JPS6025108A - Method of producing insulated conductor - Google Patents
Method of producing insulated conductorInfo
- Publication number
- JPS6025108A JPS6025108A JP13194883A JP13194883A JPS6025108A JP S6025108 A JPS6025108 A JP S6025108A JP 13194883 A JP13194883 A JP 13194883A JP 13194883 A JP13194883 A JP 13194883A JP S6025108 A JPS6025108 A JP S6025108A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- insulating
- resin
- insulating layer
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- Processes Specially Adapted For Manufacturing Cables (AREA)
- Manufacturing Of Electric Cables (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は絶縁層内に樹脂未含浸部を残さない含浸方式の
絶縁導体の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method for manufacturing an insulated conductor using an impregnation method that leaves no resin-unimpregnated portion in an insulating layer.
従来から含浸方式による絶縁導体の製造方法は行なわれ
ている。しかし、含浸方式は樹脂によシ、絶縁テープを
複数層巻回した請縁層の空隙を埋める方式であるため、
万一、この空隙部まで樹脂が到達しないと、空隙を含ん
だ絶縁導体となり、この絶縁導体で電気機器の巻線を形
成し運転する場合、前記空隙のために放′1劣化、吸湿
による劣化、熱劣化、応力集中に基く機械的ストレスに
よる劣化などが起き易い欠点があった。従って、含浸方
式の場合、絶縁層内のあらゆる空隙に樹脂を到達させ、
樹脂で埋めることが、高性能の絶縁導体ひいては絶縁コ
イルを得る上で不可欠である。特に高電圧コイルでは、
主にマイカテープからなる絶縁テープが多数層巻回され
るため、絶縁層中に空隙を残さないように、あらかじめ
真空含浸タンク内で真空脱気した後、低粘度の樹脂を前
記タンク内に送り込んでコイルを樹脂中に浸漬し、長時
間樹脂に圧力をかけた後、コイルを樹j指中から取出し
、加熱して絶縁層中に含浸されノこ樹脂を硬化する真空
加圧含浸方式が行なわれている。しかL7、このような
−V J方法でも、絶縁テープの巻上りがきつかったり
、絶縁テープ中の接着剤が幾分べとついていて絶縁テー
プ巻回間がくっついていたりすると、絶縁層中に未含浸
部分が残り、ζゾ隙のある特性不良の絶縁コイルが出来
−Lる場合がある。Conventionally, an impregnation method has been used to manufacture insulated conductors. However, the impregnation method uses resin to fill the voids in the lining layer, which is made by wrapping multiple layers of insulating tape.
If the resin does not reach these voids, it will become an insulated conductor containing voids, and when the insulated conductor is used to form the windings of electrical equipment and is operated, the voids will cause deterioration due to radiation and moisture absorption. , thermal deterioration, and deterioration due to mechanical stress based on stress concentration. Therefore, in the case of the impregnation method, the resin reaches every void in the insulating layer,
Filling with resin is essential for obtaining high-performance insulated conductors and, ultimately, insulated coils. Especially with high voltage coils,
Since multiple layers of insulating tape, mainly made of mica tape, are wound, in order to avoid leaving any voids in the insulating layer, the vacuum is degassed in a vacuum impregnation tank beforehand, and then a low-viscosity resin is fed into the tank. A vacuum pressure impregnation method is used in which the coil is immersed in the resin, pressure is applied to the resin for a long period of time, the coil is removed from the resin, and the coil is heated to impregnate the insulating layer and harden the resin. It is. However, even with this -VJ method, if the insulating tape is rolled up too tightly, or if the adhesive in the insulating tape is somewhat sticky and the turns of the insulating tape stick together, there may be some unresolved material in the insulating layer. The impregnated portion may remain, resulting in an insulated coil with poor characteristics and a gap.
このような特性不良の絶縁導体(コイルも含む)は、第
1図に示すように表面に凹凸のない導体(1)に絶縁テ
ープを巻回した絶縁Jd +21を設ける場合のものと
か、第2図に示すように、心線(3)に絶縁破覆(4)
を設けた素線(5)を複数本束ねて導体(1)を形成す
る際、絶縁I4121と素線(5) 、 t51相互の
角部間にできる空11!j f6)が、素線を束ねる際
に使用した接着剤によって埋ったり、あるかは、導体(
1)端部の心線f31 、 +31同士を結合するため
に使われるはんだfm&ろうにより埋ったすした場合の
ものに多く見られることを本発明者は発見しk。Insulated conductors (including coils) with such poor characteristics are those in which insulation Jd +21 is provided by wrapping an insulating tape around a conductor (1) with no irregularities on the surface, as shown in Figure 1, or insulated conductors (including coils) with As shown in the figure, there is an insulation breakdown (4) in the core wire (3).
When forming a conductor (1) by bundling a plurality of strands (5) provided with 11. j f6) is buried by the adhesive used to bundle the wires, or whether it is
1) The present inventor discovered that this phenomenon is often seen in cases where the wires are filled with solder fm and solder used to connect the core wires f31 and +31 at the ends.
一般に電気導体(1)の絶縁層(2)への樹脂の含浸は
、絶縁層(2)が第3図に示すように絶縁テープ7を1
/2重巻したものを多数層重ねて形成されてhる層間(
8)をぬって、絶縁表面側から矢印Aのように進む。し
かし絶縁層(2)が厚い場合は、導体(1)へ届く迄の
含浸所要距離が長りため、経済的に見合う時間内では含
浸が完了しない場合がある。iた絶縁層(2)の端部で
は矢印Bのようにも絶縁層(2)の各層間(8)へ含浸
する。しかし、この場合も導体の長さが長込と、前記と
同じように経済的に見合う時間には含浸が完了できない
。Generally, the insulating layer (2) of the electrical conductor (1) is impregnated with resin by applying an insulating tape 7 to the insulating layer (2) as shown in FIG.
/Interlayer formed by stacking many layers of double-wound material (
8) and proceed in the direction of arrow A from the insulation surface side. However, if the insulating layer (2) is thick, the distance required for impregnation to reach the conductor (1) is long, and therefore the impregnation may not be completed within an economically reasonable time. At the end of the insulating layer (2), it is also impregnated into the interlayers (8) of the insulating layer (2) as shown by arrow B. However, in this case as well, if the length of the conductor is long, the impregnation cannot be completed within an economically reasonable period of time, as described above.
一般に第2図に示した絶縁In +23と素線(5)、
(5)相互の角部間にできる空隙(6)は、絶縁層(2
)の各層間にできる隙間(8)より広いので、この空隙
(6)を通って第3図の矢I:r]Cに示すように素線
(5)に沿って樹脂が浸透し、素線(5)側からも絶縁
層(2)間をぬって樹脂が含浸する。この空隙(6)が
接着剤、はんだや銀ろうなどで埋ってしまうと、素線(
5)に沿って含浸する矢印Cの通路が断たれ、矢印A、
矢印Bの通路でしか含浸できない。第1図に示す凹凸の
ない導体(1)を使った場合には最初から矢印Cの通路
は出来る見込みがない。従って凹凸の41.n導体を使
ったり、素線角部相互と絶縁層との間にできる空隙が接
着剤、はんだや銀ろうなどで埋っている場合に特性不良
の絶縁導体が出来易い。絶縁導体の中でも特に高4圧コ
イルは一般に極めて高価なものであり、このような不良
絶縁導体の発生率を零にすることが必要である。Generally, the insulation In+23 and the strand (5) shown in FIG.
(5) The gap (6) formed between the mutual corners is formed by the insulating layer (2
) is wider than the gap (8) formed between each layer, so the resin permeates through this gap (6) along the strands (5) as shown by the arrow I:r]C in Figure 3, and the strands The resin is impregnated between the insulation layers (2) from the wire (5) side as well. If this void (6) is filled with adhesive, solder, silver solder, etc., the wire (
The path of arrow C impregnating along 5) is cut off, and the path of arrow A,
Impregnation can only be carried out along the path indicated by arrow B. If a conductor (1) without irregularities shown in FIG. 1 is used, there is no possibility that the path indicated by arrow C will be formed from the beginning. Therefore, 41. of unevenness. An insulated conductor with poor characteristics is likely to be produced when an n-conductor is used or when the gap between the corners of the strands and the insulating layer is filled with adhesive, solder, silver solder, etc. Among insulated conductors, high-voltage coils in particular are generally extremely expensive, and it is necessary to reduce the incidence of such defective insulated conductors to zero.
