JPS6035528A - Inspection device - Google Patents

Abstract

PURPOSE:To enable to have a lead and a terminal to come in contact by pressure at all time by a method wherein the external lead of an IC is provided in such a manner that the pressurizing block with which the external lead of an IC will be contacted by applying pressure will perform a two-stage reciplocal movement and, at the same time, a position inspecting means of the IC is provided. CONSTITUTION:The pushrod 19 of a pressurizing block 16 pushes down a guide rod 11 by the extending movement of the first cylinder device 14 of an FPP type IC autohandler. The receptacle member 9 of an IC1 comes down the first stage to the prescribed position, and the lead 3 of the IC1 lightly comes in preliminary contact with a terminal 7 on a socket 4. When there is a deviation in contacting condition, a position detecting device 21 equipped with a projectors 22x, 22y and 22d and light-receiving devices 23x, 23y and 23d detects the degree of inclination of the IC1, the first cylinder device 14 performs a reciplocal movement again, and the position of the IC1 is readjusted. The second cylinder device 15 performs an extending movement, the pressurizing block 16 comes down the second stage, and a lead presser presses the IC lead 3 with the prescribed energizing force on a terminal 7.

Description

[Detailed Description of the Invention] [Technical Field] The present invention relates to inspection technology, particularly to electronic components such as semiconductor devices (
Hereinafter referred to as IC. The present invention relates to a technique for bringing the external lead of a device into pressure contact with a terminal for measurement, etc., and is effective for use in an autohandler for a flat bank pancake (hereinafter referred to as PPP) type IC, for example.

[Background Art] There is a demand for the development of an autohandler that can automatically perform screening inspections on FPP type ICs.

In FPP type ICs, the external leads protrude axially from the pan cage in all directions, so it is necessary to push the external leads so that they touch the terminals at right angles, and also to press the external leads from the opposite side with a pressure piece to bring them into pressure contact with the terminals. There is,
Furthermore, the inventor of the present invention has clarified the problem that poor contact is likely to occur, and thus it is necessary to deal with poor contact.

[Object of the Invention] An object of the present invention is to provide an inspection technique that can press a lead into contact with a terminal under pressure and can also deal with poor contact.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Summary of the Invention] A brief overview of typical inventions disclosed in this application is as follows.

In other words, two pressure pieces are used to push the lead into contact with the terminal.
The IC receiver is provided so that it can reciprocate in stages, and the IC receiver is provided so that the member is linked to the pressurizing piece. Also, by providing a means for detecting the posture of the IC, preliminary contact is made between the lead and the terminal in the first stage of the stroke. Then, when a good posture is detected in this state, the second stroke is executed to make the main pressurized contact.

[Example] Fig. 1 is a longitudinal sectional view showing an FPP type IC autohandler which is an embodiment of the present invention, Fig. 2 is a longitudinal sectional view showing its operating state, and Fig. 3 is a longitudinal sectional view taken along the line m-m in Fig. 2. Plane sectional view along the line, 4th
The figure is a vertical sectional view taken along line IV--IV in FIG. 3, and FIG. 5 is a vertical sectional view showing another operating state.

In this embodiment, the ICI as an electronic component to be subjected to selection inspection includes a PPP 2 formed in a square flat board, and a plurality of beams 3 are arranged axially on each of the four sides of the FPP 2. are protruding from each.

The lead 3 is bent in a zigzag shape at the middle portion, and usually the direction of the bend is on the lower side.

This handler is equipped with a socket 4 installed horizontally, and a cavity 5 capable of accommodating an I (1) is formed in the center of the socket 4. A plurality of terminals are provided at the bottom 6 of the cavity 5. 7 are arranged upright on four sides so as to correspond to the ICI board 3, and the terminals 7 are connected to a tester (not shown) for carrying out a screening test. Although omitted, each terminal 7 is fitted into a guide groove to prevent it from falling sideways.

A rod 8 is disposed on the center line of the empty space 5 of the socket 4 so as to be movable up and down in the direction of the center line (hereinafter referred to as the vertical direction), and the FPP 2 of the IC 1 is mounted on the upper end of the rod 8. A receiving member 9 is fixed horizontally. A horizontal member 10 is horizontally fixed to the lower end of the rod 8.
A plurality of guide rods 11 are vertically erected at both ends of the rod. The guide rod 11 is slidably inserted into a guide hole 12 formed perpendicularly to the socket 4, and is always held in place by a first spring 13 sandwiched between the guide rod 11 and the upper surface of the socket.
Encouraged by niggas.

A first cylinder device 14 with a long stroke is installed vertically above the socket 4, and its piston rod 1
A second cylinder device 15 having a short stroke is coaxially suspended from the lower end of 4a. A pressure piece 16 is fixed to the lower end of the piston rod 15a of the second cylinder 15, and a lead presser 17 is provided protruding from the lower surface of the pressure piece 16 around the periphery. A heater 18 as a heating means is provided in the center of the lower surface of the pressure piece 16, and the heater 18 is configured to heat the FPP 2 of the IC 1 to a predetermined temperature. A plurality of bushing rods 19 are provided on the side of the pressure piece 16.
are disposed so as to face the guide rods 11, respectively, and are suspended so as to be vertically movable. Butsch rod 19
A second spring 20 is mounted on the outside so as to urge the second spring 20 downwardly, and the strength of the second spring 20 is set to be stronger than that of the first spring 13.

