JPS60247489A - Laser beam machining equipment - Google Patents

Laser beam machining equipment

Info

Publication number
JPS60247489A
JPS60247489A JP59103672A JP10367284A JPS60247489A JP S60247489 A JPS60247489 A JP S60247489A JP 59103672 A JP59103672 A JP 59103672A JP 10367284 A JP10367284 A JP 10367284A JP S60247489 A JPS60247489 A JP S60247489A
Authority
JP
Japan
Prior art keywords
laser
workpiece
condenser lens
power
laser beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59103672A
Other languages
Japanese (ja)
Inventor
Masayuki Matsunaga
松永　正征
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP59103672A priority Critical patent/JPS60247489A/en
Publication of JPS60247489A publication Critical patent/JPS60247489A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/707—Auxiliary equipment for monitoring laser beam transmission optics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/705—Beam measuring devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To improve the measuring accuracy of a laser beam output, etc. by arranging a temp. sensor around a condenser lens and by measuring the temp. thereof. CONSTITUTION:Temperature sensors 26, 26a of thermocouples, etc. are arranged around a condenser lens 22 and the output end thereof is connected to a laser meter 27 which is on a control panel. a laser beam 15 is irradiated to the substance to be worked via the condenser lens 22, which absorbs a part of the laser power and the temp. is arisen in proportion to the absorption thereof. The absorption heat thereof is detected by the temp. sensors 26, 26a and converted and displayed by the laser power meter 27. The laser power at the time of machining can be thus measured continuously and correctly. If necessary the output of a laser oscillator can be correctly controlled as well.

Description

【発明の詳細な説明】 〔発明の技術分野〕 本発明は、レーザ光を用いて被加工物の切断、溶接、熱
処理等を行なうレーザ加工装置に関し、さらに詳しくは
、被加工物に照射されるレーザパワーを正確に測定する
ことのできるレーザ加工装置に関するものである。[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a laser processing device that performs cutting, welding, heat treatment, etc. of a workpiece using laser light, and more specifically, The present invention relates to a laser processing device that can accurately measure laser power.

〔従来技術〕[Prior art]

レーザ加工装置においては、被加工物に照射されるレー
ザ光のエネルギー（以下レーザパワーという）を測定し
、必要に応じてレーザ発振器の出力を制御することが要
求される。BACKGROUND ART Laser processing apparatuses are required to measure the energy of laser light irradiated onto a workpiece (hereinafter referred to as laser power) and to control the output of a laser oscillator as necessary.

従来のレーザ加工装置の一例を第２図に示す。An example of a conventional laser processing device is shown in FIG.

（１）けレーザ発振器で、容器（２）内Ｋｔｊレーザ媒
質体（２ａ）が設けられており、グロー放を咎によシ励
起する。＋３１．　（４１は光学基板で、中心部に部分
透過！　（７１のホルダで５１及び全反射鏡（８）のホ
ルタ”（６）を備えておシ、容器（２）との間にマイク
ロメータ（９ａ）〜（９ｄ）が介装されていて、手動で
部分透過鏡（７）及び全反射鏡（８）の位置を移動させ
ることにより、レーザ発振器（１１の出力ｆｇＭＩ整す
ることができる。ａＩＣｌｌ）け容器（２）と光学基板
（３）、（４）との間に介装されたベローズである。(1) A laser oscillator is provided with a Ktj laser medium (2a) inside a container (2) and is excited to emit a glow. +31. (41 is an optical board, which partially transmits light in the center! (The holder 71 is equipped with a holster (6) for 51 and a total reflection mirror (8), and a micrometer (9a) is installed between it and the container (2). ) to (9d) are interposed, and the output fgMI of the laser oscillator (11) can be adjusted by manually moving the positions of the partially transmitting mirror (7) and the total reflecting mirror (8).aICll) This is a bellows interposed between the storage container (2) and the optical substrates (3) and (4).

（１２１はレーザ発振器（１）の出口側に近接して、レ
ーザ光（Ｉ３１の光路中に設けたチョッパ一式パワーモ
ニタで、第６図に示すよう忙モータａ３に駆動されて間
欠的にレーザ光（１５１の一部を取出し、レーザ出力セ
ンサａａによルレーザパワーを測定する。（２ａｔ；を
加加工ヘッド、■は集光レンズ、（ハ）はノズル、（財
）は被加工物、（２５１ｔｄレーザ光（ＨＪの光路を変
更するペンドミラーである。(121 is a chopper set power monitor installed in the optical path of the laser beam (I31) close to the exit side of the laser oscillator (1), and is driven by the busy motor a3 as shown in Fig. (Take out a part of 151 and measure the laser power with the laser output sensor aa. 251td laser beam (it is a pend mirror that changes the optical path of HJ).

