JPS60261158A - セラミック端子板の気密接合方法 - Google Patents

セラミック端子板の気密接合方法

Info

Publication number
JPS60261158A
JPS60261158A JP59117129A JP11712984A JPS60261158A JP S60261158 A JPS60261158 A JP S60261158A JP 59117129 A JP59117129 A JP 59117129A JP 11712984 A JP11712984 A JP 11712984A JP S60261158 A JPS60261158 A JP S60261158A
Authority
JP
Japan
Prior art keywords
thermal expansion
terminal plate
container
ceramic terminal
expansion coefficient
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59117129A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0439777B2 (2
Inventor
Katsuhide Natori
名取　勝英
Kyoichiro Kono
河野　恭一郎
Tsutomu Iikawa
勤 飯川
Shigeki Okamoto
岡本　茂樹
Takeaki Sakai
酒井　武明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP59117129A priority Critical patent/JPS60261158A/ja
Publication of JPS60261158A publication Critical patent/JPS60261158A/ja
Publication of JPH0439777B2 publication Critical patent/JPH0439777B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP59117129A 1984-06-07 1984-06-07 セラミック端子板の気密接合方法 Granted JPS60261158A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59117129A JPS60261158A (ja) 1984-06-07 1984-06-07 セラミック端子板の気密接合方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59117129A JPS60261158A (ja) 1984-06-07 1984-06-07 セラミック端子板の気密接合方法

Publications (2)

Publication Number Publication Date
JPS60261158A true JPS60261158A (ja) 1985-12-24
JPH0439777B2 JPH0439777B2 (2) 1992-06-30

Family

ID=14704155

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59117129A Granted JPS60261158A (ja) 1984-06-07 1984-06-07 セラミック端子板の気密接合方法

Country Status (1)

Country Link
JP (1) JPS60261158A (2)

Also Published As

Publication number Publication date
JPH0439777B2 (2) 1992-06-30

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees