JPS60247902A - Current limiting resistance element - Google Patents
Current limiting resistance elementInfo
- Publication number
- JPS60247902A JPS60247902A JP59103623A JP10362384A JPS60247902A JP S60247902 A JPS60247902 A JP S60247902A JP 59103623 A JP59103623 A JP 59103623A JP 10362384 A JP10362384 A JP 10362384A JP S60247902 A JPS60247902 A JP S60247902A
- Authority
- JP
- Japan
- Prior art keywords
- current limiting
- resistance
- pto
- current
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Non-Adjustable Resistors (AREA)
- Thermistors And Varistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 〔発明の技術分野〕 本発明は過大電流を限流する限流抵抗素子に関する。[Detailed description of the invention] [Technical field of invention] The present invention relates to a current limiting resistance element that limits excessive current.
電気回路、特に大容量受電設備回路においては、事故時
の過大電流から電気回路を保護するために、電流しゃ断
のための限流器及び電圧しゃ断器が直列にそう人されて
いる。BACKGROUND ART In electrical circuits, particularly in large-capacity power receiving equipment circuits, a current limiter and a voltage breaker are connected in series to interrupt the current in order to protect the electrical circuit from excessive current in the event of an accident.
自己回復型の限流抵抗素子としては、一般に正温度係数
を有する抵抗体、いわゆるPTO材料が用いられている
。これらPTO材料としては、ナトリウム、カリウムな
どのアルカリ金属及びこれらの合金、鉛、すす、水銀、
純鉄及び半導体化したチタン酸バリウム等のセラミック
材料などがある。As a self-healing type current limiting resistance element, a resistor having a positive temperature coefficient, a so-called PTO material, is generally used. These PTO materials include alkali metals such as sodium and potassium and their alloys, lead, soot, mercury,
Examples include ceramic materials such as pure iron and semiconducting barium titanate.
鉛、すすは過大電流による発熱・温度上昇によって金属
が融解する時に比抵抗が約2倍となる。The specific resistance of lead and soot approximately doubles when the metal melts due to heat generation and temperature rise due to excessive current.
この比抵抗の上昇を利用するものである。This increase in specific resistance is utilized.
アルカリ金属及び水銀は、これら金属の沸点が低いため
、自己発熱によシ気化した時の比抵抗の急上昇を利用し
たものである。Since alkali metals and mercury have low boiling points, the rapid increase in specific resistance when vaporized by self-heating is utilized.
純鉄は、比抵抗の温度係数が比較的大きいことを利用す
るものである。Pure iron utilizes the fact that it has a relatively large temperature coefficient of resistivity.
半導体化したチタン酸バリウムは、キー−り一点近傍か
ら比抵抗が急上昇するいわゆるPTO効果を示す。この
現象を限流素子として利用しようとするものである。Barium titanate that has been converted into a semiconductor exhibits the so-called PTO effect in which the resistivity rapidly increases from the vicinity of one point on the key. The aim is to utilize this phenomenon as a current limiting element.
しかし、鉛、すすでは比抵抗の変化が上述のように約2
倍と小さく、純鉄でも高々10倍と限流素子として不十
分な変化しか得られないという欠点があった。However, for lead and soot, the change in resistivity is approximately 2
The drawback was that even pure iron could only provide an insufficient change as a current limiting element, at most 10 times as small.
アルカリ金属及び水銀は、気化による比抵抗の上昇を用
いるため比抵抗の変化としては十分であるが、これら金
属はよく知られているように非常に活性が高く、限流素
子を製造する際に完全な不活性雰囲気中で作業しなけれ
ばならないことや、限流素子の気密性を高めるなど取扱
が困難であるという欠点があった。Alkali metals and mercury use the increase in resistivity caused by vaporization, which is sufficient to change the resistivity, but as is well known, these metals are very active and are difficult to use when manufacturing current limiting elements. The drawbacks are that the work must be done in a completely inert atmosphere and that the current limiting element is difficult to handle, such as by increasing its airtightness.
