JPS60202042A - Printed circuit board feeding device at defined interval - Google Patents
Printed circuit board feeding device at defined intervalInfo
- Publication number
- JPS60202042A JPS60202042A JP59055242A JP5524284A JPS60202042A JP S60202042 A JPS60202042 A JP S60202042A JP 59055242 A JP59055242 A JP 59055242A JP 5524284 A JP5524284 A JP 5524284A JP S60202042 A JPS60202042 A JP S60202042A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- feeding
- circuit board
- fast
- circuit boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/04—Punching, slitting or perforating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D5/20—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting with interrelated action between the cutting member and work feed
- B26D5/26—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting with interrelated action between the cutting member and work feed wherein control means on the work feed means renders the cutting member operative
- B26D5/28—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting with interrelated action between the cutting member and work feed wherein control means on the work feed means renders the cutting member operative the control means being responsive to presence or absence of work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D5/00—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D5/20—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting with interrelated action between the cutting member and work feed
- B26D5/30—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting with interrelated action between the cutting member and work feed having the cutting member controlled by scanning a record carrier
- B26D5/32—Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting with interrelated action between the cutting member and work feed having the cutting member controlled by scanning a record carrier with the record carrier formed by the work itself
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/06—Arrangements for feeding or delivering work of other than sheet, web, or filamentary form
- B26D7/0675—Arrangements for feeding or delivering work of other than sheet, web, or filamentary form specially adapted for piles of sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/22—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
- B32B37/223—One or more of the layers being plastic
- B32B37/226—Laminating sheets, panels or inserts between two continuous plastic layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
- B32B38/1833—Positioning, e.g. registration or centering
- B32B38/1841—Positioning, e.g. registration or centering during laying up
- B32B38/185—Positioning, e.g. registration or centering during laying up combined with the cutting of one or more layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F2210/00—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
- B26F2210/08—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of ceramic green sheets, printed circuit boards and the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3425—Printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/60—In a particular environment
- B32B2309/68—Vacuum
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
Landscapes
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Attitude Control For Articles On Conveyors (AREA)
- Registering Or Overturning Sheets (AREA)
- Laminated Bodies (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
発明の技術分野
本発明はプリント板の製作に用いる装置に関し、特にプ
リント基板を連続的に送りながらその表面にドライフィ
ルムをラミネートするラミネート部を有するプリント基
板ラミネート装置における該ラミネート部へのプリント
基板の定間隔給送装置に関する。TECHNICAL FIELD OF THE INVENTION The present invention relates to an apparatus used for manufacturing printed circuit boards, and particularly to a printed circuit board laminating apparatus having a laminating section for laminating a dry film on the surface of a printed circuit board while continuously feeding the printed circuit board. The present invention relates to a device for feeding printed circuit boards at regular intervals to a laminate section.
なお本明細書では、プリント板の基板を「プリント基板
」あるいは単に「基板」と略記し、またドライフィルム
状のフォトレジストあるいは基板にラミネートする保護
フィルム等を「フォトレジ ゛ストフィルム」あるいは
「レジストフィルム」と代表して略記する。In this specification, the substrate of a printed circuit board is abbreviated as a "printed circuit board" or simply "substrate," and a dry film of photoresist or a protective film laminated onto a substrate is referred to as a "photoresist film" or "resist." It is abbreviated as "film".
技術の背景
近年のプリント板の製造方法は、銅張板の如き基板の導
体層表面にフォトレジスト層を形成し、フォトリソグラ
フィ技術を用いて配線パターンを形成する方法が主流で
ある。この場合のフォトレジスト層の形成方法としては
、基板表面にドライフィルム状のフォトレジストをラバ
ネートして形成する方法が主に用いられている。Background of the Technology In recent years, the mainstream method for manufacturing printed circuit boards is to form a photoresist layer on the surface of a conductor layer of a board such as a copper-clad board, and to form a wiring pattern using photolithography technology. In this case, as a method for forming the photoresist layer, a method is mainly used in which a dry film-like photoresist is laminated onto the surface of the substrate.
このようなプリント基板へのレジストフィルムのラミネ
ートは、以前は長尺帯状のレジストフィルムを基板の長
さに切断した上で1枚ごとに行っていたが、この方法は
非能率的で量産性に欠ける。Previously, resist film was laminated onto printed circuit boards by cutting a long strip of resist film to the length of the board and then laminating the resist film one by one, but this method was inefficient and hindered mass production. Missing.
そのため、近年、レジストフィル、ムを切断せずに長尺
帯状のまま連続的にプリント基板にラミネート可能なラ
ミネート装置が開発されている。しかしながら従来のこ
の種のラミネート装置には後述するような問題があり、
その対策が要望されていた。Therefore, in recent years, a laminating apparatus has been developed that can continuously laminate a resist film in the form of a long strip onto a printed circuit board without cutting it. However, conventional laminating devices of this type have problems as described below.
Measures against this were requested.
従来技術と問題点
従来の上記の如きラミネート装置は、プリント基板を送
りローラなどで互いに間隔をおいて連続的に送りながら
長尺帯状のレジストフィルムを連続的に供給してプリン
ト基板の表面にラミネートロールで連続的に熱圧着する
ラミネート部を具えている。Prior Art and Problems Conventional laminating equipment as described above laminates the printed circuit board on the surface of the printed circuit board by continuously feeding a long strip of resist film while continuously feeding the printed circuit board with a feed roller or the like at intervals. It has a laminate section that is continuously heat-pressed using rolls.
しかるに従来は、前段のプリント基板処理部あるいはプ
リント基板ストック部からラミネート部へ供給されるプ
リント基板の間隔にバラツキがあり、そのために以下の
ような問題があった。すなわち、上記のラミネート装置
でレジストフィルムがラミネートされたプリント基板は
レジストフィルムによって相互に連結された状態でラミ
ネート装置から送出される。従って各基板間においてレ
ジストフィルムを切断して基板を1枚ずつ分離してやる
必要があるが、この場合に基板間隙が狭すぎるとフィル
ム切断がうまく行えず、また間隙が広すぎると切断後の
基板から飛び出しているレジストフィルム端部のめ(れ
または巻きっきが生じやすくなる。このため後段のフォ
トリソグラフィ工程において不具合が発生し、プリント
板の品質不良ひいては歩留り低下を招く結果となる。However, in the past, there were variations in the interval between printed circuit boards supplied from the preceding printed circuit board processing section or printed circuit board stock section to the laminating section, which caused the following problems. That is, the printed circuit boards laminated with resist films in the above laminating apparatus are sent out from the laminating apparatus while being interconnected by the resist films. Therefore, it is necessary to cut the resist film between each substrate and separate the substrates one by one. In this case, if the gap between the substrates is too narrow, the film cannot be cut properly, and if the gap is too wide, the substrates will be separated from each other after cutting. The protruding ends of the resist film tend to curl or curl. This causes problems in the subsequent photolithography process, leading to poor quality of the printed board and a decrease in yield.
