JPS6021569A - Photodirect ignition type thyristor device and manufacture thereof - Google Patents

Abstract

PURPOSE:To enable to support and fix an optical fiber to a photoreceiving part with good accuracy by a method wherein an assemblage that the photooutput end of an optical fiber is fixed with a metal fitting and then covered with an insulation cap outside is inserted to the window and the like of a cathode electrode plate, thus making the photooutput end opposed to the photoreceiving part of a semiconductor substrate. CONSTITUTION:The fixing metal fitting 11 is installed to the optical fiber 10B and then clamped with a metallic nut 12. Opposed to the side of photooutput end of the fiber 10B, the cap 13 made of a flexible material such as Teflon is loaded to said end. Besides, a fixing ring 14 made of Teflon, etc. is previously inserted inside the end of the fiber 10B. Such an assemblage is inserted to the aperture 16 of the cathode electrode plate, and then the fixing ring 14 is pushed into the gap left between the inner wall surface of the aperture 16 and the outer peripheral surface of the insulation cap 13, resulting fixing in order that the assemblage does not relatively move to the aperture 16.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Application) The present invention relates to an optical IK contact arc-type cyrisk device and a method for manufacturing the same. The present invention relates to a light direct ignition type thyristor device that can easily bring a thyristor Yonago into a conductive state even with light energy, and a method for manufacturing the same.

(Back t) A light direct ignition type thyristor is a semiconductor-controlled rectifying element that has the function of turning on from a forward voltage blocking state to a conductive state in response to a light irradiation signal.

Compared to the so-called electric gate firing type thyristor, which is turned on by a normal electrical signal, the optical direct firing type thyristor can electrically isolate the main circuit and the gate control circuit, so it can be used for the gate control circuit of the device. It has the advantage that it can be simplified.

Furthermore, since optical energy is used as the gate signal, it has the advantage of being less susceptible to electromagnetic induction noise.

For this reason, recently, the use of light direct ignition type thyristors has become popular in high voltage conversion devices such as high voltage DC power transmission where multiple thyristors are connected in series. .

However, in the optical direct firing thyristor, unlike the electric gate thyristor, an optical transmission line such as glass fiber is used to guide the optical signal to the semiconductor substrate inside the thyristor element. Alternatively, a large number of parts are required for fixing.

FIG. 1 shows a schematic cross-sectional structure of a conventional optical direct ignition type thyristor device (1 (hereinafter abbreviated as "optical thyristor device")).

The optical thyristor device 1 is provided with an anode electrode 3 and a cathode electrode 4 which are in low resistance contact on the bidirectional side of a semiconductor substrate 2 having a pnpn thyristor junction, and which are further arranged outside the stiff electrode. , it has a structure in which it is sandwiched between an anode external electrode 5 and a cathode external electrode 6.

These external poles 5.6 are metal flanges 7A.

It is insulated and hermetically sealed by a cylindrical insulating seal 8 connected by 7K. Therefore, the inside of the optical thyristor device 1 is kept airtight.

The optical signal transmitted from the outside as shown by the arrow is
The optical fiber 10, one end of which is hermetically fixed, is introduced into the light-receiving portion of the semiconductor substrate 2 through a metal connector 9 that penetrates a portion of the insulating seal 8.

In such conventional examples, since the material that transmits the optical signal that turns on the optical thyristor device is an optical fiber,
This optical fiber must be precisely positioned and fixed to the light receiving portion of the semiconductor substrate 2.

Generally, it has been empirically shown that if the relative positional misalignment between the optical axis of the optical transmission fiber and the optical axis of the light receiving section is 10% or less, the misalignment of the minimum ignition light input of the semiconductor substrate can also be suppressed to within about 10%. known to.

For example, if the minimum ignition light input at the optical input end of the optical fiber 10 is 15 mW or less, during normal operation, the gate overdrive rate is about 10 times or more, that is, the optical input signal is 150 mW or more. , turning on the thyristor element.

On the other hand, at the current state of the art, the input power of the optical signal that can be supplied to the input end of the optical fiber 10 is at most x5omW.
That's about it. Therefore, in order to increase the gate overdrive rate by more than 10 times, it is necessary to reduce the minimum firing light input of the thyristor element to 15 m W s or less.