半導体化したチタン酸ノ(リウムでは、約120℃付近
のキー IJ一点近傍から比抵抗が約5桁変化し、限流
素子として十分な変化が得られているが、セラミックス
であるため過大電流印加による熱衝撃に弱く、素子が破
壊するという欠点があった。In the case of semiconducting titanium oxide, the resistivity changes by about 5 orders of magnitude from the vicinity of the key IJ point at around 120°C, which is sufficient for a current limiting element, but because it is made of ceramic, excessive current is applied. It has the disadvantage that it is vulnerable to thermal shock due to heat, and the element can be destroyed.
この破壊は層状破壊であり、本発明者らは素子内の電流
軸方向に大きな温度分布を生じるため、このような層状
破壊がおこるということをみいだした。This destruction is laminar destruction, and the present inventors have found that such laminar destruction occurs because a large temperature distribution occurs in the current axis direction within the element.
本発明は以上の点を考慮してなされたもので、耐熱衝撃
性に優れた限流抵抗素子を提供することを目的とする。The present invention has been made in consideration of the above points, and an object of the present invention is to provide a current limiting resistance element with excellent thermal shock resistance.
。
〔発明の概要〕
本発明者らは、セラミックスPTO素子の通電による自
己発熱で生ずる温度分布など熱的動特性を検討した結果
、セラミックス部分を薄くシ、金属による放熱効果を加
味して交互に積層して素子を形成することが有効である
ことを見い出した。. [Summary of the Invention] As a result of studying the thermal dynamic characteristics such as temperature distribution caused by self-heating due to energization of a ceramic PTO element, the present inventors made the ceramic part thin and layered them alternately, taking into account the heat dissipation effect of metal. We have found that it is effective to form an element by
すなわち本発明は、正温度係数を有するセラミック抵抗
体層(セラミックスPTO素子〕と金属層とを交互に積
層して形成することを特徴とする限流抵抗素子である。That is, the present invention is a current-limiting resistance element characterized in that it is formed by alternately laminating ceramic resistor layers (ceramic PTO element) having a positive temperature coefficient and metal layers.
このような構成をとることによシ、素子全体がほぼ均一
な温度状態に保たれ、前述のような通電時の層状破壊が
防止される。By adopting such a configuration, the entire element can be maintained at a substantially uniform temperature, and the layer breakdown during energization as described above can be prevented.
又、一般にセラミックスPTO材料は、抵抗値が100
Ω・α程度と高く、シゃ断器として用いた場合、7プト
ロスが大きくなってしまうが、このように金属層を介入
させたことによシ、素子としての抵抗値がさがり、ワッ
トロスも少なくなる。Additionally, ceramic PTO materials generally have a resistance value of 100
The resistance is as high as Ω・α, and when used as a breaker, the 7pt loss will be large, but by intervening the metal layer in this way, the resistance value as an element is lowered, and the watt loss is also reduced. Become.
本発明における正温度係数を有するセラミックス抵抗体
層に用いられるセラミックスPTO材料としては、チタ
ン酸バリウム(BaTiOa)を主成分とし、La10
3 * 0102 + G d@ 01 T NJ O
s +V、O,等を添加して半導体化したもの、すなわ
ち組成で、
(Ba、−xXx)(Ti1 、Yy)O,+z−Z(
X=La、Oe、Sr、、Pb、Gd、Os Y=8n
、Zr。The ceramic PTO material used for the ceramic resistor layer having a positive temperature coefficient in the present invention contains barium titanate (BaTiOa) as a main component, and La10
3 * 0102 + G d@ 01 T NJ O
s + V, O, etc. are added to make a semiconductor, that is, the composition is (Ba, -xXx) (Ti1, Yy) O, +z - Z (
X=La, Oe, Sr, , Pb, Gd, Os Y=8n
, Zr.
Nb、V、 z=Ag、o 、At、o3.8 io、
O<x+ y + z <0.Oi )
と表わされる。一般にPTOセラミックとして知られて
いるものは、いずれも用いることができる。Nb, V, z=Ag, o, At, o3.8 io,
O<x+y+z<0. Oi). Any of those generally known as PTO ceramics can be used.
金属層としては、銅、鉄、アルミニウム等各種のものを
用いることができるが、放熱性、電気抵抗値を考慮する
と銅板を用いることが好ましい。Various materials such as copper, iron, and aluminum can be used as the metal layer, but in consideration of heat dissipation and electrical resistance, it is preferable to use a copper plate.
各層の厚みは適宜設定できるが、セラミックス抵抗体層
があまり厚いと金属層介入の効果があられれないため、
500μ陽以下の厚みとすることが好ましい。又、薄い
とPTO特性に問題が生じ、50μ島以上であることが
好ましい。The thickness of each layer can be set appropriately, but if the ceramic resistor layer is too thick, the effect of metal layer intervention will not be achieved.
The thickness is preferably 500 μm or less. Furthermore, if the thickness is too thin, problems will occur in the PTO characteristics, so it is preferable that the thickness is 50 μm or more.
金属層は特に厚みは関係しないが、100μ島以上程度
の厚み奄有すれば十分に効果を発揮する。Although the thickness of the metal layer does not particularly matter, a thickness of approximately 100 μm or more will provide sufficient effects.
本発明における積層は何層重ねてもよいが、積層する際
、セラミックス抵抗体層と金属層との電気的接続を良好
とするために1セラミックス抵抗体層の両主面には、I
n−Ga、Ag、Ni等の電極層を無電解メッキ法塗布
法あるいはペースト印刷法等の通常のセラミックスへの
電極取着法により形成しておくことが好ましい。In the present invention, any number of layers may be laminated, but in order to improve the electrical connection between the ceramic resistor layer and the metal layer, I
It is preferable to form an electrode layer of n-Ga, Ag, Ni, etc. by a conventional method for attaching electrodes to ceramics, such as an electroless plating coating method or a paste printing method.
本発明によれば、素子抵抗が小さくワットロスの小さな
限流抵抗素子を得ることができ、過大電流印加による耐
熱衝撃性を向上させることができる。According to the present invention, it is possible to obtain a current limiting resistance element with low element resistance and low watt loss, and it is possible to improve thermal shock resistance due to excessive current application.
〔発明の実施例〕 以下、本発明を実施例を説明する。[Embodiments of the invention] Hereinafter, the present invention will be explained with reference to examples.
まず、セラミックス正温度係数抵抗体としてチタン酸バ
リウム系の材料を作成した。基本成分であるチタン酸バ
リウムセリウム(Ba 1−xoex)Tie、になる
ように炭酸バリウム、酸化セリウム酸化チタンを秤量し
、ボールミルにより湿式混合粉砕する。次にこれらを乾
燥後1100℃で1時間仮焼し、再びボールミルによシ
粉砕し調合粉末とする。これに有機物バインダを加え混
練し、ドクターブレード法によって焼土が9100μ腸
になるような薄板を形成する。乾燥後この薄板を130
0〜1400℃1時間焼成し、PTO薄板を得る。この
PTO薄板の両面にInGa電極を塗布し、次に100
μ簿の銅板を積層する。このPTO薄板と銅板とを例え
ば夫々10枚、11枚1nGaをはさんで積層する。こ
こで銅板には1nGa電極を塗布していないが、銅板に
も塗布してもよい。また薄板の形成はドクターブレード
によったが、比較的厚い焼成体を研摩又は切断すること
により得てもよい。First, a barium titanate-based material was created as a ceramic positive temperature coefficient resistor. Barium carbonate, cerium oxide, and titanium oxide are weighed to form the basic component barium cerium titanate (Ba 1-xoex) Tie, and are wet mixed and pulverized using a ball mill. Next, these are dried, calcined at 1100° C. for 1 hour, and ground again in a ball mill to obtain a blended powder. An organic binder is added to this and kneaded, and a thin plate of baked clay having a size of 9100 μm is formed using a doctor blade method. After drying, this thin plate was
Fired at 0 to 1400°C for 1 hour to obtain a PTO thin plate. InGa electrodes were applied to both sides of this PTO thin plate, and then 100%
Laminate the copper plates of μ book. These PTO thin plates and copper plates are stacked, for example, with 10 and 11 sheets of 1 nGa sandwiched therebetween, respectively. Although the 1nGa electrode is not applied to the copper plate here, it may be applied to the copper plate as well. Furthermore, although the thin plate was formed using a doctor blade, it may also be obtained by grinding or cutting a relatively thick fired body.
