JPS60236242A - Bonding method for adhesive tape - Google Patents

Bonding method for adhesive tape

Info

Publication number
JPS60236242A
JPS60236242A JP59093582A JP9358284A JPS60236242A JP S60236242 A JPS60236242 A JP S60236242A JP 59093582 A JP59093582 A JP 59093582A JP 9358284 A JP9358284 A JP 9358284A JP S60236242 A JPS60236242 A JP S60236242A
Authority
JP
Japan
Prior art keywords
adhesive tape
semiconductor substrate
air
substrate
air bubbles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59093582A
Other languages
Japanese (ja)
Inventor
Masahiro Kobayashi
正弘 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Yamagata Ltd
Original Assignee
NEC Yamagata Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Yamagata Ltd filed Critical NEC Yamagata Ltd
Priority to JP59093582A priority Critical patent/JPS60236242A/en
Publication of JPS60236242A publication Critical patent/JPS60236242A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy

Landscapes

  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE:To bond an adhesive tape on a semiconductor substrate without winding air bubbles by pressing an adhesive tape with a spherical elastic film. CONSTITUTION:Air is fed under the prescribed pressure from a high pressure air input unit 5 to expand an elastic film 7 in a spherical shape to press an adhesive tape 2 and to bond it to a semiconductor substrate 1. The bonding strength of the substrate 1 to the tape 2 can be regulated by regulating pneumatic pressure. The substrate 1 can be bonded from the central portion to preferably escape air bubbles.

Description

【発明の詳細な説明】 （産業上の利用分野） 本発明は、半導体基板に粘着テープを接着させる方法に
関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for adhering an adhesive tape to a semiconductor substrate.

（従来技術） 従来、半導体基板１と粘着テープ２を接着させる場合、
第１図及び第２図に示すようにゴムローラ３で印加する
か、円筒状のブロック４でプレスしている。(Prior Art) Conventionally, when bonding a semiconductor substrate 1 and an adhesive tape 2,
As shown in FIGS. 1 and 2, the pressure is applied using a rubber roller 3 or pressed using a cylindrical block 4.

しかしながら半導体基板１と粘着テープ２が平行に当た
ることから気泡の巻き込みが発生し易くなる。気泡を巻
き込んだｉｔ半導体基板ｌを分割または拡大すると、気
泡を巻き込んだ部分のチップ保持力が低下し、チップが
剥れ易くなる不都合があった。However, since the semiconductor substrate 1 and the adhesive tape 2 are in parallel contact with each other, air bubbles are likely to be trapped. When an IT semiconductor substrate l containing bubbles is divided or enlarged, the chip holding force of the portion containing the bubbles decreases, causing the problem that the chip is likely to peel off.

（発明が解決しようとする問題点） 本発明の目的は粘着テープを半導体基板に気泡を巻き込
むことなく張り付ける方法を提供することにある。(Problems to be Solved by the Invention) An object of the present invention is to provide a method for attaching an adhesive tape to a semiconductor substrate without entraining air bubbles.

（問題を解決する手段） 本発明は弾性膜の球面を利用し接触部分を点にすること
により気泡の巻き込みを少なくする粘着テープの張り付
は方法である。さらに弾性膜の球面を用いることにより
半導体基板の中央部分より接着させることが出来るため
気泡の逃げがよくなる。(Means for Solving the Problem) The present invention is a method of applying an adhesive tape that uses the spherical surface of an elastic membrane to make the contact area a point, thereby reducing the entrainment of air bubbles. Furthermore, by using the spherical surface of the elastic film, it is possible to bond from the center of the semiconductor substrate, which improves the escape of air bubbles.

（実施例） 以下に、本発明の実施例を図面を参照にしながらより詳
細に説明する。(Example) Hereinafter, an example of the present invention will be described in more detail with reference to the drawings.

