JPS6025875Y2 - inductance circuit components - Google Patents

inductance circuit components

Info

Publication number
JPS6025875Y2
JPS6025875Y2 JP17777080U JP17777080U JPS6025875Y2 JP S6025875 Y2 JPS6025875 Y2 JP S6025875Y2 JP 17777080 U JP17777080 U JP 17777080U JP 17777080 U JP17777080 U JP 17777080U JP S6025875 Y2 JPS6025875 Y2 JP S6025875Y2
Authority
JP
Japan
Prior art keywords
magnetic body
circuit component
circuit components
inductance circuit
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP17777080U
Other languages
Japanese (ja)
Other versions
JPS57100211U (en
Inventor
光男 大沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP17777080U priority Critical patent/JPS6025875Y2/en
Publication of JPS57100211U publication Critical patent/JPS57100211U/ja
Application granted granted Critical
Publication of JPS6025875Y2 publication Critical patent/JPS6025875Y2/en
Expired legal-status Critical Current

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  • Coils Or Transformers For Communication (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【考案の詳細な説明】 本考案はリードレスのインダクタンス回路部品を提供す
るものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention provides a leadless inductance circuit component.

従来より、第1図に示すようなフェライト等から成る円
柱状の磁性体1に銅等のリード線2を貫通させ接着剤3
により接着して成るインダクタンス回路部品4が知られ
ている。
Conventionally, lead wires 2 made of copper or the like are passed through a cylindrical magnetic body 1 made of ferrite or the like as shown in FIG.
An inductance circuit component 4 is known which is formed by bonding.

このようなインダクタンス回路部品4.は、リード線2
に流れる電流の周波数fによって、例えば第2図に示す
ようにそのインピーダンスZが変化する。
Such inductance circuit components 4. is lead wire 2
For example, as shown in FIG. 2, the impedance Z changes depending on the frequency f of the current flowing through the electrode.

一方、従来のリード付き回路部品に代って最近リードレ
ス回路部品が多く用いられて来ている。
On the other hand, leadless circuit components have recently been increasingly used in place of conventional leaded circuit components.

リードレス回路部品をプリント基板ヘマウントする場合
は、自動マウント装置を用いて全て自動的に行なうこと
ができる。
When mounting leadless circuit components on a printed circuit board, it can all be done automatically using an automatic mounting device.

従って前述したインダクタンス回路部品をリードレス化
して、他の回路部品と同時にマウントできるようにすれ
ば極めて好都合である。
Therefore, it would be extremely convenient if the inductance circuit component described above could be made leadless so that it could be mounted simultaneously with other circuit components.

本考案はこのような要求に鑑みて威されたもので、以下
本考案の実施例を図面と共に説明する。
The present invention was developed in view of these demands, and embodiments of the present invention will be described below with reference to the drawings.

第3図は本考案によるリードレスイングクタンス回路部
品の製造工程の第1の実施例を示すものである。
FIG. 3 shows a first embodiment of the manufacturing process of a leadless injectance circuit component according to the present invention.

先ず、第3図Aに示すような、貫通孔6が同軸的に設け
られた円柱状の磁性体5が用意される。
First, a cylindrical magnetic body 5 having a coaxial through hole 6 as shown in FIG. 3A is prepared.

次に第3図B、 Cに示すように、磁性体5の周面の両
端部、両端面及び貫通孔6の内周面に銀ペースト7aを
塗布した後、焼成して硬化させる。
Next, as shown in FIGS. 3B and 3C, silver paste 7a is applied to both ends of the circumferential surface of the magnetic body 5, both end surfaces, and the inner circumferential surface of the through hole 6, and then baked and hardened.

次に第3図り、Eに示すように、磁性体5の両端部に電
極用のキャップ8,9を嵌め込む。
Next, as shown in the third diagram E, electrode caps 8 and 9 are fitted to both ends of the magnetic body 5.

このキャップは、銅、黄銅等の非鉄金属からなる導電性
金属が用いられ、その表面に薄く半田メッキが施されて
いる。
This cap is made of a conductive metal made of non-ferrous metal such as copper or brass, and its surface is thinly plated with solder.