上記のように構成したレーザ加工装置において、レーザ
媒質体（２ａ）が励起されると、全反射鏡（８）と部分
透過鏡（７）との間でレーザ発振が起シ、レーザ発振器
（１）の出力側からレーザ光（１９を出力する。このレ
ーザ光（１９はペンドミラー（ハ）で光路を変更し、集
光レンズ（涛で集光され、ノズル（２）から被加工物（
２４）に照射されて被加工物（２）を加工する。一方、
チョッパ一式パワーモニタ０２によって取出されたレー
ザ光（１９の一部は、レーザ出力センサ（Ｉ４）によっ
て測定され、必要紀元じてレーザ発振器（１）の出力を
制御する。In the laser processing apparatus configured as described above, when the laser medium (2a) is excited, laser oscillation occurs between the total reflection mirror (8) and the partial transmission mirror (7), and the laser oscillator (1 A laser beam (19) is output from the output side of the laser beam (19). This laser beam (19) changes its optical path with a pend mirror (c), is focused by a condensing lens (wave), and is sent from the nozzle (2) to the workpiece (
24) to process the workpiece (2). on the other hand,
A part of the laser light (19) taken out by the chopper set power monitor 02 is measured by a laser output sensor (I4), and the output of the laser oscillator (1) is controlled as needed.

ところで、上記のように構成したレーザ加工装ｇｔにお
いては、チョッパ一式パワーモニタ（１２１１−ｉレー
ザ発振器（３１７７（近接して設けられておシ、レーザ
発振器（１１の出口のレーザパワーを測定しているが、
レーザパワーは、レーザ発振器（１１から被加工物（２
）Ｋ達するまでの間に、減衰その他の理由によシ若干低
下するため、レーザ出力センサ（■による測定値と、実
際に被加工物■に照射されるレーザパワーとは一致しな
い。このため、被加工物（２黴に照射されるレーザパワ
ーを正確に測定することができず、したがってレーザ発
振器（１）の出力の制御も確実に行なうことができない
。さらに、レーザ光（１９の光路中にその一部を取出す
チョッパ一式パワーモニタα２を設けるため、構造が複
雑になる等、多くの欠点があった。By the way, in the laser processing equipment gt configured as described above, a chopper set power monitor (1211-i laser oscillator (3177) is installed nearby, and a laser oscillator (11) that measures the laser power at the exit of There are, but
The laser power is from the laser oscillator (11) to the workpiece (2
) Before reaching K, the value decreases slightly due to attenuation and other reasons, so the measured value by the laser output sensor (■) does not match the laser power actually irradiated to the workpiece (■).For this reason, It is not possible to accurately measure the laser power irradiated onto the workpiece (2), and therefore it is not possible to reliably control the output of the laser oscillator (1). Since the chopper set power monitor α2 is provided to take out a portion of the power, there are many drawbacks such as a complicated structure.

また、レーザ加工装置の非加工時に、集光レンズ＠の付
近で熱量計によ）手動で、かつ間欠的にレーザパワーを
測定することも行なわれているが、加工時に測定できな
いこと、連続的に？１１１１定できないこと、その都度
手動で測定しなければならないのできわめて面倒である
こと等もあり、これまた実際の加工時忙おける正確なレ
ーザパワーを連続的かつ正確に測定できないという欠点
がある。In addition, when the laser processing equipment is not processing, the laser power is measured manually and intermittently (with a calorimeter near the condenser lens @), but it is difficult to measure the laser power continuously during processing. To? 1111 cannot be determined, and it is extremely troublesome to manually measure each time. Also, there is a drawback that accurate laser power cannot be measured continuously and accurately during actual processing.

〔発明の概要〕[Summary of the invention]

本発明は、集光レンズにレーザ光が照射されると、一部
のレーザパワーが吸収されて集光レンズの温度が上昇す
るが、この温度上昇は照射されたレーザパワーに比例す
ることを利用し、集光レンズの温度を温度センサで連続
的に検出してパワーメータで指示させることにより、被
加工物に最も近い位置で加工に寄与するレーザパワーを
測定するようにしたレーザ加工装置を提供するものであ
る。The present invention utilizes the fact that when a condenser lens is irradiated with a laser beam, part of the laser power is absorbed and the temperature of the condenser lens increases, and this temperature increase is proportional to the irradiated laser power. We provide a laser processing device that measures the laser power that contributes to processing at the position closest to the workpiece by continuously detecting the temperature of the condensing lens with a temperature sensor and instructing it with a power meter. It is something to do.