When the gate overdrive ratio is small, the firing region spreads slowly after the thyristor element is fired. For this purpose, while the ignition area does not extend over the entire surface of the semiconductor body, the ignition area is mainly 1! The disadvantage is that current flows in, causing local current concentration and destroying the thyristor element.

Incidentally, in an electric gate thyristor, the gate overdrive ratio is usually about 20 times.

Therefore, the optical transmission fiber 10 is oriented such that the optical axis misalignment with respect to the light receiving portion of the semiconductor substrate 2 is 10% or less.
This molasses needs to be well fixed.

In view of the above points, an optical thyristor device as shown in Fig. 2 has been proposed in consideration of good assembly workability of the optical thyristor device and prevention of deviation of the optical axis (Japanese Unexamined Patent Publication No. 1983-1999).
18770).

FIG. 2 is a sectional view of a main part for explaining a connecting portion of an optical fiber. In the drawings, the same reference numerals as in FIG. 1 refer to the same or equivalent parts.

The first optical fiber IOA is fixed to the insulating seal 8 via a metal connector 9. A support jig 22 is attached to the inner (output side) end of the first optical fiber IOA. On the other hand, a support jig 21 is fixed to the input side end of the second optical fiber IOH.

Then, the supporting jig JL21 and 22 are connected to the connecting tool 20.
By fixing the first optical fiber IOA with the inner end of the first optical fiber IOA and the entrance end of the second optical fiber 10B, the optical axis can be aligned.

Further, a metal fixture JLII is fixed to the light output end of the second optical fiber IOH, that is, the end of the semiconductor substrate 2 on the side facing the light receiving section. The metal fixture 11 is covered with an insulating cap 13 for preventing contact with the surface area of the semiconductor substrate 2 and the electrodes.

The second optical fiber 10B is fixed and integrated as described above.
, the assembly of the metal fixture 11 and the insulating cap 13 is assembled using an opening or window 16 provided in the cathode electrode plate 4.
mated to.

That is, in the conventional example, as described above, the second optical fiber 1 is positioned so that the output end of the second optical fiber IOB can be accurately positioned (eye-to-eye) with respect to the light receiving part of the semiconductor substrate 2.
The structure is such that the 0B is fixed by a metal fixture 11ir, and an insulating camp 13 is inserted outside of the metal fixture 11ir.

In the case of #V construction like this, the second optical fiber IOB must be optically fixed to each of the ten first optical fibers with high precision, so in consideration of assembly workability, First, the input side end of the second optical fiber 10B is
Usually, it is optically coupled and fixed to the inner end of the first optical fiber IOA with high precision.

For this purpose, first, as shown in Figure 2,
A support jig 22 is fixed to the inner end of the second optical fiber IOA, and a support jig 21 is fixed to the input end of the second optical fiber JOB. And these supporting jigs 21, 2
21! The connection part 20 is integrally and fixedly connected.

After that, the output end (light output end) of the second optical fiber IOB
)il- must be aligned with the light receiving part of the semiconductor substrate 2.

In this case, a window 16 is opened in the cathode electrode plate 4 facing the light receiving portion of the semiconductor substrate 2, and the second optical fiber IOB is inserted together with the metal fixture 11 and the insulating cap 13. By the way, as is clear, in order to insert an assembly such as the insulating cap 13 of the above-described structure of the IC 1 into the window 16 of the cathode electrode plate 4, the gap between the inner wall surface of the window 16 and the outer peripheral surface of the cap 13 must be widened. It is necessary to make it somewhat larger.

As can be seen, if there is a gap between the inner wall surface of the window 16 and the outer peripheral surface of the insulating cap 13, the second
After inserting the optical output end of the optical fiber JOB into the window 16,
There will be conflict between them.

Therefore, in the conventional device, the relative alignment accuracy between the light output end of the second optical fiber 10B and the light receiving portion of the semiconductor substrate 2 is reduced.

If the alignment accuracy decreases in this way, it is obvious that the utilization efficiency of the ignition light energy injected into the optical thyristor device will decrease, the ignition performance will deteriorate, and in severe cases, the thyristor element This brings about the disadvantage that the

(Objective) An object of the present invention is to eliminate the above-mentioned drawbacks, eliminate the relative optical axis misalignment between the optical (transmission) fiber and the light receiving part of the semiconductor substrate, and to It is an object of the present invention to provide a light direct ignition type thyristor device which can be accurately supported and fixed to a light receiving section of the device, and a method for manufacturing the same.