本発明は樹脂含浸が経済的に良好に出iKる絶縁導体の
製造方法を提供することを目的とする。An object of the present invention is to provide a method for producing an insulated conductor that can be economically impregnated with resin.
本発明にお匹ては、′(気導体に絶縁テープ巻回による
複数層の絶縁層を形成し、この絶縁層に樹脂を含浸硬化
する絶縁導体の#遣方法にかいて、全絶縁1−故をNと
したとき、その全1−縁層故を1以上で2N/7禾イー
の値数の内測杷縁、−と残りの数の外側絶縁ノーとに分
割し、両線縁m 1ffl hてて導体のほぼ中央部に
位置し、導体に並行で長手方向孟長に、bたると共に更
に両端部が少なくとも外側絶縁層端部よりはみ出るよう
に絶、禄スペーサを介在させて、樹脂を含浸硬化させる
ことにvj徴を有するもので、絶縁スペーサだよって作
られる隙間からも樹脂を含浸することによ−りて短時間
に未含浸部の無い良好な絶縁導体を1害られるようにす
るものである。セして絶縁スペーサの位置を、上記位置
に定めたのは、実験結果により、内側絶縁層および外側
絶縁層に平均的に樹脂含浸が良好に行なわれることと、
導体に直かに絶縁スペーサを配置すると絶縁層が導体か
ら剥離し易く、Zth’4界が最も高^導体1u上で剥
離を生じると劣化が進与易いので、これを避けるためで
ある。In accordance with the present invention, a method for forming an insulated conductor in which a plurality of insulating layers are formed by winding an insulating tape around a gas conductor, and this insulating layer is impregnated with resin and cured, the total insulation 1- Let N be the total 1-edge layer layer, and divide the total 1-edge layer layer into 2N/7 inner insulation edges with a value of 1 or more, - and the remaining number of outer insulation edges, and divide both edge layers m 1ffl is located approximately in the center of the conductor, parallel to the conductor, and in the longitudinal direction, with a spacer interposed between the ends of the resin so that both ends protrude from at least the ends of the outer insulating layer. It has a vj characteristic in impregnating and curing the resin, and by impregnating the resin even from the gaps created by the insulating spacer, it is possible to make a good insulated conductor with no unimpregnated parts in a short time. The reason why the position of the insulating spacer was set at the above-mentioned position was that the inner insulating layer and the outer insulating layer were well impregnated with resin on average according to experimental results.
This is to avoid this because if the insulating spacer is placed directly on the conductor, the insulating layer will easily peel off from the conductor, and if peeling occurs on the conductor 1u where the Zth'4 field is the highest, deterioration will easily occur.
実1JtfA例1
以下、本発明の第1の実1例につhて、第4図および第
5図を参照しC説明する。このS施列は回転I櫨1幾の
絶縁コイル接続rHの絶縁1本を示す。Practical Example 1 A first practical example of the present invention will be described below with reference to FIGS. 4 and 5. This S arrangement shows one insulation of the insulated coil connection rH of rotation I 1 number.
表面に凹凸のない矩形断面の(気萼本(1)に、厚さ0
.24mg、幅32關で7〜15重道条のエポキシ樹脂
を接着剤として有するガラスI峨A11i袖強フイカテ
ープから成る絶縁テープを1/2重巻5回巻回しC1即
ち5層の内側絶縁層+97を形成する。その内側絶縁層
(9)の外側にて導体(11の広幅(130關)面に並
が両側のほぼ中央部に位置するように、厚−Δ1 sa
i、幅4011のガラス織布テープをスペーサ01とし
て接着剤で接着し、そのスペーサOIの両端は内側絶縁
層(9)の端部よりはみ出させる。その外周に内側絶縁
層(9)に用いたと同じ絶縁テープを1/2重巻で25
回巻回して、即ち25層の外側絶縁層ODを形成した。A rectangular cross section with no irregularities on the surface (calyx book (1), thickness 0
.. 24 mg, 32 width, 7 to 15 layers of insulating tape made of glass I-A11i sleeve-strength tape with 7 to 15 layers of epoxy resin as adhesive, wound 5 times in 1/2 layer C1, that is, 5 layers of inner insulation layer + 97 form. On the outside of the inner insulating layer (9), the thickness -Δ1 sa
i, a glass woven tape with a width of 4011 is bonded with an adhesive as a spacer 01, and both ends of the spacer OI are made to protrude from the ends of the inner insulating layer (9). Wrap the same insulating tape used for the inner insulating layer (9) around the outer circumference with 1/2 layer for 25 minutes.