発明の目的
本発明は、かかる問題を解消すること、すなわち上記の
ようなラミネート装置においてプリント基板を互いに一
定間隔で連続的にラミネート部へ給送でき、従ってラミ
ネート後にレジストフィルムを容易に且つ良好に切断可
能となし、結果的にプリント基板ラミネート工程におけ
る生産性向上ならびにプリン1反の品質向上ひいては歩
留り向上を可能にするプリント基板の定間隔給送装置を
提供することを目的とするものである。OBJECT OF THE INVENTION The present invention aims to solve this problem, namely, in the laminating apparatus as described above, printed circuit boards can be continuously fed to the laminating section at regular intervals, so that resist films can be easily and efficiently applied after lamination. It is an object of the present invention to provide a fixed interval feeding device for printed circuit boards that can be cut and, as a result, improve productivity in the printed circuit board lamination process, improve the quality of each roll of pudding, and ultimately improve the yield.
発明の構成
本発明によるプリント基板の定間隔給送装置は、上記の
ようなプリント基板ラミネート装置においてプリンi板
供給部が4供給されるプリント基板を互いに一定間隔で
連続的に前記ラミネート部へ給送するものであって、
(イ)前記プリント基板供給部に近接して配置され且つ
物品給送路の下方の初期位置及び該給送路と同一レベル
となる上方位置の間で上下に昇降可能なプリント基板厚
遇り用の早送り機構、(ロ)該早送り機構がその初期位
置に位置しているときのその後端部近傍位置に固設され
ていて、該早送り機構によって早送りされてきたプリン
ト基板を停止させてこれを該早送り機構上にて待機させ
るためのストッパ、
(ハ)前記早送り機′構の上方に配置されていて該早送
り機構が上方位置へ上昇したときにそれに載っているプ
リント基板をクランプし、該早送り機構と協働して該プ
リント基板を前記所定給送速度よりも早い速度で早送り
給送する早送り給送機構、
(ニ)該早送り給送機構に対し前記ラミネート部側に上
下に開閉可能に配置されていて、前記早送り給送機構に
よるプリント基板の早送り給送終了後に該プリント基板
を前記所定給送速度で前記ラミネート部へと給送する給
送機構、及び(ホ)該給送機構と前記ラミネート部との
間に前記給送路に対して出し入れ自在に且つ該給送路と
平行に移動可能に配置され一前記ラミネート部に給送さ
れる先行のプリント基板と前記早送り給送機構によって
早送りされる後続ψプリント基板との間に挿入介在して
両プリント基板間に前記一定間隔を確保し、前記給送機
構による後続プリント基板の定速給送開始後に両プリン
ト基板間から抜去される間隔部材、
を具備する構成としたものである。Structure of the Invention The printed circuit board fixed interval feeding device according to the present invention is such that in the printed circuit board laminating apparatus as described above, four printed circuit boards are continuously fed to the laminate section at regular intervals. (a) It is disposed close to the printed circuit board supply section and is capable of rising and falling between an initial position below the article feeding path and an upper position at the same level as the feeding path. (b) A fast-feeding mechanism for thickly handling printed circuit boards, (b) fixed to a position near the rear end when the fast-feeding mechanism is located at its initial position, and capable of handling printed circuit boards fast-forwarded by the fast-feeding mechanism; (c) a stopper for stopping the rapid-forwarding mechanism and making it wait on the rapid-forwarding mechanism; (d) a fast-feeding mechanism that clamps and rapidly feeds the printed circuit board at a speed faster than the predetermined feeding speed in cooperation with the fast-feeding mechanism; (e) a feeding mechanism that is arranged to be openable and closable at the laminate section and feeds the printed circuit board to the laminate section at the predetermined feeding speed after the rapid feeding mechanism finishes feeding the printed circuit board; A preceding printed circuit board to be fed to the laminate section and the fast feed are arranged between the feeding mechanism and the laminate section so as to be able to be moved in and out of the feed path and movable parallel to the feed path. It is inserted between the following ψ printed circuit board that is rapidly fed by the feeding mechanism to ensure the constant interval between the two printed circuit boards, and after the feeding mechanism starts feeding the subsequent printed circuit board at a constant speed, the distance between the two printed circuit boards is The spacing member is removed from the spacer.
発明の実施例
以下、本発明の実施例につき図面を参照して詳細に説明
する。尚、全図を通じて同一符号は同一部分を示す。Embodiments of the Invention Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that the same reference numerals indicate the same parts throughout the figures.
第1図は本発明によるプリント基板の定間隔給送装置を
具えたプリント基板ラミネート装置(以下単に「ラミネ
ータ」と称する)の一実施例の外観を略示する斜視図で
あり、第2図及び第3図はその全体構成を略示したそれ
ぞれ平面図及び側面図である。これらの図において符号
1はラミネータ全体を示し、ラミネータ1は基本的には
タイミング合せ部2、ラミネート部3、および切断部4
から構成されている。また第2図及び第3図の符号5は
図示していない前段のプリント基板処理部あるいはプリ
ント基板ストック部からプリント基板Pをラミネータ1
へ供給する基板供給部を示す。FIG. 1 is a perspective view schematically showing the appearance of an embodiment of a printed circuit board laminating apparatus (hereinafter simply referred to as a "laminator") equipped with a fixed interval feeding device for printed circuit boards according to the present invention, and FIG. FIG. 3 is a plan view and a side view, respectively, schematically showing the overall configuration. In these figures, the reference numeral 1 indicates the entire laminator, and the laminator 1 basically includes a timing unit 2, a laminating unit 3, and a cutting unit 4.
It consists of Further, reference numeral 5 in FIGS. 2 and 3 indicates that the printed circuit board P is transferred to the laminator 1 from the previous stage printed circuit board processing section or printed circuit board stock section (not shown).
The figure shows the substrate supply unit that supplies the substrate to the substrate.
まず第2図及び第3図を参照して基板供給部5及びラミ
ネータ1の各部2,3.4の全体的な構成および作用を
節単に説明する。基板供給部5は、プーリ6に水平に巻
回された1対の送りベルト7で基FiPを水平送路T(
第3図に一点鎖線で示す)に沿って矢印入方向へ水平状
態にて送り、フリーの支持ローラ8を経てラミネータ1
のタイミング合せ部2へ供給するように構成されている
。First, the overall structure and operation of the substrate supply section 5 and each section 2, 3.4 of the laminator 1 will be briefly explained with reference to FIGS. 2 and 3. The substrate supply unit 5 transports the substrate FiP through a horizontal feeding path T (
3) in the direction of the arrow, and passes through the free support roller 8 to the laminator 1.
It is configured such that the signal is supplied to the timing adjustment section 2 of.
ラミネータ1のタイミング合せ部2は、早送りベルト1
1、ストッパ17、ガイドローラ18及び幅寄せローラ
19(第2図)、クランプ用ローラ21.給送用ローラ
22及び23、間隔ビン25等を有する本発明による基
板定間隔給送装置を具備しており、基板供給部5から供
給された基板Pを互いに所定の間隙d(例えば2〜3m
m)を隔てた状態で且つ基板送り方向に正しく向いた状
態に整列させて所定の速度V(例えば0.5〜21Il
/分)にて連続的に次のラミネート部3へ給送する。尚
、この基板定間隔給送装置はこの後に第4図から第7図
を参照して詳述する。The timing adjustment section 2 of the laminator 1 has a fast-feeding belt 1
1, stopper 17, guide roller 18, width adjusting roller 19 (Fig. 2), clamp roller 21. It is equipped with a substrate constant-space feeding device according to the present invention having feeding rollers 22 and 23, a spacing bin 25, etc., and the substrates P supplied from the substrate supply section 5 are separated from each other by a predetermined gap d (for example, 2 to 3 m).
m) at a predetermined speed V (e.g., 0.5 to 21 Il) while lining up in a state facing correctly in the substrate feeding direction.