(Overview) In order to achieve the above object, the present invention provides a direct-ignition thyristor in which the optical output end of an optical fiber that transmits an optical signal to a light receiving part of a semiconductor substrate is fixed with a metal fitting. ,
Furthermore, the assembly whose outside is covered with an insulating cap is inserted into the window or opening ζ of the cathode electrode plate, so that the light output end of the optical fiber faces the light receiving part of the semiconductor substrate, and the inner wall surface of the window The present invention is characterized in that a suitable fixing ring is fitted into the gap between the outer peripheral surface of the insulating cap, thereby preventing relative movement between the assembly and the inner wall of the window.

(Example) Below, the features of the present invention will be explained in detail using specific examples.

FIG. 3 is a schematic exploded cross-sectional view showing individual parts to be attached to the optical output end of the optical (transmission) fiber according to the present invention, and FIGS. 4 and 5 are cross-sectional views showing the assembly process. It was,
Figure 5 (Well, assemble the individual parts shown in Figure 3 with precision.)
This is a schematic cross-sectional view after completion.

At the optical output end of the optical (transmission) fiber IOH, there is a metal fixture 1 for supporting and fixing the optical (transmission) fiber IOB.
1 is attached and tightened using metal cross-sections 2.

The metal fixture 11 is preferably made of a comparative material, such as aluminum, so as not to damage the optical fiber IOB. Alternatively, the effect of preventing damage to the optical fiber IOB can be similarly achieved by forming a plating film such as silver on a common metal such as copper.

Furthermore, since metal materials are used for this attachment part, the optical signal transmitted within the optical fiber is reflected at the contact point between the optical fiber and the metal part, making it possible to transmit the optical signal efficiently. The effects of this can be clearly seen.

In addition, these metal fixtures 11 and metal nuts 1
2 is held so as to be flush with the optical output end surface of the optical (transmission) fiber 10B. Therefore, if these assemblies are pressed as they are against the light receiving part of the semiconductor substrate 2,
This has the disadvantage that the semiconductor substrate 2 may be damaged.

In order to prevent the above-mentioned inconvenience, a flexible material (for example, Teflon) is placed so as to surround the metal fixture 11 and the nut 12, facing the optical output end of the optical (transmission) fiber 10B. A cap 13 made of thermoplastic resin (such as thermoplastic resin) is attached to the light output end.

With such a configuration Cζ, when operating the semiconductor device 1, the external 1! on the anode side and the cathode side! Even if the electrode plates 5 and 6 are pressed together from both sides, the semiconductor substrate 2 can be prevented from being damaged by the pressure of the optical fiber IOB, the metal fixture 11, and the nut 12.

In this embodiment, a g2 optical fiber 1011, a metal fixture 11, and a metal nut 1 are integrated as in the previous Hjr.
2 and the insulating cap 13 into the opening 16 of the cathode polar plate 4, as shown in FIG. (For example, made of Teflon) is inserted in advance.

In this state, the assembly is inserted into the opening 16 of the cathode electrode plate 4 as in the conventional example.

At this time, as is clear from the foregoing and as clearly shown in FIG.
A gap of a certain size is left between lζ and the outer peripheral surface.

Thereafter, in this embodiment, the fixing ring 14 is pushed into the gap once to fix the assembly so that it does not move relative to the opening 16.

The fixing ring 14 can be made of an insulating material such as synthetic resin (for example, Teflon) as described above, and its thickness is the same as the inner wall surface of the opening 16 and the outer periphery of the insulating camp 13. It must be selected according to the size of the gap created between the surface and the surface.

In this case, if the thickness of the fixing ring 14 is tapered so that the wall thickness increases upward from the lower end, the workability when inserting into the gap will be improved, and the insulating cap 13 can be securely fixed within the opening 16.

(Effects) As is clear from the above description, according to the present invention, the following effects are achieved.

(1) The optical output end of the optical fiber can be positioned with high precision (without deviation of the optical axis) with respect to the light receiving part of the semiconductor substrate, increasing the effective utilization rate of optical energy and improving the turn-on characteristics of the thyristor weight. However, the variation can be reduced.