By winding, 25 outer insulating layers OD were formed.
従って全絶縁層(2)の層数NはN=5+25=30
で30層となる。この場合、スペーサ四の両端を外側絶
縁層aυの端部よりはみ出場tてなくことは勿論である
。この後、m記絶縁を施した導体を真空含浸タンクに入
れ、0.5Torr以下に減圧した仮、1ポアズのエポ
キシ樹脂を前記タンク内に込り込み、前記導体を樹脂に
浸漬し、7 KP/cIJP Gの圧力で樹脂を所定時
間0口圧した。ちなみにこの所定時間は、前記絶縁を施
した導体の絶縁層(2)の最外周の中央部に金網テープ
(図示せず)を巻回し、導体(1)と金網間の静電容縫
の変化を樹脂加圧時間に対して測定し、第6図の曲線a
のように飽和する迄の時間としたものである。このよう
にして絶謹層(2)に樹脂を含浸した導体を真空含浸タ
ンクから取出し、周囲に鉄板を当て、その上から熱収縮
チヱーブを巻回し、加熱硬化して絶縁導体を得る。Therefore, the total number of insulating layers (2) N is 30 (N=5+25=30). In this case, it goes without saying that both ends of the spacer 4 should not protrude beyond the end of the outer insulating layer aυ. Thereafter, the conductor with the m insulation was placed in a vacuum impregnation tank, and epoxy resin of 1 poise, which had been reduced in pressure to 0.5 Torr or less, was poured into the tank, and the conductor was immersed in the resin. /cIJP G pressure was applied to the resin for a predetermined period of time. Incidentally, during this predetermined time, a wire mesh tape (not shown) is wound around the center of the outermost periphery of the insulating layer (2) of the insulated conductor, and changes in the capacitance stitch between the conductor (1) and the wire mesh are observed. Measured against resin pressurization time, curve a in Figure 6
This is the time taken to reach saturation. The conductor whose insulating layer (2) has been impregnated with resin in this way is taken out of the vacuum impregnation tank, a steel plate is placed around it, a heat-shrinkable tube is wound over it, and the conductor is cured by heating to obtain an insulated conductor.
次に作用について説明する。Next, the effect will be explained.
絶縁スペーサQlを用いない場合は、絶縁層(2)の最
外周の中央部に金網テープを巻回し、導体(1)と金網
間の静電容重の変化を樹脂加圧時間に対して測定し、飽
和する迄の時間をめると第6図の曲線すに示すように、
本実施例の曲線aの場合の数倍の時間を要する。従って
本実施例の製造方法によれば、短かい時間で確実に樹脂
が含浸され、経済的に見合うことが明らかである。そし
て内側絶縁層(9)を5層とし、外側絶縁Qllを25
層としだのは次の理由による。If the insulating spacer Ql is not used, wrap a wire mesh tape around the center of the outermost periphery of the insulating layer (2) and measure the change in capacitance between the conductor (1) and the wire mesh with respect to the resin pressurization time. , the time until saturation is calculated as shown in the curve in Figure 6.
It takes several times as much time as in the case of curve a of this embodiment. Therefore, it is clear that according to the manufacturing method of this example, the resin can be reliably impregnated in a short period of time and is economically viable. Then, the inner insulating layer (9) is made into 5 layers, and the outer insulating layer (Qll) is made into 25 layers.
The reason for the layers is as follows.