/min) to the next laminating section 3. The device for feeding substrates at regular intervals will be described in detail later with reference to FIGS. 4 to 7.
ラミネート部3は、送りローラ31 、32 、33
、34、ラミネートロール35、フリーの支持ローラ3
6、レジストフィルムリール37等を有するラミネーせ
部2から給送された基板Pをそれらの間隙dを保った状
態で定速■にて連続的に送ると共に、長尺帯状のレジス
トフィルムF(第2図に特にハンチングを付して明示)
を基板の送り速度を等速度で連続的に供給し、且つレジ
ストフィルムFに予め基板Pの基準穴Hp(第2図)と
対応する逃げ穴Hf(第2図)を加工した上で、レジス
トフィルムFを基板Pの上下両面に連続的に熱圧着し、
そしてラミネート後の基板PおよびレジストフィルムF
を次の切断部4へ送出する。すなわち、タイミング合せ
部2から給送された基板Pはその間隔dを保った状態で
送りローラ31 、32 、33 、34により定速■
にてラミネートロール35を経て連続的に送られる。一
方、上下のレジストフィルムリール37から長尺帯状の
レジストフィルムFが連続的にラミネートロール35へ
供給され、基板Pの上面及び下面にそれぞれ連続的に熱
圧着される。更に、グイ・ポンチユニット40はそれぞ
れレジストフィルムFの供給路中にラミネートロール3
5から互いに等距離にて設けられており、一方、基板送
路Tのラミネートロール35に至る途中位置には基板P
の基準穴Hpを検出するためのセンサ(図示せず)がラ
ミネートローラ35からグイ・ポンチユニット40と等
距離にて配置されており、このセンサが基準穴Hpを検
出すると同時にグイ・ポンチユニット40がレジストフ
ィルムFに逃ケ穴Hfを加工する。そしてこれらの穴H
p SHfはラミネートローラ35の位置に送られてき
たときに第2図に示す如く重ね合わされる。The laminating section 3 includes feed rollers 31 , 32 , 33
, 34, laminating roll 35, free support roller 3
6. The substrate P fed from the laminating unit 2 having the resist film reel 37 etc. is continuously fed at a constant speed (2) while maintaining the gap d between them, and the long strip-shaped resist film F (No. (Specifically indicated with hunting in Figure 2)
is continuously supplied at a constant feeding speed of the substrate, and after cutting a relief hole Hf (Fig. 2) corresponding to the reference hole Hp (Fig. 2) of the substrate P in advance in the resist film F, The film F is continuously thermocompressed onto both the upper and lower surfaces of the substrate P,
Then, the substrate P and resist film F after lamination
is sent to the next cutting section 4. In other words, the substrate P fed from the timing adjustment section 2 is kept at a constant speed by the feed rollers 31, 32, 33, and 34 while maintaining the distance d.
The film is continuously fed through a laminating roll 35 at the same time. On the other hand, long strip-shaped resist films F are continuously supplied from the upper and lower resist film reels 37 to the laminating roll 35, and are continuously thermocompressed onto the upper and lower surfaces of the substrate P, respectively. Furthermore, each of the gou punch units 40 has a laminating roll 3 in the supply path of the resist film F.
On the other hand, on the way to the laminating roll 35 of the substrate feeding path T, the substrate P
A sensor (not shown) for detecting the reference hole Hp is arranged at the same distance from the laminating roller 35 as the Gouy punch unit 40, and at the same time as this sensor detects the reference hole Hp, the Gouy punch unit 40 A relief hole Hf is formed in the resist film F. And these holes H
When the pSHf sheets are sent to the position of the laminating roller 35, they are overlapped as shown in FIG.
切断部4は、送りロール51、ブーIJ 52及び53
に水平に巻回された送りベルト54、カッター60等を
有する切断機構を具えており、ラミネート部3から送出
されたラミネート後の基板PおよびレジストフィルムF
を連続的に送りながらレジストフィルムFを基板Pの間
隙部分にて切断して基板Pを1枚ずつに分離し、図示し
てない後段の基板処理部あるいは基板ストック部へ矢印
Bで示す如く送出する。すなわち、ラミネート部3から
送出されたレジストフィルムFで相互連結された基板P
の列は送りローラ5,1及び送りベルト54によって定
速■(但し、実用的には送りヘルド54の周速を定速■
より少し速(するのが有利)で連続的に送られる。カッ
ター60は送りローラ51と送りベルト54の間に設け
られていて、カミソリ刃状のカッターブレード65を有
して(、zる。The cutting section 4 includes a feed roll 51 and boo IJs 52 and 53.
It is equipped with a cutting mechanism having a feed belt 54 wound horizontally, a cutter 60, etc., and the laminated substrate P and resist film F sent out from the laminating section 3 are
While continuously feeding the resist film F, the resist film F is cut at the gap between the substrates P, and the substrates P are separated one by one, and sent as shown by arrow B to a subsequent substrate processing section or substrate stock section (not shown). do. That is, the substrates P interconnected by the resist film F sent out from the laminating section 3
The line is moved at a constant speed by the feed rollers 5, 1 and the feed belt 54 (however, in practice, the peripheral speed of the feed heald 54 is set at a constant speed).
Continuously sent at a slightly faster rate (advantageous). The cutter 60 is provided between the feed roller 51 and the feed belt 54, and has a razor-shaped cutter blade 65.
このカンクーブレード65は、図示してなし)支持機構
及び駆動機構によって第3図に示す如く上下に昇降可能
であると共に、第2図に示す如く基板列と同方向Bへ同
速度■にて送られると同時にそれを直角に横断する(実
際の軌跡は第2図に点線で示す如(基板列送り方向Bに
対し斜めになる)如く構成されている。そして、送りロ
ーラ51と送りベルト54の間において図示してないセ
ンサ(例えばフォトセンサ)によって基板列の基板間隙
が検出されると、カッターブレード65が第3図に示す
如く下降し、それと同時に矢印B方向へ定速■で移動し
つつそれと直角な方向へ移動し、レジストフィルムFを
基板間隙部分にて切断する。This Kanku blade 65 can be moved up and down as shown in FIG. 3 by a support mechanism (not shown) and a drive mechanism, and at the same speed in the same direction B as the substrate row as shown in FIG. The feed roller 51 and the feed belt 54 are configured to cross at right angles at the same time as being fed (the actual locus is as shown by the dotted line in FIG. 2 (oblique to the substrate row feeding direction B)). When the gap between the substrates in the row of substrates is detected by a sensor (for example, a photo sensor) not shown between the cutter blades 65 and 65, the cutter blade 65 descends as shown in FIG. At the same time, the resist film F is moved in a direction perpendicular thereto, and the resist film F is cut at the gap between the substrates.
これにより先行の基板Pは基板列から分離され、送りベ
ルト54によって矢印B方向へ送り出される。一方、切
断終了後、カンタ−ブレード65は第2図に符号65′
で示す位置で上昇し、基板側上方を切断時とは逆方向へ
移動して初期位置に復帰する。As a result, the preceding substrate P is separated from the substrate row and sent out in the direction of arrow B by the feeding belt 54. On the other hand, after the cutting is completed, the canter blade 65 is shown at 65' in FIG.
It rises at the position indicated by , moves upward on the substrate side in the opposite direction to the direction used when cutting, and returns to the initial position.
次に基板定間隔給送装置を第4図から第7図により詳述
する。第4図及び第5図はタイミング合せ部2を基板供
給部5及びラミネート部3の各一部分と共に示すそれぞ
れ平面図及び側面図である。Next, the substrate constant-space feeding device will be described in detail with reference to FIGS. 4 to 7. 4 and 5 are a plan view and a side view, respectively, showing the timing alignment section 2 together with parts of the substrate supply section 5 and the laminating section 3. FIG.
基板定間隔給送装置は、基板送路T(第5図)に沿って
基板供給部5に近い前段部に設けられたl対の早送りベ
ルト11を有している。この早送りベルト11はプーリ
12.13に水平に巻回されており、ベルトまたはチェ
ーン14でプーリ13に連結された2段変速モータM1
によって駆動されて、後述する如く基板Pの高速Vl及
び低速Vg (但し■ ゛<vt<v、である)での2
種類の早送りが可能に構成されている。尚、符号S1、
S2、S3は基板供給部5から早送りベルト11へ供給
されて早送すされる基板Pを検出するためのセンサを示
し、これらのセンサは図に明示してないがそれぞれ発光
素子と受光素子からなるフォトセンサである。The substrate constant-space feeding device has l pairs of rapid-feeding belts 11 provided at a front stage near the substrate supply section 5 along the substrate feeding path T (FIG. 5). This fast-feeding belt 11 is wound horizontally around pulleys 12 and 13, and a two-speed variable speed motor M1 is connected to the pulley 13 by a belt or chain 14.
2 at high speed Vl and low speed Vg (where ■゛<vt<v) of the substrate P as described later.
It is configured to allow various types of fast forwarding. In addition, the code S1,
S2 and S3 indicate sensors for detecting the substrate P that is fed from the substrate supply section 5 to the fast-feeding belt 11 and fast-forwarded, and although these sensors are not clearly shown in the figure, they each consist of a light-emitting element and a light-receiving element. It is a photo sensor.
また、早送りベルト11はリニアモータM2によって上
下方向へ昇降可能な支持台15上に装着され、第5図に
実線で示す如くベルト上面が基板送路Tより低くなる下
方位置(初期位置)と、点線11’で示す如くベルト上
面が基板送路Tとほぼ同レベルとなるような上方位置と
の間で昇降可能としである。その昇降ストロークは例え
ば15〜201である。この早送りベルト11が初期位
置(下方位置)にあやときのその後端の近傍位置にはス
トッパ17が配置されている。このストッパ17は後述
する如く早送りベル)IIによって早送りされた基板P
を所定の待機位置に停止させるためのものである。尚、
符号S4、S5は早送りベル)11の初期位置及び上方
位置をそれぞれ検出するためのセンサを示し、これらは
前述の如きフォトセンサまたは機械式マイクロスイッチ
である。The fast-feeding belt 11 is mounted on a support base 15 that can be raised and lowered in the vertical direction by a linear motor M2, and has a lower position (initial position) where the upper surface of the belt is lower than the substrate feeding path T, as shown by a solid line in FIG. As shown by a dotted line 11', the belt can be moved up and down between an upper position where the upper surface of the belt is approximately at the same level as the substrate feeding path T. The vertical stroke is, for example, 15-201. A stopper 17 is disposed near the rear end of the fast-forwarding belt 11 when it is at the initial position (lower position). This stopper 17 is connected to the substrate P fast-forwarded by the fast-forwarding bell) II as described later.
This is for stopping the machine at a predetermined standby position. still,
Reference numerals S4 and S5 indicate sensors for respectively detecting the initial position and upper position of the fast-forwarding bell (11), and these are the aforementioned photosensors or mechanical microswitches.
第4図に示す如く、早送りベルト11の両側方にはそれ
ぞれ固定のガイドローラ18及び基板送路Tと直角な水
平方向(矢印Z1、Z2)へ可動な幅寄せローラ19が
配置されている。幅寄せローラ19はエアー等を用いる
シリンダSYIによって駆動され、早送りベルト11上
の待機位置にある基板Pをガイドローラ18に対し押し
付けて基板Pを所定位置に且つ基板給送方向をまっすぐ
向くようにセントする作用をする。尚、バネ20はシリ
ンダSYIの基板押し力を調整するためのものである。As shown in FIG. 4, fixed guide rollers 18 and width adjusting rollers 19 movable in the horizontal direction (arrows Z1, Z2) perpendicular to the substrate feeding path T are arranged on both sides of the fast-feeding belt 11, respectively. The width adjustment roller 19 is driven by a cylinder SYI using air or the like, and presses the substrate P at the standby position on the fast-feeding belt 11 against the guide roller 18 so that the substrate P is in a predetermined position and faces straight in the substrate feeding direction. It has the effect of cent. Note that the spring 20 is for adjusting the substrate pressing force of the cylinder SYI.
第5図に示すように、早送りベル1−11の上方にはそ
れのプーリ13と対向させてクランプ用ローラ21を設
けである。クランプ用ローラ21はバネ21aによって
常に下方に付勢されており、後述するように早送りベル
ト11が上昇したときにその上に載っている基板Pをク
ランプし、早送りベルト11と協働して基板Pを低速ν
2で早送り給送するものである。As shown in FIG. 5, a clamping roller 21 is provided above the fast-forwarding bell 1-11 so as to face the pulley 13 thereof. The clamping roller 21 is always urged downward by a spring 21a, and as will be described later, when the fast-feeding belt 11 rises, it clamps the substrate P placed on it, and cooperates with the fast-feeding belt 11 to clamp the substrate P. P at low speed ν
2 for rapid feeding.