In the horizontal plane passing near the upper end of the group of terminals 7, there is an attitude detection device 2 for detecting the attitude of the ICI in the vertical direction (Z direction).
1 is provided. This device 2■ consists of 3 sets of emitters (light emitting diodes, etc.) and receivers (photosensors, etc.) 22x and 2
Equipped with 3x, 22y and 23y, 22d and 23d,
Each set of emitter and receiver has three sets of through holes 24
They are respectively disposed outside the socket 4 so as to face each other through 4y and 24d.

On the remaining diagonal of the socket 4, the direction of rotation of the ICI (
A positioning device 25 is provided for determining the position in the θ direction). This positioning device is equipped with a pair of correction pieces 26, and both pieces 26 are slidably fitted into a pair of guides 27 bored diagonally at a predetermined height of Sogano L-4. . A positioning groove 28 is cut in the inner tip of the correction piece 26 in the shape of a right-angled ■ groove so as to match the corner of the FPP 2 of IcI. A return spring 29 is interposed between the correction piece 26 and the guide 27 so as to always urge the correction piece outward.

A driven side direction conversion member 3° is fixedly erected on the upper surface of the correction piece 26, and an extension surface is provided at the upper end of this member 3o. 3
1, so that the correction piece 26 is pushed inward.

Next, the action will be explained.

When the ICI is carried directly above the socket 4 by the transfer device 32, as shown in FIG. ing. When the holding of the moving device 32 is released, the ICI is quietly transferred onto the receiving member 9.

When the ICI is delivered, the first cylinder device 14 is extended and the pressure piece 16 is moved to the first position, as shown in FIG.
Steps are lowered. Due to this lowering, the bushing rod 19 of the pressurizing piece 16 abuts against the guide rod 11, and since the first spring 13 is set to be weaker than the second spring 20, the guide rod 11 is pushed down. Accordingly, the receiving member 9 integrated with the guide rod 11 is lowered by the first step to a predetermined position. By this first step of lowering, the ICI glue part 3 received by the member 9 of the receiver comes into a state in which it makes preliminary contact with the terminal 7 of the socket 4.

On the other hand, as shown in FIGS. 3 and 4, as the pressure piece 16 descends to the first stage, the pair of correction pieces 26
are slid inward by a set distance that is equal to each other, and lightly applies a counterforce to the diagonal corners of the FPP 2 of the IC. At this time, since the positioning grooves 28 of the correction piece 26 are aligned with the diagonals of the PPP 20, the position W (attitude) of the ICI placed on the receiver member 9 in the θ direction can be determined correctly.

When the IC lead 3 is in contact with the terminal 7, if there is deviation, the ICI will be tilted about 1 in the height direction. In this way, when the ICI is tilted in the height direction, three sets of projectors 22x, 22F, 22d on the X and Y axes and diagonally
Since at least one of the light emitted in is blocked by a part of the ICI, three sets of light receivers 23x,
No light reception is detected in at least one of 23y and 23d. When such a non-light receiving state is detected, the ICI is tilted, and it is determined that the contact between the lead 3 and the terminal 7 is defective.

Upon detection of this poor contact, the first cylinder device 14 is once shortened and then extended again. Due to this reciprocating movement, the member 9 of the receiver is raised and lowered, and the correction piece 26
is moved outward and inward. This combined operation causes the ICI to readjust its posture in the height direction and rotational direction. This adjustment operation is performed until the attitude of the ICI is corrected or a preset number of times is completed. If the posture of the IC is not corrected, it is determined that there is a defect in the FPP 2 or the lead 3, and the IC is removed from the socket 4 by the transfer device 32 or the like as a defective product.

When light reception is detected in all of the light receivers 23x, 23y, and 23d, the second cylinder device 15 is extended and the pressure piece 16 is lowered to the second stage, as shown in FIG. As a result, the lead presser 17 of the pressure piece 16 is
7- Hold down the wire 3 and press it into contact with the terminal 7 with a predetermined biasing force. Further, the heater 18 of the pressure piece 16 heats the FPP 2 of the ICI to a predetermined temperature. In order for this heating to be carried out effectively, it is desirable that the ICI be delivered onto the receiving part jrA9 in the opposite direction (with the lower surface facing upward).

Incidentally, if the ICI is transferred in the opposite direction, the center of gravity will be lowered, so that the above-mentioned attitude detection of the IC1 will also be effectively executed.

In this way, when the lead 3 is brought into contact with the terminal 7 under pressure and the PPP 2 is heated to a predetermined temperature, a test signal is input from the tester to the terminal 7 and a predetermined test is executed as appropriate.