即ち、スペーサ(IIの位置と絶縁テープ巻回層数を捕
々に変えて、含浸試験を繰返したところ、第7図におい
て、矢印A方向からの含浸到達可能層故に対する矢印り
方向からの含浸到達i]能ノー故9比が、4:3であっ
た。従って全j−故N f l Oとするならば、同一
時間に最外周から矢印人の方向に4層含浸し、スペーサ
(11の側面の通路Q3 (45図参照)から外側と内
側へ矢印りの方向に3)−rつ含浸することになる。従
ってスペーサOIの位置は内側から3N/10層以下に
すルば内側絶縁1−(9)、および外側1酌縁層0υの
内側部分の樹脂含浸は確実に行なわれることが分った。That is, when the impregnation test was repeated by changing the position of the spacer (II) and the number of layers of insulating tape, in Fig. 7, the impregnation from the direction of the arrow indicated that the impregnation could be reached from the direction of the arrow A. The ratio of the spacer (11 From the side passage Q3 (see Figure 45), impregnation is carried out in the direction of the arrow from the outside to the inside.Therefore, if the spacer OI is positioned at 3N/10 layers or less from the inside, the inner insulation It was found that the resin impregnation of the inner part of the outer layer 1-(9) and the outer 1 edge layer 0υ was reliably carried out.
しめ為しC全体の絶縁層(2)を含浸する場合、外側の
河よりも内側の方が確実に含浸δルでいることが、内側
が高贋゛成界による劣化防止と必要条件であるので、3
N/10よりやセ小さい2N/7以下であることを条件
としたものである。また、スペーサa〔を導体+1)に
1ばかに設けると、導体(1)との熱膨張率の差に騙づ
く熱応力により、絶縁層(2)が4体(1)から剥離し
易く、そして、4界が最も高い導体直上(’ ill離
と生じると1層縁層(2)の劣化が値み易いので必らr
少なくとも1層だけは内側絶縁層(9)を設けなければ
ならな(Q0上記実施例1では全絶縁層数N=30であ
るからとなり、整数を採って8層な^し1層を内側絶縁
層(9)とすることが必要であり、5層としたのは適当
である。When impregnating the entire insulating layer (2) of the insulation layer C, it is a necessary condition to ensure that the inner layer is more impregnated than the outer layer in order to prevent deterioration due to high impurities on the inner side. Therefore, 3
The condition is that the value is 2N/7 or less, which is slightly smaller than N/10. In addition, if spacer a [is provided on conductor +1), the insulating layer (2) will easily peel off from the 4th body (1) due to thermal stress caused by the difference in thermal expansion coefficient with the conductor (1). When the 4th field is located directly above the highest conductor ('ill), it is easy to see the deterioration of the first edge layer (2), so it is necessary to
At least one layer must be provided with an inner insulating layer (9) (Q0 In Example 1, the total number of insulating layers is 30, so the integer is taken to be 8 layers, and one layer is provided as an inner insulating layer. It is necessary to have layer (9), and it is appropriate to have five layers.
また絶縁スペーサOIを導体(1)の幅方向のほぼ中央
に配置するのは、導体角部は電界が最も高く、劣化し易
いためである。そして、一般には絶縁スペーサa1の幅
は導体(1)の幅の315以下、好ましくは半分程度が
、含浸性および耐劣化性から与て良好である。Further, the reason why the insulating spacer OI is arranged approximately at the center in the width direction of the conductor (1) is that the electric field is highest at the corners of the conductor and the conductor is easily deteriorated. In general, the width of the insulating spacer a1 is 315 mm or less, preferably about half the width of the conductor (1), from the viewpoint of impregnability and deterioration resistance.
なお、第5図では絶縁スペーサO1の配置は、導体(1
)の広幅側の2面のみに設けたものを示したが、狭幅の
2面も含めて4面に設けてもよい。又、絶縁スペーサ(
11は内側絶縁層(9)端からはみ出さなくても、少な
くとも外側絶縁層Qυ端よりはみ出していればよい。In addition, in FIG. 5, the arrangement of the insulating spacer O1 is similar to that of the conductor (1
), but it may be provided on four sides including the two narrow sides. Also, insulating spacer (
11 does not have to protrude from the end of the inner insulating layer (9), it is sufficient that it at least protrudes from the end of the outer insulating layer Qυ.