(2) Since the gap between the outer peripheral surface of the insulating cap and the inner wall surface of the window or opening of the cathode electrode plate can be increased, assembly work is facilitated, and work efficiency can be increased.

(3) If the thickness of the Teflon ring is tapered,
The insertion work of the Teflon ring becomes easier, and the fixing of the insulating cap to the opening of the cathode electrode plate can be improved.

[Brief explanation of drawings]

Fig. 1 is a cross-sectional view of a general optical direct ignition type thyristor device suitable for applying the present invention, and Fig. 2 shows the main part of the optical fiber part of the conventional optical direct ignition type thyristor device. A sectional view, FIG. 3 is an exploded sectional view showing one embodiment of the present invention, and FIG.
5 and 5 are sectional views showing the assembly process of the embodiment of FIG. 3, and FIG. 6 is a sectional view of the embodiment of FIG. 3 after the assembly process is completed. 4... Cathode i [MM board, IOA,..., first optical fiber, IOB... second optical fiber, 11...
Metal fixing fittings, 12...Metal nuts, 13...
・Insulating cap, 14...Fixing ring, 16...
・Window (opening 1) Representative Patent Attorney Michihito Hiraki Figure 1 Figure 2

Claims (4)

[Claims] (1) A semiconductor substrate on which a photoacoustic arc type thyristor element having a light receiving portion is formed, an anode electrode plate and a cathode electrode plate disposed on both main surfaces of the semiconductor substrate, and the anode electrode plate and the cathode electrode. An anode-side external shield, an electrode plate, and a cathode-side external electrode plate arranged so as to sandwich the plate from both sides, the semiconductor substrate, an anode electrode plate, a cathode electrode plate, an anode-side external electrode plate a, and a cathode-side external electrode plate. an insulating seal surrounding the laminate, a metal flange hermetically fixed to the upper and lower end surfaces of the insulating seal, an anode-side external electrode plate, and a cathode-side external electrode plate, respectively, and one end of the metal flange hermetically passing through the insulating seal. an optical direct ignition type thyristor device, the other end of which has the semiconductor and an optical fiber disposed opposite to the light receiving portion of the body base, a fixing fitting fixed to the light output end of the optical fiber; an insulating cap fixed to an optical end thereof so as to cover the fixing metal fitting; and a cathode facing the light receiving part so that the assembly of the optical output end of the optical fiber, the fixing metal fitting, and the insulating cap is inserted. A direct light point comprising a window formed in a part of an electrode plate, and a fixing ring tightly inserted between an inner wall surface of the window and an outer peripheral surface of an insulating cap. Arc thyristor device. (2) The optical direct ignition type Zyristor device described in the patent, wherein the fixing ring is tapered so that the wall thickness increases upward from the lower end thereof. (3) A semiconductor substrate on which a photo-direct firing thyristor element having a light receiving portion is formed, an anode electrode plate and a cathode electrode plate disposed on both main surfaces of the semiconductor substrate, and the anode electrode plate and the cathode electrode. An anode-side external electrode plate and a cathode-side external electrode plate arranged to sandwich the plate from both sides; an insulating seal surrounding the laminate; a metal flange hermetically fixed to the upper and lower end surfaces of the insulating seal, an anode-side external electrode plate, and a cathode-side external electrode plate; one end of the metal flange hermetically passing through the insulating seal; , an optical direct ignition type thyristor device having an optical fiber whose other end is disposed opposite to the light receiving portion of the semiconductor substrate, the method comprising: a fixing metal fitting at the light output end of the optical fiber 7, and the fixing metal fitting. The optical output end of the optical fiber, the fixed metal plate, and the insulating cap assembly are attached to a part of the cathode electrode plate so as to face the light receiving part. Ii between the step of forming and inserting into the window and the inner wall surface of the AIJRe window and the outer diameter of the insulating cap of 1 m! Insert the illuminating ring, and position the leading end of the optical fiber 1 with respect to the light receiving part.
A method for manufacturing an optical direct ignition type device (J. (4) The method for manufacturing a light direct ignition type cyrisk device described in the patent, characterized in that the fixing ring is tapered such that the wall thickness increases upward from the lower end thereof. .