このキャップ8,9は磁性体5の両端部に形成された上
記銀ペースト7aが固化して成る銀層7を覆うように、
この銀層7と密着されて嵌め込まれる。
The caps 8 and 9 cover the silver layer 7 formed by solidifying the silver paste 7a formed on both ends of the magnetic body 5.
It is fitted in close contact with this silver layer 7.

尚、キャップ8,9の嵌め込み後、必要に応じて加熱処
理が行われる。
Note that after fitting the caps 8 and 9, heat treatment is performed as necessary.

これによって、キャップ8と9とは、磁性体5の周面の
両端部、両端面及び貫通孔6の内周面に形成された銀層
7を通じて電気的に接続される。
Thereby, the caps 8 and 9 are electrically connected through the silver layer 7 formed on both ends of the circumferential surface of the magnetic body 5, both end surfaces, and the inner circumferential surface of the through hole 6.

次に第3図Fに示すように、キャップ8,9を除く全面
に絶縁性樹脂被膜10を形成してリードレスイングクタ
ンス回路部品11が完成される。
Next, as shown in FIG. 3F, an insulating resin coating 10 is formed on the entire surface except for the caps 8 and 9, and the leadless injectance circuit component 11 is completed.

第4図は製造工程の第2の実施例を示す。FIG. 4 shows a second embodiment of the manufacturing process.

先ず第3図Aと同じ磁性体5が用意される。First, the same magnetic material 5 as in FIG. 3A is prepared.

次に第4図Aに示すように磁性体5の両端部を除く周面
に絶縁性樹脂被膜12を印刷等により猛威する。
Next, as shown in FIG. 4A, an insulating resin coating 12 is coated on the circumferential surface of the magnetic body 5 except for both ends by printing or the like.

次にこの磁性体5にメッキを施すと、第4図B、 Cに
示すように、磁性体5の上記被膜12を除く部分、即ち
周面の両端部、両端面及び貫通孔6の内周面にメッキ層
13が形成される。
Next, when this magnetic body 5 is plated, as shown in FIG. A plating layer 13 is formed on the surface.

尚1.一ヒ記メツキ層13は例えば次のようにして形成
される。
Note 1. The plating layer 13 is formed, for example, as follows.

先ず、第4図Aの状態の磁性体5の周面の両端部、両端
面及び貫通孔6の内周面に銅の不導体メッキを施し、こ
の不導体メッキ層にさらに銅の電解メッキを施す。
First, nonconductor plating of copper is applied to both ends and end surfaces of the circumferential surface of the magnetic body 5 in the state shown in FIG. give

次にこの銅のメッキ層に半田メッキを施すか、あるいは
ニッケルメッキを施1゜た後、その上に半田メッキを施
す。
Next, solder plating is applied to this copper plating layer, or after 1° of nickel plating is applied, solder plating is applied thereon.

半田メッキは、例えば鉛95%、錫5%の半田層が例え
ば3〜4μmの厚さで形成される。
In the solder plating, a solder layer containing, for example, 95% lead and 5% tin is formed with a thickness of, for example, 3 to 4 μm.

次に上記第4図B、 Cの磁性体5の両端部に第3図り
と同様にしてキャップ8,9を嵌め込め、さらに第3図
Fと同様にして絶縁性樹脂被膜10を施してリードレス
イングクタンス回路部品11が完成される。
Next, caps 8 and 9 are fitted to both ends of the magnetic body 5 shown in FIGS. 4B and 4C in the same manner as in the third drawing, and an insulating resin coating 10 is applied in the same manner as in FIG. 3F to form the leads. The responsivity circuit component 11 is completed.

以上のように本考案は、貫通孔が軸方向に設けられた円
柱状磁性体の周面の両端部、両端面及び上記貫通孔の内
面に導電層(例えば銀層)が形成され、上記磁性体の上
記両端部は金属製の電極キャップが嵌め込まれ、上記キ
ャップを除く略全面に樹脂袖膜が形成されて戊る回路部
品に係るものである。
As described above, in the present invention, a conductive layer (for example, a silver layer) is formed on both ends of the circumferential surface of a cylindrical magnetic body in which a through hole is provided in the axial direction, on both end surfaces, and on the inner surface of the through hole. This is a circuit component in which metal electrode caps are fitted into both ends of the body, and a resin sleeve film is formed on substantially the entire surface except for the caps.