〔発明の実施例〕[Embodiments of the invention]

第１図は本発明実施例の要部を示す縦断面図である。な
お、第２図と同−又は相当部分には同じ符号を付し、説
明を省略する。（ハ）ν　（２６ａ）は集光レンズりの
周囲に設けた熱電対の如き温度センサで、その出力端は
操作盤（図示せず〕に設けたパワーメータ（２７）Ｋ接
続されている。FIG. 1 is a longitudinal sectional view showing the main parts of an embodiment of the present invention. Note that the same or equivalent parts as in FIG. 2 are denoted by the same reference numerals, and the explanation thereof will be omitted. (c) ν (26a) is a temperature sensor such as a thermocouple provided around the condenser lens, and its output end is connected to a power meter (27) K provided on an operation panel (not shown).

このようなレーザ加工装置においては、第２図の従来装
置と同様に、レーザ発振器（１）からのレーザ光（＋５
１をペンドミラー四、集光レンズ四を介して被加工物ｃ
！４に照射し、被加工物（２）の切断、溶接、熱処理等
を行なう。このとき、レーザ光（１５１が照射された集
光レンズのはレーザパワーの一部を吸収し、レーザパワ
ーに比例して温度が上昇する。この吸収熱を温度センサ
（４）、（２６ａ）で検出し、ノくワーメータ（ロ）で
レーザパワーに換算して表示させれば、加工時のレーザ
パワーを連続的に測定することができる。また必要に応
じてレーザ発振器（Ｊ＋の出力を制御することもできる
。In such a laser processing device, the laser beam (+5
1 to the workpiece c through the pend mirror 4 and the condensing lens 4.
! 4, and the workpiece (2) is subjected to cutting, welding, heat treatment, etc. At this time, the condensing lens irradiated with the laser beam (151) absorbs a part of the laser power, and the temperature rises in proportion to the laser power.This absorbed heat is detected by the temperature sensors (4) and (26a). By detecting the power and converting it to laser power and displaying it using a power meter (b), the laser power during processing can be continuously measured.Also, if necessary, the output of the laser oscillator (J+) can be controlled. You can also do that.

上記の説明では、温度センサとして熱電対を使用した場
合を示したが、サーミスタその他の温度センサを用いて
もよいことは云う迄もない。また集光レンズの周囲の２
ケ所に温度センサを配置した例を示したが、１か所でも
よくあるいは６か所以上設けてもよい。In the above description, a thermocouple is used as the temperature sensor, but it goes without saying that a thermistor or other temperature sensor may also be used. Also, the two around the condenser lens
Although an example has been shown in which temperature sensors are arranged at two locations, the temperature sensors may be provided at one location or at six or more locations.

〔発明の効果〕〔Effect of the invention〕

本発明は、上記のように被加工物の加工に寄与するレー
ザパワーの最近傍に設けられ、レーザパワーの一部を吸
収して温度上昇する集光レンズの温度を測定することに
よシ、加工中に被加工物に照射されるレーザパワーを連
続的に測定するよう圧したもので、構造が簡単で加工中
に被加工物に照射されるレーザパワーを正確に測定する
ことができ、必要に応じてレーザ発振器の出力を正確に
制御することができる等、実施による効果大である。As described above, the present invention measures the temperature of the condensing lens, which is installed closest to the laser power that contributes to the processing of the workpiece and which absorbs a part of the laser power and rises in temperature. This is a pressurized device that continuously measures the laser power irradiated to the workpiece during processing.It has a simple structure and can accurately measure the laser power irradiated to the workpiece during processing. Implementation has great effects, such as being able to accurately control the output of the laser oscillator depending on the situation.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本発明実施例の要部断面図、第２図は従来のレ
ーザ加工装置の一例の構成図、第６図はそのチョッパ式
パワーモニタ部分の断面図である。 （１）・・・レーザ発振器、（２Ｉ）・・・加工ヘッド
、（２）・・・集光レンズ、（至）・・・被加工物、１
２ｆｊ）、（２６ａ）・・・温度センサ、（２）・・・
パワーメータ。 なお、図中同一符号は同−又は相当部分を示すものとす
る。 代理人　弁理士　木　村　三　朗 １　図FIG. 1 is a sectional view of a main part of an embodiment of the present invention, FIG. 2 is a configuration diagram of an example of a conventional laser processing apparatus, and FIG. 6 is a sectional view of a chopper type power monitor portion thereof. (1)...Laser oscillator, (2I)...Processing head, (2)...Condensing lens, (to)...Workpiece, 1
2fj), (26a)...Temperature sensor, (2)...
power meter. Note that the same reference numerals in the figures indicate the same or equivalent parts. Agent Patent Attorney Sanro Kimura 1 Figure

Claims (2)