1クランプ用ローラ21の後段つまりラミネート部3側
には1対の給送ローラ22及び23を配置しである。下
側のローラ22はベルトあるいはチェーン24によって
ラミネート部3の送りローラ31と同期して常時駆動さ
れ、基板Pを所定速度Vで送ることができる。上側のロ
ーラ23はエアーなどを用いるシリンダSY2によって
上下に昇降可能に構成された従動ローうである。この上
側給送ローラ23は通常は上方位置(初期位置)にあり
、早送り゛ベルト11及びクランプ用ローラ21で早送
り給送される基板Pが給送ローラ22゜23間を自由に
通過し得るが、後述するようにこの基板早送り給送が終
了すると下降して基板Pを下側給送ローラ22との間に
クランプし、基板Pを定速■で給送するように構成され
ている。尚、符号S6、S7、S8は送路Tに沿って早
送り給送あるいは定速給送される基板Pを検出するため
の前記の如きフォトセンサを示し、また符号S9は上側
給送ローラ23の下方位置を検出するだめの前記の如き
フォトセンサあるいはマイクロスイッチを示す。・
更に、給送ローラ22,23の後段つまりラミネート部
3側には左右2本(第4図参照)の間隔ピン25を設け
である。間隔ビン25は所定の基板間隔dと等しくして
あり、エアー等を用いるシリンダSY3によって上下に
駆動されて基板1間に挿抜自在に構成されている。一方
、シリンダSY3は固定支持台26の水平ガイドロッド
27に装着されたスライダ28に取り付けられ、従って
間隔ビン25は第5図に実線で示ず給送ローラ22,2
3に近い前方位置と点線25′で示す送りローラ31に
近い後方位置との間を基板送路Tと平行に移動自在であ
る。後述するように、間隔ビン25は通常は前方の下方
位置(初期位置)にあり、基板Pの後端が間隔ピン25
を通過すると第5図に示す如く上昇させられる。そして
後続の基板Pが早送りベルト11及びクランプ用ローラ
21によって早送り給送されると、第4図及び第5図に
点ゆ25’、’rえ。。1□カ。□1ゆ、より、ヵ :
、行基板Pの後端に突き当てられる。これにより前後の
基板Pの間隔がdに設定される。その後、間隔ピン25
は基板1間から抜去され、そして支持台26とスライダ
28間に張設された復帰用バネ29によって初期位置へ
復帰させられる。尚、符号SIOはスライダ28つまり
間隔ピン25の後方位置25′を検出するための前記の
如きフォトセンサあるいはマイクロスイッチを示す。A pair of feeding rollers 22 and 23 are arranged downstream of the first clamping roller 21, that is, on the side of the laminating section 3. The lower roller 22 is constantly driven by a belt or chain 24 in synchronization with the feed roller 31 of the laminating section 3, and can feed the substrate P at a predetermined speed V. The upper roller 23 is a driven roller that can be moved up and down by a cylinder SY2 using air or the like. This upper feeding roller 23 is normally in the upper position (initial position), and the substrate P rapidly fed by the fast feeding belt 11 and the clamping roller 21 can freely pass between the feeding rollers 22 and 23. As will be described later, when this rapid feeding of the substrate is completed, it is lowered to clamp the substrate P between the lower feeding roller 22 and feed the substrate P at a constant speed (2). Incidentally, reference numerals S6, S7, and S8 indicate the aforementioned photosensors for detecting the substrate P that is fed rapidly or at a constant speed along the feeding path T, and reference numeral S9 indicates the photo sensor of the upper feeding roller 23. A photosensor or microswitch as described above is shown for detecting the downward position. Furthermore, two spacing pins 25 (see FIG. 4) are provided on the left and right sides of the feed rollers 22 and 23, that is, on the side of the laminating section 3. The spacing bins 25 are set equal to a predetermined substrate spacing d, and are configured to be freely inserted into and removed from between the substrates 1 by being driven up and down by a cylinder SY3 using air or the like. On the other hand, the cylinder SY3 is attached to a slider 28 attached to a horizontal guide rod 27 of a fixed support 26, so that the spacing bin 25 is not shown in solid line in FIG.
It is movable parallel to the substrate feeding path T between a front position close to 3 and a rear position close to the feed roller 31 indicated by a dotted line 25'. As will be described later, the spacing pin 25 is normally located at the lower front position (initial position), and the rear end of the board P is located at the spacing pin 25.
When it passes through, it is raised as shown in FIG. When the subsequent substrate P is rapidly fed by the fast-feeding belt 11 and the clamping roller 21, spots 25' and 're' appear in FIGS. 4 and 5. . 1□F. □1 Yu, Yori, Ka:
, is abutted against the rear end of the row substrate P. As a result, the distance between the front and rear substrates P is set to d. Then, the spacing pin 25
is removed from between the substrates 1 and returned to the initial position by a return spring 29 stretched between the support stand 26 and the slider 28. Incidentally, the reference numeral SIO indicates the above-mentioned photosensor or microswitch for detecting the rear position 25' of the slider 28, that is, the spacing pin 25.
さて以上の如き基板定間隔給送装置による基板Pの一定
間隔給送について第6A図から第6に図の工程図及び第
7図のタイムチャートに基づいて詳述する。尚、第6A
図から第6に図には関連部分のみ略示し、第7図にはセ
ンサSlがらSIO、モータM1、M2、及びシリンダ
SYIからSY3の動作のみ示しである。Now, the constant interval feeding of the substrates P by the substrate constant interval feeding apparatus as described above will be explained in detail based on the process diagrams shown in FIGS. 6A to 6 and the time chart shown in FIG. 7. Furthermore, the 6th A
Only related parts are schematically shown in FIG. 6, and FIG. 7 only shows the operations of sensor SI, SIO, motors M1, M2, and cylinders SYI to SY3.
(alまず第6A図に示すように、始動時には早送りベ
ルト11、上側給送ローラ23、間隔ピン25はいずれ
も初期位置にあるものとする。この状態で供給部5の送
りベルト7で第1番目の基板P1が送られてくると、基
板Piは支持ローラ8を半分以上越えた時点で斜めに傾
いて前端が早送りベルト11上に載る。(Al First, as shown in FIG. 6A, it is assumed that the rapid feed belt 11, the upper feed roller 23, and the spacing pin 25 are all in the initial position at the time of startup. In this state, the feed belt 7 of the supply section 5 When the th substrate P1 is sent, the substrate Pi is tilted diagonally when it passes over the support roller 8 by more than half, and the front end thereof is placed on the fast-feeding belt 11.
(bl第6B図に示す如く、基板P1をセンサs1が検
出するとモータM1によって早送りベルト11が高速駆
動され、基板P1は高速v、にて早送りされる。(As shown in FIG. 6B, when the sensor s1 detects the substrate P1, the motor M1 drives the fast-feeding belt 11 at high speed, and the substrate P1 is fast-forwarded at a high speed v.
(c)次いで第6C図に示す如く、基板P1の前端をセ
ンサS2が検知するとモータM1は低速駆動に切り集え
られ、基板Plは低速v2に減速されてストツパ17に
突き当る。そうするとセンサS3が基板P1を検出し、
モータM1つまり早送りベル)11の駆動が停止し、基
板P1はその位置に待機させられる。同時にまた、セン
サs3の信号により第4図に示す如くシリンダSYIが
作動して幅寄せ自−ラ19を矢印Z1方向へ駆動し、基
板PIをガイドローラ18に押し付けて所定位置及び正
しい向きにセットする。(c) Next, as shown in FIG. 6C, when the sensor S2 detects the front end of the board P1, the motor M1 is driven at a low speed, and the board P1 is decelerated to a low speed v2 and hits the stopper 17. Then sensor S3 detects substrate P1,
The driving of the motor M1 (that is, the fast-forwarding bell) 11 is stopped, and the substrate P1 is made to stand by at that position. At the same time, the cylinder SYI is actuated by the signal from the sensor s3 as shown in FIG. 4 to drive the width adjustment roller 19 in the direction of arrow Z1, and presses the board PI against the guide roller 18 to set it in a predetermined position and in the correct direction. do.