第３図は本発明に係る張り付は装置である。本装置の高
圧空気導入部５より所定の圧力で空気を送り込み弾性膜
６を球面状にふくらませ粘着テープ２を押し下げて半導
体基板に張り付ける。半導体基板と粘着テープの接着力
は、空気の圧力を調節することくより加減出来る。FIG. 3 shows a pasting device according to the present invention. Air is sent in at a predetermined pressure from the high-pressure air introduction section 5 of this device to inflate the elastic membrane 6 into a spherical shape, and the adhesive tape 2 is pushed down and attached to the semiconductor substrate. The adhesive strength between the semiconductor substrate and the adhesive tape can be adjusted by adjusting the air pressure.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図及び第２図は従来から使用されている半導体基板
と粘着テープを張り付ける方法を説明する断面図、第３
図は、本発明の一実施例に係る張り付は方法を説明する
断面図である。 １・・・・・半導体基板、２・・・・・・粘着テープ、
７，８・・・・・・弾性膜固定用ブロック、９・・・・
・・固定用ステージ。 卒　１　Ｈ 荘Figures 1 and 2 are cross-sectional views illustrating the conventional method of attaching adhesive tape to a semiconductor substrate;
The figure is a sectional view illustrating a sticking method according to an embodiment of the present invention. 1...Semiconductor substrate, 2...Adhesive tape,
7, 8... Elastic membrane fixing block, 9...
・Fixation stage. Graduation 1 H So

Claims (1)

【特許請求の範囲】[Claims] 半導体基板に粘着テープを張り付ける時に、球面状の弾
性膜で粘着テープを押し付けることにより粘着テープを
半導体基板に張り付けることを特徴とする粘着テープ張
り付は方法。An adhesive tape attachment method is characterized in that when attaching an adhesive tape to a semiconductor substrate, the adhesive tape is attached to the semiconductor substrate by pressing the adhesive tape with a spherical elastic membrane.
JP59093582A 1984-05-10 1984-05-10 Bonding method for adhesive tape Pending JPS60236242A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59093582A JPS60236242A (en) 1984-05-10 1984-05-10 Bonding method for adhesive tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59093582A JPS60236242A (en) 1984-05-10 1984-05-10 Bonding method for adhesive tape

Publications (1)

Publication Number Publication Date
JPS60236242A true JPS60236242A (en) 1985-11-25

Family

ID=14086265

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59093582A Pending JPS60236242A (en) 1984-05-10 1984-05-10 Bonding method for adhesive tape

Country Status (1)

Country Link
JP (1) JPS60236242A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6393130A (en) * 1986-10-08 1988-04-23 Hitachi Ltd Jig for sticking wafer
WO2000025349A1 (en) * 1998-10-27 2000-05-04 Matsushita Electric Industrial Co., Ltd. Component affixing method and apparatus
US7901528B2 (en) * 2006-09-19 2011-03-08 Seiko Epson Corporation Method for manufacturing wiring substrate having sheet
JP2014058588A (en) * 2012-09-14 2014-04-03 Shin Etsu Polymer Co Ltd Method and device for tackily sticking film body
CN104934314A (en) * 2014-03-21 2015-09-23 鸿积科机股份有限公司 Adhesive film sticking device that can remove air bubbles
US20170243851A1 (en) * 2014-08-14 2017-08-24 Atv Technologie Gmbh Apparatus for especially thermally joining micro-electromechanical parts
CN112265688A (en) * 2020-11-18 2021-01-26 山西金圪达食品有限公司 Bowl filling and sealing production line

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6393130A (en) * 1986-10-08 1988-04-23 Hitachi Ltd Jig for sticking wafer
WO2000025349A1 (en) * 1998-10-27 2000-05-04 Matsushita Electric Industrial Co., Ltd. Component affixing method and apparatus
US6370750B1 (en) * 1998-10-27 2002-04-16 Matsushita Electric Industrial Co., Ltd. Component affixing method and apparatus
US7901528B2 (en) * 2006-09-19 2011-03-08 Seiko Epson Corporation Method for manufacturing wiring substrate having sheet
JP2014058588A (en) * 2012-09-14 2014-04-03 Shin Etsu Polymer Co Ltd Method and device for tackily sticking film body
CN104934314A (en) * 2014-03-21 2015-09-23 鸿积科机股份有限公司 Adhesive film sticking device that can remove air bubbles
US20170243851A1 (en) * 2014-08-14 2017-08-24 Atv Technologie Gmbh Apparatus for especially thermally joining micro-electromechanical parts
CN112265688A (en) * 2020-11-18 2021-01-26 山西金圪达食品有限公司 Bowl filling and sealing production line

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