JPS60244051A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS60244051A
JPS60244051A JP59101208A JP10120884A JPS60244051A JP S60244051 A JPS60244051 A JP S60244051A JP 59101208 A JP59101208 A JP 59101208A JP 10120884 A JP10120884 A JP 10120884A JP S60244051 A JPS60244051 A JP S60244051A
Authority
JP
Japan
Prior art keywords
base plate
case
reinforced material
aperture
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59101208A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0546702B2 (2
Inventor
Toshiaki Ito
利明 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP59101208A priority Critical patent/JPS60244051A/ja
Publication of JPS60244051A publication Critical patent/JPS60244051A/ja
Publication of JPH0546702B2 publication Critical patent/JPH0546702B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP59101208A 1984-05-17 1984-05-17 半導体装置 Granted JPS60244051A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59101208A JPS60244051A (ja) 1984-05-17 1984-05-17 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59101208A JPS60244051A (ja) 1984-05-17 1984-05-17 半導体装置

Publications (2)

Publication Number Publication Date
JPS60244051A true JPS60244051A (ja) 1985-12-03
JPH0546702B2 JPH0546702B2 (2) 1993-07-14

Family

ID=14294501

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59101208A Granted JPS60244051A (ja) 1984-05-17 1984-05-17 半導体装置

Country Status (1)

Country Link
JP (1) JPS60244051A (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63208253A (ja) * 1987-02-25 1988-08-29 Toshiba Corp 半導体回路装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63208253A (ja) * 1987-02-25 1988-08-29 Toshiba Corp 半導体回路装置

Also Published As

Publication number Publication date
JPH0546702B2 (2) 1993-07-14

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees