |
| JPS6049666U (en) | Mounting structure of integrated circuit components | |
| JPS5970373U (en) | Connection structure of flexible printed board | |
| JPS6011470U (en) | Electronics | |
| JPS6122381U (en) | Thick film hybrid integrated circuit | |
| JPS5944069U (en) | electronic circuit module | |
| JPS583061U (en) | Parts mounting structure | |
| JPS60185353U (en) | Printed board | |
| JPS58177882U (en) | Package test jig |