この積層体の両端の銅板の両端面に、電極層を設は限流
抵抗素子とする。Electrode layers are provided on both end surfaces of the copper plates at both ends of this laminate to serve as current-limiting resistance elements.
第1図は素子断面の断面図であり、素子両端面A、Bは
それぞれ電極として働く。薄板PTO特性を示すセラミ
ックス抵抗層(1)は、電極層(2)を介して銅板(3
)と接合している。なお端子は、素子両端面A、Bから
直接数9出せばよい。FIG. 1 is a cross-sectional view of the element, and both end faces A and B of the element each serve as electrodes. A ceramic resistance layer (1) exhibiting thin plate PTO characteristics is connected to a copper plate (3) via an electrode layer (2).
). Note that the terminals may be provided directly from both end faces A and B of the element.
こうして得られ、た限流抵抗素子の抵抗値は約0゜3Ω
で、温度変化は第1図に示す通りであった。The resistance value of the current limiting resistor element obtained in this way is approximately 0°3Ω.
The temperature change was as shown in FIG.
本限流抵抗素子に10OAの電流を投入したところ、割
れやはがれを生じることなく十分な限流効果が得られた
。一方、比較例として金属層を介さないチタン酸バリウ
ムのみのPTO素子では、約10Ωの抵抗であり、同一
電流を投入したところ、電流軸に垂直な方向に多数の割
れを生じた。When a current of 10 OA was applied to this current limiting resistor element, a sufficient current limiting effect was obtained without cracking or peeling. On the other hand, as a comparative example, a PTO element made only of barium titanate without a metal layer had a resistance of about 10Ω, and when the same current was applied, many cracks occurred in the direction perpendicular to the current axis.
以上のように1本発明による限流抵抗素子は常温での素
子抵抗が低く、ワットロスを小さくすることができる。As described above, the current limiting resistor element according to the present invention has a low element resistance at room temperature and can reduce watt loss.
また過大電流が流れた時に1素子全体がジーール熱によ
り均一に温度上昇するため耐熱衝撃性も向上させること
ができる。Furthermore, when an excessive current flows, the temperature of the entire element rises uniformly due to Zeel heat, so that thermal shock resistance can also be improved.
第1図は本発明素子の構成を示す断面図、第2図は抵抗
温度特性図。FIG. 1 is a sectional view showing the structure of the device of the present invention, and FIG. 2 is a resistance temperature characteristic diagram.
Claims (1)
れていることを特徴とする限流抵抗素子。A current limiting resistance element characterized in that ceramic PTO resistor layers and metal layers are alternately laminated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59103623A JPS60247902A (en) | 1984-05-24 | 1984-05-24 | Current limiting resistance element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59103623A JPS60247902A (en) | 1984-05-24 | 1984-05-24 | Current limiting resistance element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60247902A true JPS60247902A (en) | 1985-12-07 |
Family
ID=14358892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59103623A Pending JPS60247902A (en) | 1984-05-24 | 1984-05-24 | Current limiting resistance element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60247902A (en) |
-
1984
- 1984-05-24 JP JP59103623A patent/JPS60247902A/en active Pending
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