JPS6032397A - Device for mounting heat generating component - Google Patents
Device for mounting heat generating componentInfo
- Publication number
- JPS6032397A JPS6032397A JP58141332A JP14133283A JPS6032397A JP S6032397 A JPS6032397 A JP S6032397A JP 58141332 A JP58141332 A JP 58141332A JP 14133283 A JP14133283 A JP 14133283A JP S6032397 A JPS6032397 A JP S6032397A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- generating component
- board
- heat generating
- radiator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、無線装置、その他者種電子機器装置に使用す
る発熱部品の取付装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a mounting device for heat generating components used in radio equipment and other types of electronic equipment.
従来例の構成とその問題点
従来、無線装置等において発熱部品を取付けるには、第
１図に示すように発熱部品１の端子２を回路接続のため
の基板３の孔４に挿通したハン、グ６により取付ける。Conventional Structure and Problems Conventionally, in order to install a heat generating component in a wireless device or the like, as shown in FIG. Attach using 6 screws.
而して基板３をネジ（図示省略）により放熱器６に取付
けると共に発熱部品１の放熱片７に形成したネジ挿通孔
８より放熱器６の放熱台座９に形成したネジ孔１ｏにネ
ジ１１を螺入して取付けている。また従来の他の例とし
て第２図に示すように発熱部品１の放熱片７に形成した
ネジ挿通孔８より放熱板１２に形成１〜だネジ孔１３に
ネジ１４を螺入ｊ−で固定し、端子２を基板３の孔４に
挿通してハンダ５により数例ける。Then, the board 3 is attached to the heat sink 6 with screws (not shown), and the screws 11 are inserted into the screw holes 1o formed in the heat sink 9 of the heat sink 6 through the screw insertion holes 8 formed in the heat sink 7 of the heat generating component 1. It is installed by screwing it in. As another conventional example, as shown in FIG. 2, a screw 14 is fixed by screwing into a screw hole 13 formed in a heat sink 12 through a screw insertion hole 8 formed in a heat sink 7 of a heat generating component 1. Then, the terminal 2 is inserted into the hole 4 of the board 3 and soldered several times with solder 5.
而して基板３をネジ（図示省略）により放熱器６に数例
けると共に放熱板１２に形成したネジ挿通孔１５より放
熱器６の放熱台座９に形成したネジ孔１ｏにネジ１１を
螺入して取付けている。Then, attach the board 3 to the heatsink 6 using screws (not shown), and screw the screws 11 into the screw holes 1o formed on the heatsink base 9 of the heatsink 6 through the screw insertion holes 15 formed on the heatsink plate 12. and installed it.
しかし第１図に示す従来例によれば、作業工数の削減の
だめ予め発熱部品１の端子２を基板３にハンダ５により
取付けておく必要がある。従って、発熱部品１のネジ挿
通孔８と放熱器６のネジ孔１０とを一致させ難く、発熱
部品１の端子２に歪力が加わり、ハンダ５による取付部
の信頼性に問題があった。また第２図に示す従来例にお
いても放熱板１２のネジ挿通孔１５と放熱器６のネジ孔
１ｏとを一致させ難く、上記と同様に端子２と基板３と
のハンダ５による取ｔＪ部の信頼性に問題があり、しか
も放熱板１２を介して放熱器６に熱を逃しているため、
放熱効果が悪い欠点があった。However, according to the conventional example shown in FIG. 1, it is necessary to attach the terminals 2 of the heat generating component 1 to the board 3 with solder 5 in advance in order to reduce the number of work steps. Therefore, it is difficult to align the screw insertion holes 8 of the heat generating component 1 with the screw holes 10 of the radiator 6, and strain force is applied to the terminals 2 of the heat generating component 1, which poses a problem in the reliability of the attachment portion using the solder 5. Furthermore, in the conventional example shown in FIG. 2, it is difficult to align the screw insertion holes 15 of the heat sink 12 and the screw holes 1o of the heat sink 6, and similarly to the above, it is difficult to match the screw insertion holes 15 of the heat sink 12 with the screw holes 1o of the heat sink 6, and as described above, the connection between the terminals 2 and the board 3 by the solder 5 is difficult. There is a problem with reliability, and moreover, heat is released to the heat sink 6 via the heat sink 12.
The drawback was that the heat dissipation effect was poor.
発明の目的
本発明の目的は、発熱部品を他の電子部品と同じ工程で
基板に取付けることができ、従って組立工数の削減を図
ることができ５寸だ発熱部品の信頼性の向上を図ること
ができるようにした発熱部品の数句装置を提供しようと
するものである。Purpose of the Invention The purpose of the present invention is to enable a heat generating component to be attached to a board in the same process as other electronic components, thereby reducing assembly man-hours and improving the reliability of a 5-inch heat generating component. The present invention is intended to provide a heat-generating component device that can perform the following functions.
発明の構成
本発明は、上記目的を達成するだめに、１個若しくは？
を数個の発熱部品の端子を回路接続するだめの基板に取
付け、上記発熱部品の放熱面に対応して基板に空所を形
成し、基板を放熱器に取付けると共に発熱部品側の放熱
面を放熱器の放熱面に当接させ、基板に押圧部材を取付
け、この抑圧部材の弾性片の先端部に設けた抑圧片によ
り弾性片の弾性を利用して発熱部品を放熱器に押圧した
ことを特徴とするものである。Structure of the Invention In order to achieve the above-mentioned object, the present invention has one or more objects.
Attach the terminals of several heat-generating components to a circuit board that will connect the circuit, form a space on the board corresponding to the heat-radiating surface of the heat-generating component, and attach the board to the heat radiator, and connect the heat-radiating surface of the heat-generating component side. A pressing member is attached to the substrate in contact with the heat radiating surface of the radiator, and the heat generating component is pressed against the radiator by using the elasticity of the elastic piece with the suppressing piece provided at the tip of the elastic piece of the suppressing member. This is a characteristic feature.
実施例の説明 以下、本発明の実施例を図面に基いて詳細に説明する。Description of examples Embodiments of the present invention will be described in detail below with reference to the drawings.
第３図及び第４図に示すように回路接続のだめの基板３
に２個の発熱部品１が背中合わせに取付けられる。即ち
基板３の孔４に発熱部品１の端子２が挿入され、ノ・ン
ダ５により取付けられている。この発熱部品１の取付け
は、他の電子部品１６，１７ｉ８のノ・ンダによる取付
作秦と同時に行われる。基板３はその隅部にネジ挿通孔
１９が形成され、このネジ挿通孔１９よりネジ２ｏが放
熱器６のボス２１に形成されたネジ孔２２に螺入され、
基板３が放熱器６に取付けられる。基板３には両放熱器
１の放熱片７の下側放熱面に跨って孔若しくは切欠によ
る空所２３が形成され、この空所２３が放熱器６に突設
された放熱台座２４に嵌合され、放熱片７の放熱面が放
熱台座２４の放熱面に載せられている。押圧部材２６は
金属製で基板２７の両側に側片２８が連設され、各側片
２８に弾性片２９が連設され、各弾性片２９の先端に抑
圧片３０が連設され゛ている。基板２了にはネジ挿通孔
３１が形成されている。この抑圧部利２５はそのネジ挿
通孔３１よりネジ３２が基板３のネジ孔（図示省略）に
螺入されて取付けられ５発熱部品１の放熱片７が弾性片
２９の弾性と利用して抑圧片３０により放熱台座２４に
押圧されて固定されている。As shown in Figures 3 and 4, the circuit board 3
Two heat generating components 1 are attached back to back. That is, the terminal 2 of the heat-generating component 1 is inserted into the hole 4 of the board 3 and attached with a solder 5. The heat generating component 1 is attached at the same time as the other electronic components 16, 17i8 are attached using a solder. A screw insertion hole 19 is formed in the corner of the board 3, and the screw 2o is screwed into the screw hole 22 formed in the boss 21 of the radiator 6 through the screw insertion hole 19.