【特許請求の範囲】[Claims] （１）レーザ発振器からのレーザ光を集光レンズを介し
て被加工物に照射し該被加工物を加工するものにおいて
、前記集光レンズの周囲に温度センサを内Ｃ設し、蚊集
光し′ンズの温度を測定することＫよル前記被加工物に
照射されるレーザパワーを測定することを特徴とするレ
ーザ加工装置。(1) In a device that processes a workpiece by irradiating the workpiece with laser light from a laser oscillator through a condenser lens, a temperature sensor is installed around the condenser lens to condense mosquito light. A laser processing apparatus characterized in that the temperature of the laser lens is measured and the laser power irradiated onto the workpiece is measured. （２）ＰｔＩ記温度センサに熱雷対を用いてなる特許請
求の範囲第１項記載のレーザ加工装置。(2) The laser processing apparatus according to claim 1, wherein a thermal lightning pair is used as the PtI temperature sensor.
JP59103672A 1984-05-24 1984-05-24 Laser beam machining equipment Pending JPS60247489A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59103672A JPS60247489A (en) 1984-05-24 1984-05-24 Laser beam machining equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59103672A JPS60247489A (en) 1984-05-24 1984-05-24 Laser beam machining equipment

Publications (1)

Publication Number Publication Date
JPS60247489A true JPS60247489A (en) 1985-12-07

Family

ID=14360279

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59103672A Pending JPS60247489A (en) 1984-05-24 1984-05-24 Laser beam machining equipment

Country Status (1)

Country Link
JP (1) JPS60247489A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62139374A (en) * 1985-12-13 1987-06-23 Matsushita Electric Ind Co Ltd Laser device
FR2698495A1 (en) * 1992-11-23 1994-05-27 Aerospatiale Laser focusing lens monitor system - has temp monitors around outside of lens with comparators having expected levels and alarm.
JPH0751870A (en) * 1993-08-18 1995-02-28 Mitsubishi Electric Corp Laser processing equipment
US20130341309A1 (en) * 2011-04-08 2013-12-26 Mitsubishi Electric Corporation Laser machining device
JP2014524839A (en) * 2011-06-29 2014-09-25 トルンプフ ヴェルクツォイクマシーネン ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディートゲゼルシャフト Optical element of material processing machine using laser, laser processing head provided with optical element, and method of operating material processing machine using laser

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62139374A (en) * 1985-12-13 1987-06-23 Matsushita Electric Ind Co Ltd Laser device
FR2698495A1 (en) * 1992-11-23 1994-05-27 Aerospatiale Laser focusing lens monitor system - has temp monitors around outside of lens with comparators having expected levels and alarm.
JPH0751870A (en) * 1993-08-18 1995-02-28 Mitsubishi Electric Corp Laser processing equipment
US20130341309A1 (en) * 2011-04-08 2013-12-26 Mitsubishi Electric Corporation Laser machining device
US9289850B2 (en) * 2011-04-08 2016-03-22 Mitsubishi Electric Corporation Laser machining device
JP2014524839A (en) * 2011-06-29 2014-09-25 トルンプフ ヴェルクツォイクマシーネン ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディートゲゼルシャフト Optical element of material processing machine using laser, laser processing head provided with optical element, and method of operating material processing machine using laser

Similar Documents

Publication Publication Date Title
US6837109B2 (en) Material thickness measurement method and apparatus
JP2753284B2 (en) Workpiece processing equipment
US20080165814A1 (en) Pulse oscillating type solid laser unit and laser process unit
JP7504743B2 (en) Method for detecting the operating state of an optical element arranged along the propagation path of a laser beam of a machine for processing materials, a system for carrying out said method, and a laser processing machine equipped with said system
JP6367194B2 (en) Workpiece processing apparatus using laser beam
US20180266967A1 (en) Optical test apparatus
JPH11101632A (en) Ultrasonic measuring device
JPS60247489A (en) Laser beam machining equipment
JP2002257793A (en) Laser ultrasonic inspection equipment
KR880008417A (en) Method and apparatus for measuring ion implantation dose of semiconductor crystals
US5172392A (en) Apparatus for the analysis in continuous mode and in impulse mode of the distribution of energy within a power laser beam and the alignment of this latter
EP3939737A1 (en) Laser processing device
JP2602711B2 (en) Optical system thermal deformation control device and operation method thereof
US5523837A (en) Beam stealer laser power meter
JPS5584287A (en) Laser working apparatus
EP1166064A1 (en) Integrated diagnostic system for photoelastic modulator
JPS6066737A (en) Laser irradiating apparatus
JP3277669B2 (en) Semiconductor manufacturing equipment
JPS63206644A (en) Thermocouple laser calorimetry method
SU1570476A1 (en) Method of determining thermal diffusivity of metals and semiconductors
SU1093952A1 (en) Method and device for measuring light absorption coefficient
JP3157070B2 (en) Thermal processing method of metal material by pulse YAG laser
Kronfeldt Piezo-enhanced multireflection cells applied for in-situ measurements of trace-gas concentrations
JP2013253918A (en) Size correction quantity acquisition device, size correction quantity calculation method and processing device for workpiece
RU1382162C (en) Method of measuring time of scillating relaxation of gas