実施例2
第8図および第9図に示す第2の実施例はタービン発4
機用のハーフコイルとしての絶縁導体である。心線(3
)に通水孔Iを有し絶縁被覆(4)を設けた素線(5)
を8本束ねて導体+1)を形成するが、内側絶縁層(9
)と素線(5) 、 (5)相互の角部間にできる空隙
(6)が、導体(1)の両端付近回部において、通水管
のクリップa滲と心線(3)との銀ろう付けの際の流れ
銀ろうによって埋まっている。そこで実施例1と同じ絶
縁テープを1層2重巻4回にょ′って4層の内側絶縁層
+9)を形成し、端部の一部の層はクリップIの上まで
巻き上げる。導体(1)の広幅(68mm)面側に導体
(1)のほぼ中央部に位置するように、実施例1に述べ
た絶縁テープと同じ厚さl−)、24 Mm、幅32闘
のマイカテープt−4秋積重ねて絶縁スペーサOIとし
て配設し、その両端はクリップ04)の上まではみ出さ
せる。外周に内側絶縁層+9)と同じ絶縁テープt″l
/2重巻20回によつC20層の外側1通縁j−aυを
形成した。4縁スペーサQ1の両端部が、外側絶縁層θ
Dの両端部よりはみ出ていることも実施同lと同様であ
る。次にエポキシ樹脂金^窄加圧含浸し、加熱硬化して
ハーフコイル用絶縁導体を得ることも実施例1と同様で
ある。そして更にクリップIの上も絶縁テープを巻回し
て保護絶縁a5を形成する。Embodiment 2 A second embodiment shown in FIGS. 8 and 9 uses a turbine generator 4.
This is an insulated conductor used as a half coil for machines. Core wire (3
) has a water hole I and an insulating coating (4) (5)
are bundled to form a conductor +1), but the inner insulating layer (9
) and the wire (5), the gap (6) created between the mutual corners of the conductor (1) is caused by the leakage of the clip a of the water pipe and the silver between the core wire (3) and the conductor (1) near both ends. Filled with flowing silver solder during brazing. Therefore, one layer of the same insulating tape as in Example 1 was wound twice four times to form a four-layer inner insulating layer +9), and a part of the layer at the end was wound up to the top of the clip I. A mica tape having the same thickness as the insulating tape described in Example 1, 24 mm, and width 32 mm was placed on the wide (68 mm) side of the conductor (1) so as to be located approximately at the center of the conductor (1). Tape t-4 is stacked and arranged as an insulating spacer OI, with both ends protruding above clip 04). The same insulation tape t″l as the inner insulation layer + 9) on the outer periphery
/ One outer edge j-aυ of the C20 layer was formed by double winding 20 times. Both ends of the four-edge spacer Q1 are connected to the outer insulating layer θ
The fact that it protrudes from both ends of D is also the same as in Example I. Next, in the same manner as in Example 1, the epoxy resin is impregnated with gold under pressure and cured by heating to obtain an insulated conductor for a half coil. Then, an insulating tape is further wound over the clip I to form a protective insulation a5.
次に作用について説明する。Next, the effect will be explained.
全絶縁層数NはN=4+20=24である。従って、で
あるから、内側絶縁層(9)を4層としたことはlと6
の間の値であって適当である。このようにして得た絶縁
導体と絶縁スペーサのない従来の方法によって製造した
絶縁導体のΔtanδの累積頻度分布特性を比較して第
10図に示す。Δtanδとは定格′磁圧におけるta
nδ と、(定格電圧−2kV)におけるtanδの差
である。本実施例のものを示す曲線aは従来のものを示
す曲線すに比べ、△tanδは小さく、ばらつきも少な
いことが分った。これは絶縁スペーサOIによシ樹脂の
含浸する通路a4が形成され、この通路aaを通シ、樹
脂が含浸するため、経済的に見合う程度の短かい所要時
間内に、完全に樹脂が含浸できるからである。The total number of insulating layers N is N=4+20=24. Therefore, since the inner insulating layer (9) has four layers, l and 6
A value between 1 and 2 is appropriate. FIG. 10 shows a comparison of the cumulative frequency distribution characteristics of Δtanδ of the insulated conductor thus obtained and the insulated conductor manufactured by the conventional method without an insulated spacer. Δtanδ is ta at rated magnetic pressure.
It is the difference between nδ and tanδ at (rated voltage −2 kV). It was found that the curve a representing the present example had a smaller Δtan δ and less variation than the curve a representing the conventional one. This is because the insulating spacer OI forms a passage a4 where the resin is impregnated, and the resin is impregnated through this passage aa, so that the resin can be completely impregnated within an economically viable short period of time. It is from.