The substrate 3 is attached to the heat sink 6. A cavity 23 formed by a hole or a notch is formed in the substrate 3 across the lower heat dissipation surfaces of the heat dissipation pieces 7 of both the radiators 1, and this cavity 23 is fitted into a heat dissipation pedestal 24 protruding from the radiator 6. The heat dissipation surface of the heat dissipation piece 7 is placed on the heat dissipation surface of the heat dissipation pedestal 24. The pressing member 26 is made of metal, and has side pieces 28 connected to both sides of a base plate 27, elastic pieces 29 connected to each side piece 28, and a suppressing piece 30 connected to the tip of each elastic piece 29. . A screw insertion hole 31 is formed in the board 2. This suppressing part 25 is attached by screwing a screw 32 into a screw hole (not shown) of the board 3 through the screw insertion hole 31, and the heat dissipating piece 7 of the heat generating component 1 is suppressed by using the elasticity of the elastic piece 29. It is pressed and fixed to the heat radiation pedestal 24 by the piece 30.
第６図及び第６図は本発明の他の実施例を示すものであ
る。本実施例にあっては、４個の発熱部品１を２個宛、
背中合わせに取付けるようにしだもので、押圧部材２５
の面側片２８の前後に各一対の弾性片２９を連設し、各
弾性片２９の先端に抑圧片３ｏを連設し、基板２７のネ
ジ挿通孔３１よりネジ３２を基板３のネジ孔（図示省略
）に螺入して押圧部桐２５を基板に取イτｊけることに
より各発熱部品１の放熱片７を弾性片２９の弾性を第１
」用して抑圧片３ｏにより放熱台座２４に押圧して固定
するようにしたものであり、その他の構成は前記実例と
同様である。6 and 6 show other embodiments of the present invention. In this embodiment, four heat-generating components 1 are sent to two
The pressing member 25 is designed to be attached back to back.
A pair of elastic pieces 29 are provided in series at the front and rear of the surface side piece 28, and a suppressing piece 3o is provided in series at the tip of each elastic piece 29, and the screw 32 is inserted into the screw hole 31 of the board 3 through the screw insertion hole 31 of the board 27. (not shown) and attaching the pressing part paulownia 25 to the board, the heat dissipating piece 7 of each heat generating component 1 is adjusted to the first elasticity of the elastic piece 29.
'', and is pressed and fixed to the heat dissipation pedestal 24 by the suppressing piece 3o, and the other configuration is the same as that of the previous example.
なお、抑圧部材２６の形状は、取付ける発熱ｇｂ品１の
個数に応じて変形することカーできる。Note that the shape of the suppressing member 26 can be changed depending on the number of heat generating Gb products 1 to be attached.
発明の効果
以上の説明より明らかなように本発明によれば、発熱部
品を抑圧部材によりその弾性をオリ用して放熱器に抑圧
固定するようにしているので、筐体放熱器へ発熱部品を
取付ける際、発熱部品の位置ずれが生じても、それを吸
収することカーできる。従って発熱部品を他の電子部品
と同じ工程で基板」二に組立てることができ組立工数の
削減を図ることができ、また端子に歪力による負担カニ
力１カ・らないので部品の信頼性を向上させることがで
きる等の利点がある。Effects of the Invention As is clear from the above explanation, according to the present invention, the heat generating component is suppressed and fixed to the heat radiator by using the elasticity of the suppressing member. Even if the heat-generating parts are misaligned during installation, it can be absorbed. Therefore, heat-generating components can be assembled on the board in the same process as other electronic components, reducing assembly man-hours. Also, since there is no strain on the terminals, the reliability of the components is improved. There are advantages such as being able to improve
第１図は従来の発熱部品の取付装置の要部断面図、第２
図は従来の発熱部品の取付装置の他の例を示す要部断面
図、第３図及び第４図は本発明の発熱部品の取付装置の
一実施例を示す要部斜視図とそのＩＶ−ＩＶ矢視断面図
、第５図及び第６図は本発明の他の実施例の要部斜視図
と押圧部材の余１視図である。
１・・・・・・発熱部品、２・・・・・端子、３・・・
・・・基板、６・・・・放熱器、７・・・・放熱片、２
４・・・・・・放熱台座、２５・・・・・押圧部材。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第２
図Figure 1 is a sectional view of the main parts of a conventional heat-generating component mounting device, Figure 2
FIG. 4 is a cross-sectional view of a main part showing another example of a conventional heat-generating component mounting device, and FIGS. 3 and 4 are perspective views of main parts and IV- 5 and 6 are a perspective view of a main part of another embodiment of the present invention and a perspective view of a pressing member. 1... Heat generating parts, 2... Terminals, 3...
... Board, 6 ... Heat sink, 7 ... Heat sink, 2
4... Heat radiation pedestal, 25... Pressing member. Name of agent: Patent attorney Toshio Nakao and 1 other person 2nd
figure
Claims (1)
めの基板に取付け、上記発熱部品の放熱面に対応して基
板に空所を形成し、基板を放熱器に取付けると共に発熱
部品側の放熱面を放熱器の放熱面に当接させ、基板に押
圧部材を取付け、この抑圧部材の弾性片の先端部に設け
た抑圧片により弾性片の弾性を利用して発熱部品を放熱
器に押圧したことを特徴とする発熱部品の増刊装置。Attach the terminals of one or more heat generating components to a circuit board to which the circuit is connected, form a void on the board corresponding to the heat radiation surface of the heat generating component, and attach the board to the heat radiator and heat radiation from the heat generating component side. A pressing member was attached to the board with the surface in contact with the heat radiating surface of the radiator, and the heat generating component was pressed against the radiator by using the elasticity of the elastic piece with the suppressing piece provided at the tip of the elastic piece of the suppressing member. A reprint device for heat-generating parts, which is characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58141332A JPS6032397A (en) | 1983-08-01 | 1983-08-01 | Device for mounting heat generating component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58141332A JPS6032397A (en) | 1983-08-01 | 1983-08-01 | Device for mounting heat generating component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6032397A true JPS6032397A (en) | 1985-02-19 |
Family
ID=15289481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58141332A Pending JPS6032397A (en) | 1983-08-01 | 1983-08-01 | Device for mounting heat generating component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6032397A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6771509B2 (en) | 1992-05-20 | 2004-08-03 | Seiko Epson Corporation | Cartridge for electronic devices |
| US7804688B2 (en) | 1992-05-20 | 2010-09-28 | Seiko Epson Corporation | Apparatus including processor |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS541370B2 (en) * | 1974-11-13 | 1979-01-24 |
-
1983
- 1983-08-01 JP JP58141332A patent/JPS6032397A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS541370B2 (en) * | 1974-11-13 | 1979-01-24 |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6771509B2 (en) | 1992-05-20 | 2004-08-03 | Seiko Epson Corporation | Cartridge for electronic devices |
| US6845014B2 (en) | 1992-05-20 | 2005-01-18 | Seiko Epson Corporation | Cartridge for electronic devices |
| US7035108B2 (en) | 1992-05-20 | 2006-04-25 | Seiko Epson Corporation | Information processing device |
| US7345883B2 (en) | 1992-05-20 | 2008-03-18 | Seiko Epson Corporation | Processing device |
| US7359202B2 (en) | 1992-05-20 | 2008-04-15 | Seiko Epson Corporation | Printer apparatus |
| US7583505B2 (en) | 1992-05-20 | 2009-09-01 | Seiko Epson Corporation | Processor apparatus |
| US7804688B2 (en) | 1992-05-20 | 2010-09-28 | Seiko Epson Corporation | Apparatus including processor |
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