After the inspection, when the first and second cylinder devices 14 and 15 are shortened, the pressure piece 16 is raised, the member 9 of the receiver is raised by the first spring 13, and the correction ring 26 is moved by the return spring 29. pushed back outwards. The IC 1 on the receiver member 9 is transferred to a predetermined location by the transfer device 32 or the like, and the sorting inspection is completed.

After that, the above operation is repeated until 1? Screening tests for PP type ICs will be carried out automatically and individually.

[Effects] (1) By providing the pressure piece so as to reciprocate in two stages, providing the electronic component receiver so that the member is interlocked with the pressure piece, and further providing means for detecting whether the posture of the electronic component is good or bad. , the first stage stroke brings the lead of the electronic component into preliminary contact with the terminal, and it is possible to detect whether the electronic component's posture is good or bad at this time, so the lead and terminal are always properly pressurized when the second stage stroke is performed. can be brought into contact.

(2) By configuring the pressurizing piece to have a two-step stroke, the terminal side can be made into a fixed structure, so the electrical wiring structure etc. can be simplified and the electronic components can be received. Sufficient space can be secured for delivery to the members.

(3) The electronic component receiver can correct the orientation of the electronic component in the direction of rotation by providing a pair of correction wheels on the outside of the member so as to apply a counterforce to the electronic component. There is no need to provide a guide protrusion for positioning the electronic component on the member, improving the efficiency of positioning work. Furthermore, since positioning is not performed by a group of lead tips, accurate positioning can be ensured without being affected by lead bending errors.

(4) By linking the correction wheel with the reciprocating movement of the pressure piece, preliminary contact between the leads and terminals, and the ma/rank between the pressure contact action and the posture correction action can be easily and accurately performed. .

(5) When a poor posture of an electronic component is detected, the receiver re-corrects the posture of the electronic component by reciprocating the member and pressure piece. There is no need to start over from the beginning to replace the
The efficiency of the entire work will be improved.

(6) By providing a heating means on the pressure piece, the heating means on the terminal side can be omitted, so the length of the terminal can be shortened, and therefore electrical property tests on high-frequency electronic components can also be performed. That is, if the terminals are long, the line capacitance increases, making it impossible or difficult to test the electrical characteristics of high-frequency electronic components.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Nor.

For example, the heating means is not limited to being provided on the pressure piece, but the receiver may be provided on the member or both of them.

The means for detecting the posture of electronic components is not limited to optical means.
You can also use a micro switch etc.
At least one
Sometimes it is sufficient to set it up.

The correction wheel is not limited to being linked to the heating piece, and the receiver may be configured to move automatically when the electronic component on the piece comes to a predetermined position.

The cooperation structure between the pressurizing piece and the receiving member is not limited to the cooperation structure using the bushing rod and the guide rod.

The driving means for the pressurizing piece is not limited to a cylinder device, but a binion rank device, a feed screw device, etc. can be used.

Field of Application] In the above explanation, the invention made by the present inventor was mainly applied to an autohandler of an FPP type IC, which is the field of application that formed the background of the invention, but it is not limited to this, and for example, It can be used in cases where the leads of axial lead type resistors, capacitors, single inline packaged ICs, dual inline packaged ICs, etc. are brought into pressure contact with the foot terminals.

[Brief explanation of the drawing]

Fig. 1 is a longitudinal cross-sectional view showing an embodiment of the present invention, Fig. 2 is a longitudinal cross-sectional view showing its operating state, Fig. 3 is a plan cross-sectional view taken along line m-m in Fig. 2, and Fig. 4 is a longitudinal cross-sectional view showing an embodiment of the present invention. Fig. 3 is a longitudinal sectional view taken along the line IV-IV, and Fig. 5 is a longitudinal sectional view showing another operating state.
... IC (electronic component), 3... Lead, 4... Socket, 5... Blank space, 7... 9... Terminal, 8... Rod, 9... Receiver is a member, 10 ...Horizontal member, 11...
Guide rod, 13, 20° 29...Spring, 1
4.15... Cylinder device, 16... Pressure piece, 17
...Lead holder, 18...Heater, 19...Bushion rod, 21...Position detection device, 22x, 2
2y. 22d--Emitter, 23x, 23y, 23d--Receiver, 25--Positioning device, 26--Correction piece, 2
7...Guide, 28...Positioning groove, 30.31.
...Direction changing member. Figure 1 Figure 6 10 Figure 2 Figure 3 Figure 4

Claims (1)

[Scope of Claims] 1. A pressure piece that presses the lead of an electronic component to contact a terminal is provided so as to reciprocate in two stages, and a receiving member for receiving this electronic component is provided in conjunction with this pressure piece, Further, the inspection device is provided with an attitude detection means for detecting the attitude of the electronic component. 2. The inspection device according to claim 1, wherein the pressure piece is capable of heating an electronic component. 3. A pressure piece that pushes the lead of an electronic component into contact with the C terminal is provided so as to move back and forth in two steps, and a receiving member for receiving this electronic component is provided in conjunction with this pressure piece. An inspection device comprising a pair of correction pieces located outside the member so as to apply an equal opposing force (=J force) to the electronic component. 4. The correction pieces are linked to a pressure piece. An inspection device according to claim 3.