同、本発明は、絶縁スペーサOIとしてマイカテープの
他に、ポリエステルやアラミツドの不織布フェルト、ガ
ラス織布のテープ、ガラスロープ、ガラスアラミツドボ
ード(GAボードと称する日本アロマ社商品名のものあ
り)積層板などを使用してもよく、特に樹脂含浸後の成
形硬化時に圧縮され、絶縁テープ(7)による内外の絶
縁層(91、Onと一体化するマイカテープや不織布フ
ェルトなどは好適である。又、絶縁テープ(7)として
は、マイカテープ、ポリエステルやポリイミドなどのフ
ィルム、ポリエステルやアラミツドなどの不織布テープ
、アラミツド紙などが使える。高電圧絶縁には絶縁スペ
ーサ(11、絶縁テープ(7)ともに耐部分放′鑞性が
優れているマイカテープが好ましい。樹脂としては、エ
ポキシ、ポリイミド、ポリエステルなどの無溶剤の熱硬
化性樹脂が好ましい。In addition to mica tape, the present invention also uses polyester or aramid nonwoven felt, glass woven tape, glass rope, and glass aramid board (also known as GA board, a product of Nippon Aroma Co., Ltd.) as an insulating spacer OI. A laminated plate or the like may be used, and mica tape or nonwoven felt, which is compressed during molding and hardening after resin impregnation and is integrated with the inner and outer insulating layers (91, On) of the insulating tape (7), is particularly suitable. In addition, as the insulating tape (7), mica tape, polyester or polyimide film, polyester or aramid nonwoven tape, aramid paper, etc. can be used.For high voltage insulation, both the insulating spacer (11) and the insulating tape (7) are used. Mica tape is preferred because it has excellent partial brazing resistance.As the resin, solvent-free thermosetting resins such as epoxy, polyimide, and polyester are preferred.
以上説明したように本発明によれば、全絶縁層数Nを1
以上で2N/7未満の4故の内側絶縁層と残りの数の外
側絶縁層とに分割し、両線縁層間にて導体のほぼ中央部
に位置し、導体に並行で長手方向全長にわたると共に更
に両端部が少なくとも外側、酌縁層端部よりはみ出るよ
うに絶縁スペーサを介在させて、樹脂を含浸硬化させる
ようにしたので、最外周面のみならず、絶縁スペーサの
両側にできた通路を通って樹脂が内外の絶縁層へ含浸す
るため、経済的に見合う時間で絶縁層に完全に樹脂を含
浸させることができる。又、絶縁スペーサの位置は導体
直上でなく、内外の両絶縁層の間で、かつ導体幅のほぼ
中央部であるため、絶縁スペーサの介在が絶縁層に電気
的劣化、機械的応力による劣化等の悪影響を及ぼさずに
すむ優秀な絶縁導体の製造方法となる。As explained above, according to the present invention, the total number N of insulating layers can be reduced to 1.
The inner insulating layer is divided into four inner insulating layers of less than 2N/7 and the remaining number of outer insulating layers, which are located approximately in the center of the conductor between the two edge layers, and extend parallel to the conductor and extend over the entire length in the longitudinal direction. Furthermore, an insulating spacer was interposed so that both ends protruded at least from the outside, beyond the end of the copper layer, and the resin was impregnated and cured, so that the resin could pass not only through the outermost surface but also through the passages formed on both sides of the insulating spacer. Since the resin is impregnated into the inner and outer insulation layers, the insulation layer can be completely impregnated with the resin in an economically reasonable time. In addition, since the insulating spacer is located not directly above the conductor, but between the inner and outer insulating layers, and approximately at the center of the conductor width, the presence of the insulating spacer may cause electrical deterioration, mechanical stress deterioration, etc. to the insulating layer. This is an excellent method for manufacturing insulated conductors that does not have any negative effects.
