JPS60218477A - 無電解付着のための触媒化処理法 - Google Patents

無電解付着のための触媒化処理法

Info

Publication number
JPS60218477A
JPS60218477A JP2666285A JP2666285A JPS60218477A JP S60218477 A JPS60218477 A JP S60218477A JP 2666285 A JP2666285 A JP 2666285A JP 2666285 A JP2666285 A JP 2666285A JP S60218477 A JPS60218477 A JP S60218477A
Authority
JP
Japan
Prior art keywords
substrate
copper
plating
tin
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2666285A
Other languages
English (en)
Japanese (ja)
Inventor
ラツセル・ルイス・アバー
ウイルマ・ジーン・ホーカンス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS60218477A publication Critical patent/JPS60218477A/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2666285A 1984-04-11 1985-02-15 無電解付着のための触媒化処理法 Pending JPS60218477A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US59912084A 1984-04-11 1984-04-11
US599120 1984-04-11

Publications (1)

Publication Number Publication Date
JPS60218477A true JPS60218477A (ja) 1985-11-01

Family

ID=24398295

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2666285A Pending JPS60218477A (ja) 1984-04-11 1985-02-15 無電解付着のための触媒化処理法

Country Status (2)

Country Link
EP (1) EP0158890A3 (fr)
JP (1) JPS60218477A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6453538A (en) * 1987-08-25 1989-03-01 Matsushita Electric Industrial Co Ltd Manufacture of solid electrolytic capacitor

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4576685A (en) * 1985-04-23 1986-03-18 Schering Ag Process and apparatus for plating onto articles
GB2206128B (en) * 1987-06-23 1991-11-20 Glaverbel Copper mirrors and method of manufacturing same
US5227223A (en) * 1989-12-21 1993-07-13 Monsanto Company Fabricating metal articles from printed images
CN105671526B (zh) * 2016-01-22 2018-05-22 卓达新材料科技集团有限公司 一种镀金属膜的聚合物材料

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3011920A (en) * 1959-06-08 1961-12-05 Shipley Co Method of electroless deposition on a substrate and catalyst solution therefor
JPS518127A (ja) * 1974-07-12 1976-01-22 Hitachi Ltd Mudenkaimetsukyomaeshorieki
US4204013A (en) * 1978-10-20 1980-05-20 Oxy Metal Industries Corporation Method for treating polymeric substrates prior to plating employing accelerating composition containing an alkyl amine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6453538A (en) * 1987-08-25 1989-03-01 Matsushita Electric Industrial Co Ltd Manufacture of solid electrolytic capacitor

Also Published As

Publication number Publication date
EP0158890A3 (fr) 1986-10-08
EP0158890A2 (fr) 1985-10-23

Similar Documents

Publication Publication Date Title
US4478883A (en) Conditioning of a substrate for electroless direct bond plating in holes and on surfaces of a substrate
US4554182A (en) Method for conditioning a surface of a dielectric substrate for electroless plating
EP0156212B1 (fr) Procédé de dépôt de cuivre par voie chimique
EP0053279B1 (fr) Procédé de préparation d'un circuit imprimé
US9551073B2 (en) Method for depositing a first metallic layer onto non-conductive polymers
JP3337802B2 (ja) 酸化銅（ｉ）コロイドの金属化によるダイレクトプレーティング方法
JPH0247551B2 (fr)
CA1048707A (fr) Compose et methode de neutralisation et de sensibilisation des surfaces resineuses, et surfaces resineuses a sensibilite accrue a la metallisation par adherence
JP2001519477A (ja) ゴールド層を生じるための方法と溶液
JPS636628B2 (fr)
US4904506A (en) Copper deposition from electroless plating bath
JPS60218477A (ja) 無電解付着のための触媒化処理法
EP0163089B1 (fr) Procédé d'activation d'un substrat en vue du dépôt sans courant d'un métal conducteur
JPS60184683A (ja) 金属付着方法
GB2126608A (en) Electroless copper plating rate controller
EP0139233B1 (fr) Procédé pour le conditionnement de la surface d'un substrat diélectrique pour le placage sans courant
EP0079975B1 (fr) Colloide de cuivre et procédé pour l'activation des surfaces isolantes pour la galvanisation suivante
EP0228664B1 (fr) Bain de dépôt chimique de cuivre
JPH0499283A (ja) 触媒金属析出方法
WO1983001794A1 (fr) Colloide de cuivre et procede d'activation de surfaces isolantes pour effectuer ulterieurement une metallisation electrolytique
JPS634074A (ja) 無電解めつき用銅コロイド触媒液およびその製造方法
JPH0249547B2 (ja) Purintohaisenbannoseizohoho
JPH02310375A (ja) アルミニウム部材上への無電解銅めっき方法