(d)更に、センサS3の信号により第6D図に示す如
(モータM2が作動して早送りベル!−11が矢印Yl
で示す如く上方位置へ上昇させられ、基iP1が送路T
上の給送位置にてクランプ用ローラ21でクランプされ
る。尚、早送りベルト11が上方位置に達するとセンサ
s5で検出されてモータM2が停止される。(d) Furthermore, as shown in FIG.
The base iP1 is raised to the upper position as shown in FIG.
It is clamped by a clamping roller 21 at the upper feeding position. Incidentally, when the fast-feeding belt 11 reaches the upper position, it is detected by the sensor s5 and the motor M2 is stopped.
(Q)次に同じ(センサS5の信号により第6E図に示
す如くモータM1が再び低速駆動され、基板P1は早送
りベルト11及びクランプ用ローラ21により給送位置
から給送用ローラ22.23を通って低速v2で早送り
給送される。(Q) Next, the motor M1 is driven at a low speed again as shown in FIG. It passes through and is fed in fast forward at low speed v2.
(f)そして第6F図に示す如く、基1IiP1の前端
をセンサS8が検出するとモータM1つまり早送りベル
ト11の駆動が停止する。同時にまた、シリンダSY2
が作動して上側給送ローラ23が矢印Y3方向へ下降し
、基板P1をクランプしてそれを所定速度■にて給送し
始める。一方、上側給送ローラ23の下降がセンサS9
で検出され、その信号によりモータM2が逆駆動されて
早送りベルト11は矢印Y2で示す如く下降し、初期位
置へ戻るとこれがセンサS4で検出されてモータM2は
停止する。更にまたセンサS9の信号により第4図に示
すようにシリンダSYIが作動して幅寄せローラ19が
矢印Z2方向へ復帰する。(f) Then, as shown in FIG. 6F, when the sensor S8 detects the front end of the base 1IiP1, the drive of the motor M1, that is, the fast-forwarding belt 11 is stopped. At the same time, cylinder SY2
is activated, the upper feeding roller 23 descends in the direction of the arrow Y3, clamps the substrate P1, and starts feeding it at a predetermined speed (2). On the other hand, the lowering of the upper feeding roller 23 is detected by the sensor S9.
The motor M2 is reversely driven by the signal, and the fast-forwarding belt 11 is lowered as shown by the arrow Y2, and when it returns to the initial position, this is detected by the sensor S4 and the motor M2 is stopped. Furthermore, as shown in FIG. 4, the cylinder SYI is actuated by the signal from the sensor S9, and the width adjusting roller 19 returns to the direction of the arrow Z2.
(g1次に第6G図に示すように、給送・ローラ22゜
23で定速給送される第1基板P1はラミネート部3の
送りローラ31へ給送され、引き続き定速■で送られる
。一方、初期位置へ戻った早送りベルト11には、基板
供給部5から第2番目の基板P2が第6A図から第6C
図を参照して上記+8)からtc>で説明した如くして
供給され、高速V1及び低速v2で早送りされ、そして
幅寄せされて所定位置にて待機する。(g1) Next, as shown in Fig. 6G, the first substrate P1, which is fed at a constant speed by the feed rollers 22 and 23, is fed to the feed roller 31 of the laminating section 3, and continues to be fed at a constant speed. On the other hand, the second substrate P2 from the substrate supply section 5 is transferred to the fast-forwarding belt 11 which has returned to the initial position from FIGS. 6A to 6C.
Referring to the figure, the rollers are supplied as described above from +8) to tc>, are fast-forwarded at high speed V1 and low speed V2, are brought closer to each other, and are placed on standby at a predetermined position.
(h)そして第6H図に示す如く、第1基板P1の後端
がセンサS6を通過するとモータM2が作動し、前記(
dlにおいて説明した第6D図の場合と同様に早送り、
ベルト11が上昇して第2基板P2はクランプ用ローラ
21でクランプされる。(h) As shown in FIG. 6H, when the rear end of the first substrate P1 passes the sensor S6, the motor M2 is activated and the (
Fast forward as in the case of Fig. 6D explained in dl,
The belt 11 rises and the second substrate P2 is clamped by the clamping rollers 21.
(1)次に第61図に示すように、第1基板P1の後端
がセンサS7を通過するとシリンダSY3が作動し、間
隔ピン25が矢印Y5方向へ上昇して基板P1.P2間
に挿入される。これと同時にシリンダSY2が作動し、
上側給送ローラ23が矢印Y4で示す如く初期位置に上
昇復帰する。同時にまたモータM1が低速駆動され、第
2基板P2が早送りベルト11及びクランプ用ローラ2
1によって低速V2で早送り給送される。(1) Next, as shown in FIG. 61, when the rear end of the first substrate P1 passes the sensor S7, the cylinder SY3 is actuated, and the spacing pin 25 rises in the direction of arrow Y5 to move the rear end of the first substrate P1 past the sensor S7. It is inserted between P2. At the same time, cylinder SY2 operates,
The upper feeding roller 23 ascends back to the initial position as shown by arrow Y4. At the same time, the motor M1 is again driven at low speed, and the second substrate P2 is moved between the fast-feeding belt 11 and the clamping roller 2.
1, the feed is fast-forwarded at low speed V2.
(J)そして第6J図に示すように、早送り給送される
第2基FiP2は前端で間隔ピン25を押しながら定速
給送されている第1基板P1を追走しくVx>V)、間
隔ピン25を介して第1基板Plの後端に突き当たる。(J) Then, as shown in FIG. 6J, the second substrate FiP2, which is fed in fast forward motion, follows the first substrate P1, which is fed at a constant speed, while pushing the spacing pin 25 at the front end (Vx>V), It abuts against the rear end of the first substrate Pl via the spacing pin 25.
これにより第1基板P1と第2基板P2との間隙dが所
定値に設定される。Thereby, the gap d between the first substrate P1 and the second substrate P2 is set to a predetermined value.
(k1間隔ピン25がその後方位置に達するとこれがセ
ンサS10で検出され、第6に図に示す如くシリンダS
Y2が作動して上側給送ローラ23が矢印Y3方向へ下
駿し、第2基板P2をクランプする。同時にまたシリン
ダSY3が作動して間隔ピン25を基板Pl、P2間か
ら矢印Y6方向へ抜去する。これにより基板P1及びP
2は定速Vにて互いに所定間隔dを保った状態で連続給
送される。一方、下方へ抜去された間隔ピン25は復帰
用バネ29によって矢印X2で示す如く前方の初期位置
(点線で示す)に復帰する。同時にまた上側給送ローラ
23の下降がセンサS9によって検出され、前述したよ
うに早送りベルト11はモータM2により初期位置へ下
降復帰する。(When the k1 spacing pin 25 reaches its rear position, this is detected by the sensor S10, and the cylinder S
Y2 is activated, and the upper feeding roller 23 moves downward in the direction of arrow Y3 to clamp the second substrate P2. At the same time, the cylinder SY3 operates again to remove the spacing pin 25 from between the substrates Pl and P2 in the direction of the arrow Y6. As a result, the substrates P1 and P
2 are continuously fed at a constant speed V while maintaining a predetermined distance d from each other. On the other hand, the spacing pin 25 that has been pulled out downward is returned to the initial position (indicated by the dotted line) in the front direction by the return spring 29 as shown by the arrow X2. At the same time, the lowering of the upper feeding roller 23 is also detected by the sensor S9, and as described above, the fast-feeding belt 11 is lowered and returned to the initial position by the motor M2.