第1図および第2図はそれぞれ異なる従来の方法で製造
した絶縁導体の横断面図、第3図は第2図の絶縁層にお
ける樹脂の含浸経路を示す説明図、第4図は本発明の方
法の第1の実施例で製造途中の状態を示す絶縁導体の平
面図、第5図は第4図のV−V線に沿う矢悦拡大断面図
、第6図は第1の実施列の方法と従来の方法とで製造す
るl18縁導体の樹脂含浸時間に対する静″4容瀘の変
化を比較して示す曲線図、第7図は第1の実施列の絶縁
層における樹脂含浸進路を示す説明図、FA8図は第2
の実施例で!!!!造途中の状態を示すA8縁導体の平
面因、第9図は第8図の「−1線に沿う矢視拡大断面図
、第1θ図は第2の実施例の方法と従来の方法とで製造
した絶縁導体のΔtanδの累積頻度分布を比較して示
す曲線図である。
1 ・導体 2・・・絶縁層
7 ・絶縁テープ 9−内側絶縁層
1()・・絶縁スペーサ 11・・・外側絶縁1−代理
人 弁理士 井 上 −男
@1図
第 2 図
第3図
□!
第10図
h
44−1 and 2 are cross-sectional views of insulated conductors manufactured by different conventional methods, FIG. 3 is an explanatory diagram showing the resin impregnation path in the insulating layer of FIG. 2, and FIG. A plan view of an insulated conductor showing a state in the middle of manufacturing in the first embodiment of the method, FIG. 5 is an enlarged cross-sectional view taken along line V-V in FIG. 4, and FIG. A curve diagram showing a comparison of the change in static 4 volume with respect to the resin impregnation time of L18 edge conductors manufactured by the method and the conventional method. FIG. 7 shows the course of resin impregnation in the insulating layer of the first row. Explanatory diagram, FA8 diagram is the second
With examples! ! ! ! 9 is an enlarged cross-sectional view taken along the -1 line in FIG. It is a curve diagram comparing and showing the cumulative frequency distribution of Δtanδ of manufactured insulated conductors. 1 - Conductor 2... Insulating layer 7 - Insulating tape 9-Inner insulating layer 1 ()... Insulating spacer 11... Outer Insulation 1 - Agent Patent attorney Inoue - Male @ Figure 1 Figure 2 Figure 3 □! Figure 10 h 44-
Claims (3)
層を形成し、この絶縁層に樹脂を含浸硬化する絶縁導体
の製造方法におして、全絶縁層数をNとしたとき、その
全絶縁II数を1以上で2N/7未満の整数の内側絶縁
層と残りの数の外側絶縁層とに分割し、両絶縁層間にて
導体のほぼ中央部に位置し、導体に並行で長手方向全長
にわたると共に更に両瑞部が少なくとも外側絶縁層端部
よりはみ出るように絶縁スペーサを介在さtて、樹脂を
含浸硬化式せることを特徴とする絶縁導体の製造方法0(1) In a method for manufacturing an insulated conductor, in which multiple insulating layers are formed on an electrical conductor by winding insulating tape, and the insulating layer is impregnated with resin and cured, when the total number of insulating layers is N, the total insulation II number is divided into an integer number of 1 or more and less than 2N/7 and an outer insulating layer of the remaining number, and is located approximately in the center of the conductor between both insulating layers, parallel to the conductor, and has a total length in the longitudinal direction. A method for manufacturing an insulated conductor, which comprises impregnating and curing a resin with an insulating spacer interposed so that both the ferrules extend over the outer insulating layer and protrude from at least the ends of the outer insulating layer.
ことを特徴とする特許請求の範囲第1項記載の絶縁導体
の製造方法。(2) The method for manufacturing an insulated conductor according to claim 1, wherein the width of the insulating spacer is 375 times or less the width of the conductor.
徴とする特許請求の範囲第1項又は第2項記載の絶縁導
体の製造方法。(3) The method for manufacturing an insulated conductor according to claim 1 or 2, wherein the insulating spacer uses mica tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13194883A JPS6025108A (en) | 1983-07-21 | 1983-07-21 | Method of producing insulated conductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13194883A JPS6025108A (en) | 1983-07-21 | 1983-07-21 | Method of producing insulated conductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6025108A true JPS6025108A (en) | 1985-02-07 |
| JPH0354805B2 JPH0354805B2 (en) | 1991-08-21 |
Family
ID=15069949
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13194883A Granted JPS6025108A (en) | 1983-07-21 | 1983-07-21 | Method of producing insulated conductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6025108A (en) |
-
1983
- 1983-07-21 JP JP13194883A patent/JPS6025108A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0354805B2 (en) | 1991-08-21 |
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