従って本考案によれば、全く新規なリードレスイングク
タンス回路部品を提供することができるので、他のリー
ドレス回路部品と共にプリント基板上で回路を構成する
ことにより、新しい性能を有する回路設計を行うことが
できる。
Therefore, according to the present invention, a completely new leadless injectance circuit component can be provided, and by configuring a circuit on a printed circuit board together with other leadless circuit components, a circuit design with new performance can be achieved. be able to.

また磁性体は比較的熱に弱いので、第1図の従来のもの
を単にリードレス化した場合は、プリント基板に半田付
けする際の高熱により、磁性体が割れるおそれがあるが
、本考案では絶縁性樹脂被膜を設けているので、熱が磁
性体に直接伝わることがなく、割れる心配はない。
Furthermore, since magnetic materials are relatively sensitive to heat, if the conventional type shown in Figure 1 were simply made leadless, the magnetic material would be likely to crack due to the high heat generated when soldering it to a printed circuit board. Since it has an insulating resin coating, heat will not be transferred directly to the magnetic material, so there is no risk of it breaking.

また銀層の上からキャップを嵌め込むので、キャップが
嵌め込み易い。
Furthermore, since the cap is fitted over the silver layer, it is easy to fit the cap.

さらに絶縁樹脂被膜があるために、その下にプリント基
板の配線パターンがあっても、充分に絶縁性を良くする
ことができる。
Furthermore, since there is an insulating resin coating, the insulation can be sufficiently improved even if there is a wiring pattern of a printed circuit board underneath.

また生産性が高いのでコストが安い。In addition, the cost is low due to high productivity.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来のインダクタンス回路部品の斜視図、第2
図はインダクタンス回路部品の特性図、第3図は本考案
による回路部品の製造工程の第1の実施例を示す斜視図
及び断面側面図、第4図は製造工程の第2の実施例を示
す斜視図及び断面側面図である。 なお図面に用いられている符号において、5・・・・・
・磁性体、6・・・・・・貫通孔、7・・・・・・銀層
、8,9・・・・・・電極キャップ、11・・・・・・
インダクタンス回路部品である。
Figure 1 is a perspective view of a conventional inductance circuit component, Figure 2 is a perspective view of a conventional inductance circuit component.
The figure is a characteristic diagram of an inductance circuit component, FIG. 3 is a perspective view and a cross-sectional side view showing a first embodiment of the manufacturing process of the circuit component according to the present invention, and FIG. 4 is a second embodiment of the manufacturing process. FIG. 2 is a perspective view and a cross-sectional side view. In addition, in the symbols used in the drawings, 5...
・Magnetic material, 6... Through hole, 7... Silver layer, 8, 9... Electrode cap, 11...
It is an inductance circuit component.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 貫通孔が軸方向に設けられた円柱状磁性体の周面の両端
部、両端面及び上記貫通孔の内面に導電層が形成され、
上記磁性体の上記両端部に金属製の電極キャップが嵌め
込まれ、上記電極キャップを除く略全面に絶縁性樹脂被
膜が形成されて成る回路部品。
A conductive layer is formed on both ends of the circumferential surface of a cylindrical magnetic body in which a through hole is provided in the axial direction, on both end surfaces, and on the inner surface of the through hole,
A circuit component in which metal electrode caps are fitted into both ends of the magnetic body, and an insulating resin coating is formed on substantially the entire surface except for the electrode caps.
JP17777080U 1980-12-11 1980-12-11 inductance circuit components Expired JPS6025875Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17777080U JPS6025875Y2 (en) 1980-12-11 1980-12-11 inductance circuit components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17777080U JPS6025875Y2 (en) 1980-12-11 1980-12-11 inductance circuit components

Publications (2)

Publication Number Publication Date
JPS57100211U JPS57100211U (en) 1982-06-19
JPS6025875Y2 true JPS6025875Y2 (en) 1985-08-03

Family

ID=29971955

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17777080U Expired JPS6025875Y2 (en) 1980-12-11 1980-12-11 inductance circuit components

Country Status (1)

Country Link
JP (1) JPS6025875Y2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59131118U (en) * 1983-02-23 1984-09-03 株式会社トーキン inductor

Also Published As

Publication number Publication date
JPS57100211U (en) 1982-06-19

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