JPS6033781U - connection device - Google Patents

connection device

Info

Publication number
JPS6033781U
JPS6033781U JP10166084U JP10166084U JPS6033781U JP S6033781 U JPS6033781 U JP S6033781U JP 10166084 U JP10166084 U JP 10166084U JP 10166084 U JP10166084 U JP 10166084U JP S6033781 U JPS6033781 U JP S6033781U
Authority
JP
Japan
Prior art keywords
leads
terminals
connection
soldering
flexible film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10166084U
Other languages
Japanese (ja)
Other versions
JPH019105Y2 (en
Inventor
猪原 章夫
久雄 川口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP10166084U priority Critical patent/JPS6033781U/en
Publication of JPS6033781U publication Critical patent/JPS6033781U/en
Application granted granted Critical
Publication of JPH019105Y2 publication Critical patent/JPH019105Y2/ja
Granted legal-status Critical Current

Links

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  • Manufacturing Of Electrical Connectors (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案実施例を説明する平面図である。第2図
は本考案実施例の熱線源送り手段を説明する斜視図であ
る。第3図は赤外線小型スポットランプの断面図である
。第4図は本考案実施例による接続における接着力を説
明する図である。 第5図は本考案実施例による接着力の測定例を示す図で
ある。第6図は従来例の構成を示す半分断面図である。 第7図は従来例の構成を示す半断面側面図である。第8
図は従来例の接続装置において熱線を照射するプログラ
ムである。 1・・・赤外線小型スポットランプ、2・・・駆動部、
3・・・送りネジ、4・・・ガイド軸、5・・・往復台
、6・・・リレー装置、21・・・容器、27・・・フ
ィルム、28・・・気密室、30・・・クリップ、33
・・・硬質の基板、34・・・可撓性の基板。 第6図 第7図
FIG. 1 is a plan view illustrating an embodiment of the present invention. FIG. 2 is a perspective view illustrating the hot ray source feeding means according to the embodiment of the present invention. FIG. 3 is a sectional view of a small infrared spot lamp. FIG. 4 is a diagram illustrating the adhesive force in the connection according to the embodiment of the present invention. FIG. 5 is a diagram showing an example of measuring adhesive force according to an embodiment of the present invention. FIG. 6 is a half sectional view showing the configuration of a conventional example. FIG. 7 is a half-sectional side view showing the configuration of a conventional example. 8th
The figure shows a program for irradiating heat rays in a conventional connection device. 1... Infrared small spot lamp, 2... Drive unit,
3... Feed screw, 4... Guide shaft, 5... Carriage table, 6... Relay device, 21... Container, 27... Film, 28... Airtight chamber, 30...・Clip, 33
... Rigid substrate, 34... Flexible substrate. Figure 6 Figure 7

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 複数の接続用リードをもつ可撓性フィルムと、そのリー
ドと重なり合う複数の接続用端子をもつ基板のリード・
端子間を接続する接続装置であって、上記可撓性フィル
ムの上に上記基板を重ね合わせて固定し、上記可撓性フ
ィルムの下面に静水圧を作用させ、上記基板上方に設け
た熱線源の熱線を上記複数個のリード・端子のうちの特
定のものに集光させてそのリード・端子間を半田付は接
続し、次に上記熱線源を移動させて接続済みのリード・
端子に隣接した次のリード・端子間を半田付は接続し、
同様にして順次半田付は接続を行って接続部分を熱源の
走査方向へ拡大し、全リード・端子間の接続を完了する
ことを特徴とする接続装置。
A flexible film with multiple connection leads and a board lead with multiple connection terminals that overlap the leads.
A connection device for connecting terminals, wherein the substrate is superimposed and fixed on the flexible film, hydrostatic pressure is applied to the lower surface of the flexible film, and a heat ray source is provided above the substrate. The hot wire is focused on a specific one of the plurality of leads/terminals, the leads/terminals are connected by soldering, and then the hot wire source is moved to connect the already connected leads/terminals.
Soldering connects the next lead and terminal adjacent to the terminal,
A connection device characterized in that soldering is performed in a similar manner in order and the connection portion is expanded in the scanning direction of the heat source to complete the connection between all leads and terminals.
JP10166084U 1984-07-04 1984-07-04 connection device Granted JPS6033781U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10166084U JPS6033781U (en) 1984-07-04 1984-07-04 connection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10166084U JPS6033781U (en) 1984-07-04 1984-07-04 connection device

Publications (2)

Publication Number Publication Date
JPS6033781U true JPS6033781U (en) 1985-03-07
JPH019105Y2 JPH019105Y2 (en) 1989-03-13

Family

ID=30239975

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10166084U Granted JPS6033781U (en) 1984-07-04 1984-07-04 connection device

Country Status (1)

Country Link
JP (1) JPS6033781U (en)

Also Published As

Publication number Publication date
JPH019105Y2 (en) 1989-03-13

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