JPS60245155A - Plastic ic package - Google Patents

Abstract

PURPOSE:To readily and accurately mount a small-sized IC package by providing a projection on a plastic portion for enclosing an IC chip. CONSTITUTION:A projection 4 is formed at the mounting side of a plastic portion 3 for enclosing an IC chip 1. The number of the projections may be sufficient with two for the purpose of positioning, but in case of handling IC in the state before mounting, it becomes unstably with only two. Therefore, three or more are provided. In order to mount the plastic IC package thus constructed, a projection 4 is inserted into a positioning hole opened in advance at a printed board to be mounted, or positioned at the end of the projection 4 to the special position, leads 2 are soldered and mounted. In this case, a miniature IC can be readily and accurately mounted by using the IC package.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a plastic IC package, particularly an FP
(Flat Package), S OP (Small
l OutlinePackage), P L CC (
Plastic Leaded Chip Car-r
ier) and other small plastic IC packages.

[Prior art]

Conventionally, DIL (D
ual in Line Package), S I
L (Single 1nLine Package)
has been mainly used, and since the leads are directly inserted into the IC socket or the board when mounting this package, misalignment during mounting is not much of a problem.

However, in recent years, there has been a growing trend toward smaller packages in order to improve packaging density, and FP, SOP, PL
The use of small mini IC packages such as CCs is increasing.

Figures 1 to 6 show conventional small plastic IC packages, with Figure 1 being a cross-sectional view of an FP, Figure 2 being a perspective view thereof, Figure 3 being a cross-sectional view of an SOP, and Figure 4 being a perspective view thereof. 5 is a cross-sectional view of the PLCC, and FIG. 6 is a perspective view thereof. In the figures, (1) is an IC chip, and (2) is this I
The lead connecting to the C chip, (3) is the IC chip (1)
This is the plastic part that encases it. In the case of Pr-cc, an IC socket may be used to mount these IC packages, but in most cases, the leads (2) are soldered onto the board. In the latter case, positional deviation during mounting is a big problem, and the pitch between the leads (2) is also narrower than in conventional DIL and STL, so more accurate mounting is required.

[Summary of the invention]

This invention was made in order to meet the above-mentioned requirements.
By providing more than one protrusion, FP, SOP, P
The present invention provides a plastic IC package in which a small IC package such as an LCC can be easily and accurately mounted.

[Embodiments of the invention]

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

7 to 10 show embodiments of the present invention, and FIG.
The figure is a cross-sectional view of the FP, Figure 8 is a cross-sectional view of the SOP, Figure 9 is a perspective view thereof, and Figure 10 is a cross-sectional view of the PLCC. The same or equivalent parts as in Figure 6 are shown. (4) is a protrusion protruding toward the mounting side of the plastic part (3) surrounding the rc chip (1);
It is formed integrally with the plastic part (3). The shape of the protrusion (4) may be a pin shape that can be inserted into a positioning hole drilled in a printed circuit board to be mounted, or a pointed shape that can be aligned. In addition, since the purpose of the number of protrusions (4) is for alignment, two protrusions are sufficient to achieve the purpose, but two protrusions will result in an unstable condition when handling the IC before mounting. Provide three or more.

In a plastic IC package configured as described above, the protrusion is inserted into a positioning hole previously drilled on the printed circuit board to be mounted, or the tip of the protrusion is positioned at a specific position, and the leads (2 ) are soldered and mounted. In this case, by using the above plastic IC package, the mini IC can be easily and accurately mounted.

In the above description, the shape, -3=number, etc. of the protrusion (4) can be arbitrarily selected. Furthermore, the target plastic IC packages are not limited to FP, SOP, and PLCC, but can also be applied to other types.

〔Effect of the invention〕

According to the present invention, since the protrusion is provided on the plastic part surrounding the IC chip, it is possible to easily and accurately mount a small IC package.

[Brief explanation of the drawing]

Figures 1 to 6 show conventional small plastic IC packages, with Figure 1 being a cross-sectional view of an FP, Figure 2 being a perspective view thereof, Figure 3 being a cross-sectional view of an SOP, and Figure 4 being a perspective view thereof. 5 is a sectional view of the PLCC, FIG. 6 is a perspective view thereof, FIGS. 7 to 10 show embodiments of the present invention, FIG. 7 is a sectional view of the FP, and FIG. 8 is a sectional view of the SOP. 9 is a perspective view thereof, and FIG. 10 is a sectional view of the PLCC. In each figure, the same reference numerals indicate the same or corresponding parts, (1)
is an IC chip, (2) is a lead, (3) is a plastic part, and (4) is a protrusion. Agent Masuo Oiwa 4- Figure 7 Figure 8 Figure 9 Figure 1O Figure 291-

Claims (3)

[Claims] (1) A plastic IC package having a plastic part that encloses an IC chip, characterized in that the plastic part has three or more protrusions on the mounting side. (2) Plastic IC packages are FP and S. The plastic IC package according to claim 1, wherein the plastic IC package is P or PLCC. (3) The plastic IC package according to claim 1 or 2, wherein the protrusion is pin-shaped or pointed.