(1,)以後は、第3番目の基板P3(第6に図)以下
の各基板について上記(g)から(klで説明した第2
基板P2の場合と同様の工程が反復される。尚、第7図
からも明らかなように、センサS8は第1番目の基板P
Iの検出にしか使用されない。(1,) From then on, for each board after the third board P3 (Fig. 6), from (g) to the second board explained in (kl),
The same steps as for substrate P2 are repeated. Incidentally, as is clear from FIG. 7, the sensor S8 is connected to the first substrate P.
It is only used to detect I.
このようにして、基板供給部5から供給された木板Pは
、供給時の基板間隔にバラツキがあっても、タイミング
合せ部2において互いに所定の間隔で整列させられて連
続的にラミネート部3へ給送されることになる。In this way, even if there are variations in the board spacing at the time of supply, the wooden boards P supplied from the board supply section 5 are aligned at predetermined intervals in the timing alignment section 2 and are continuously transferred to the laminate section 3. It will be shipped.
以上のように、本発明によるプリント基板定間隔給送装
置によれば、プリント基板Pをラミネート部3へ所定間
隔で連続的に給送することができ、従ってラミネート部
3におけるレジストフィルムの良好なラミネートを可能
とすることは勿論のこと、ラミネート後のレジストフィ
ルムの切断を能率良く且つ良好に行うことを可能とする
。As described above, according to the printed circuit board constant interval feeding device according to the present invention, the printed circuit boards P can be continuously fed to the laminating section 3 at predetermined intervals, and therefore the resist film in the laminating section 3 can be properly maintained. Not only does it enable lamination, but it also enables efficient and good cutting of the resist film after lamination.
発明の効果
以上の如(、本発明によればプリント基板を一定間隔で
連続給送可能なプリント基板定間隔給送装置を実現する
ことができ、従ってラミネート後のレジストフィルム切
断を容易且つ良好なものとし、結果的にプリント板の品
質向上ひいては歩留り向上を実現でき、その技術的およ
び経済的効果は著大である。As described above, according to the present invention, it is possible to realize a printed circuit board fixed interval feeding device that can continuously feed printed circuit boards at fixed intervals, and therefore, resist film cutting after lamination can be easily and efficiently performed. As a result, it is possible to improve the quality of printed boards and, in turn, to improve the yield, and the technical and economic effects are significant.
第1図は本発明によるプリント基板定間隔給送装置を具
えたプリント基板ラミネート装置の一実施例の外観略示
斜視図、第2図及び第3図はラミネート装置の全体構成
を略示するそれぞれ平面図及び側面図、第4図及び第5
図はラミネート装置のタイミング合せ部のそれぞれ平面
図及び側面図、第6A図から第6に図および第7図はプ
リント基板定間隔給送装置の作用を示すそれぞれ工程図
およびタイムチャートである。
■・・・プリント基板ラミネート装置、2・・・タイミ
ング合せ部、3・・・ラミネート部、4・・・切断部、
5・・・基板供給部、7・・・送りベルト、11・・・
早送りベルト、17・・・ストッパ、21・・・クラン
プ用ローラ、22 、23・・・給送ローラ、25・・
・間隔ピン、31 、32 、33 、34・・・送り
ローラ、35・・・ラミネートロール、37・・・レジ
ストフィルムリール、40・・・グイ・ポンチユニット
、51・・・送りローラ、54・・・送りベルト、60
・・・カッター、65・・・カッターブレード、P・・
・プリント基板、F・・・レジストフィルム、T・・・
基板送路、S1〜SIO・・・センサ、Ml、M2・・
・モータ、S1〜SIO・・・シリンダ。
特許出願人
富士通株式会社
特許出願代理人
弁理士 青 木 朗
弁理士西舘和之
弁理士内田幸男
弁理士 山 口 昭 之
&6八へ
第6B図
第60図
第6D図
l
第6E図
l
第6F図
第6G図
2″(
第6H図
第61図
第6j図
3
h6に図FIG. 1 is a perspective view schematically showing the appearance of an embodiment of a printed circuit board laminating apparatus equipped with a printed circuit board constant-space feeding device according to the present invention, and FIGS. 2 and 3 are schematic views showing the overall structure of the laminating apparatus, respectively. Plan view and side view, Figures 4 and 5
The figures are a plan view and a side view, respectively, of the timing adjustment section of the laminating apparatus, and FIGS. 6A to 6A and 7B are a process diagram and a time chart, respectively, showing the operation of the printed circuit board fixed interval feeding apparatus. ■...Printed circuit board laminating device, 2...timing unit, 3...laminate unit, 4...cutting unit,
5... Board supply unit, 7... Feeding belt, 11...
Rapid feed belt, 17...stopper, 21...clamping roller, 22, 23...feeding roller, 25...
- Spacing pin, 31, 32, 33, 34... Feed roller, 35... Laminating roll, 37... Resist film reel, 40... Gui punch unit, 51... Feed roller, 54...・Feed belt, 60
...Cutter, 65...Cutter blade, P...
・Printed circuit board, F...resist film, T...
Substrate feed path, S1 to SIO...sensor, Ml, M2...
・Motor, S1~SIO...Cylinder. Patent Applicant Fujitsu Limited Patent Application Agent Akira Aoki Patent Attorney Kazuyuki Nishidate Patent Attorney Yukio Uchida To Akira Yamaguchi & 68 Figure 6B Figure 60 Figure 6D Figure 6E Figure l Figure 6F Fig. 6G 2″ ( Fig. 6H Fig. 61 Fig. 6j Fig. 3 h6)
Claims (1)
る手段を備えるラミネート装置において、前記手段には
プリント基板を一時待機させる停止機構と、プリント基
板間に間隔部材を挿入〆抜取する機構を備えることを特
徴とするプリント基板の定間隔給送装置。 2、 プリント基板を互いに間隔をおいて連続的に送り
ながらその表面に長尺帯状のフィルム部材を連続的にラ
ミネートするラミネート部を有するプリント基板ラミネ
ート装置においてプリント基板供給部から供給されるプ
リント基板を互いに一定間隔で連続的に前記ラミネート
部へ給送するプリント基板の定間隔給送装置であって、
(イ)前記プリント基板供給部に近接して配置され且つ
物品給送路の下方の初期位置及び該給送路と同一レベル
となる上方位置の間で上下に昇降可能なプリント基板早
送り用の早送り機構、(ロ)該早送り機構がその初期位
置に位置しているときのその後端部近傍位置に固設され
ていて、該早送り機構によって早送りされてきたプリン
ト基板を停止させてこれを該早送り機構上にて待機させ
るためのストッパ、 (ハ)前記早送り機構の上方に配置されていて該早送り
機構が上方位置へ上昇したときにそれに載っているプリ
ント基板をクランプし、該早送り機構と協働して該プリ
ント基板を前記所定給送速度よりも早い速度で早送り給
送する早送り給送機構・ (ニ)該早送り給送機構に対し前記ラミネート部側に上
下に開閉可能に配置されていて、前記早送り給送機構に
よるプリント基板の早送り給送終了後に該プリント基板
を前記所定給送速度で前記ラミネート部へと給送する給
送機構、及び(ホ)該給送機構と前記ラミネート部との
間に前記給送路に対して出し入れ自在に且つ該給送路と
平行に移動可能に配置されえ前記ラミネート部に給送さ
れる先行のプリント基板と前記早送り給送機構によって
早送り給送される後続のプリント基板との間に挿入介在
して両プリント基板間に前記一定間隔を確保し、前記給
送機構による後続プリント基板の定速給送開始後に両プ
リント基板間から抜去される間隔部材、 を具備することを特徴とするプリント基板の定間隔給送
装置。 3、特許請求の範囲第2項記載の装置において、前記早
送り機構は、いずれも前記所定給送速度よりも早い2種
類の速度で前記プリント基板を早送り可能であることを
特徴とする装置。 4、特許請求の範囲第2項または第3項に記載の装置に
おいて、前記早送り機構の側方に、該早送り機構によっ
て早送りされたプリント基板を所定位置にて給送方向を
正しく向いた状態にセットするための幅寄せ機構を設け
たことを特徴とする装置。[Claims] 1. A laminating apparatus equipped with a means for continuously supplying printed circuit boards at regular intervals, the means having a stop mechanism for temporarily waiting the printed circuit boards, and a mechanism for inserting and extracting a spacing member between the printed circuit boards. 1. A fixed-space feeding device for printed circuit boards, comprising a mechanism for feeding the printed circuit boards at regular intervals. 2. In a printed circuit board laminating apparatus having a laminating section that continuously feeds printed circuit boards at intervals and continuously laminates a long strip-shaped film member on the surface of the printed circuit boards, the printed circuit boards supplied from the printed circuit board supply section are A constant-space feeding device for printed circuit boards that continuously feeds printed circuit boards to the laminate section at constant intervals,
(b) A fast feed for printed circuit boards that is disposed close to the printed circuit board supply section and that can be raised and lowered between an initial position below the article feeding path and an upper position at the same level as the feeding path. (b) a mechanism fixedly installed near the rear end of the fast-forwarding mechanism when the fast-forwarding mechanism is located at its initial position; (c) a stopper disposed above the fast-forwarding mechanism, which clamps the printed circuit board placed on the fast-forwarding mechanism when the fast-forwarding mechanism rises to the upper position, and cooperates with the fast-forwarding mechanism; (d) A rapid feeding mechanism that rapidly feeds the printed circuit board at a speed faster than the predetermined feeding speed. a feeding mechanism that feeds the printed circuit board to the laminate section at the predetermined feeding speed after the fast-forward feeding of the printed circuit board by the fast-forward feeding mechanism; and (e) between the feeding mechanism and the laminate section. a preceding printed circuit board to be fed to the laminate section and a subsequent printed circuit board to be fed in fast-forward by the fast-forward feeding mechanism; a spacing member that is inserted between the printed circuit board and the printed circuit board to ensure the constant spacing between the two printed circuit boards, and is removed from between the two printed circuit boards after the feeding mechanism starts feeding the subsequent printed circuit board at a constant speed; What is claimed is: 1. A fixed interval feeding device for printed circuit boards, comprising: 3. The apparatus according to claim 2, wherein the rapid feed mechanism is capable of rapidly feeding the printed circuit board at two different speeds, both of which are faster than the predetermined feeding speed. 4. In the apparatus according to claim 2 or 3, the printed circuit board fast-forwarded by the fast-forwarding mechanism is placed on the side of the fast-forwarding mechanism at a predetermined position with the feeding direction correctly oriented. A device characterized by having a width adjustment mechanism for setting.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59055242A JPS60202042A (en) | 1984-03-24 | 1984-03-24 | Printed circuit board feeding device at defined interval |
| CA000476569A CA1243417A (en) | 1984-03-16 | 1985-03-14 | Printed circuit board laminating apparatus |
| US06/711,635 US4680079A (en) | 1984-03-16 | 1985-03-14 | Printed circuit board laminating apparatus |
| EP85103025A EP0157261B1 (en) | 1984-03-16 | 1985-03-15 | Printed circuit board laminating apparatus |
| DE8585103025T DE3571309D1 (en) | 1984-03-16 | 1985-03-15 | Printed circuit board laminating apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59055242A JPS60202042A (en) | 1984-03-24 | 1984-03-24 | Printed circuit board feeding device at defined interval |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60202042A true JPS60202042A (en) | 1985-10-12 |
| JPH0457578B2 JPH0457578B2 (en) | 1992-09-14 |
Family
ID=12993122
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59055242A Granted JPS60202042A (en) | 1984-03-16 | 1984-03-24 | Printed circuit board feeding device at defined interval |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60202042A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ES2376450A1 (en) * | 2010-05-03 | 2012-03-14 | Jesús Francisco Barberan Latorre | System of coating of successive pieces with a continuous folio. (Machine-translation by Google Translate, not legally binding) |
| CN103481623A (en) * | 2012-06-08 | 2014-01-01 | 珠海格力电器股份有限公司 | Film discharging mechanism and film discharging method |
| TWI494201B (en) * | 2010-04-19 | 2015-08-01 | 塔工程有限公司 | Foreign matter drop prevention device for glass panel |
| CN106079809A (en) * | 2016-06-30 | 2016-11-09 | 苏州博众精工科技有限公司 | A kind of attaching mechanism |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5955243A (en) * | 1982-09-20 | 1984-03-30 | 横河電機株式会社 | Scanning system of ultrasonic diagnostic apparatus |
-
1984
- 1984-03-24 JP JP59055242A patent/JPS60202042A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5955243A (en) * | 1982-09-20 | 1984-03-30 | 横河電機株式会社 | Scanning system of ultrasonic diagnostic apparatus |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI494201B (en) * | 2010-04-19 | 2015-08-01 | 塔工程有限公司 | Foreign matter drop prevention device for glass panel |
| ES2376450A1 (en) * | 2010-05-03 | 2012-03-14 | Jesús Francisco Barberan Latorre | System of coating of successive pieces with a continuous folio. (Machine-translation by Google Translate, not legally binding) |
| CN103481623A (en) * | 2012-06-08 | 2014-01-01 | 珠海格力电器股份有限公司 | Film discharging mechanism and film discharging method |
| CN103481623B (en) * | 2012-06-08 | 2015-07-15 | 珠海格力电器股份有限公司 | Film discharging mechanism and film discharging method |
| CN106079809A (en) * | 2016-06-30 | 2016-11-09 | 苏州博众精工科技有限公司 | A kind of attaching mechanism |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0457578B2 (en) | 1992-09-14 |
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