JPS6039251U - Cooling structure for electronic components - Google Patents
Cooling structure for electronic componentsInfo
- Publication number
- JPS6039251U JPS6039251U JP13042283U JP13042283U JPS6039251U JP S6039251 U JPS6039251 U JP S6039251U JP 13042283 U JP13042283 U JP 13042283U JP 13042283 U JP13042283 U JP 13042283U JP S6039251 U JPS6039251 U JP S6039251U
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- cooling structure
- heat
- fins
- heat sinks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来例を示す斜視図、第2図は第1図における
結合部を示す拡大側断面図、第3図は本考案の一実施例
を示す分解斜視図、第4図は第3図における組立てた状
態の部分的拡大平面図である。
1・・・電力用トランジスタ、5・・・絶縁シート、6
・・・第1ヒートシンク、6a・・・フィン、6b・・
・空洞、7・・・第2ヒートシンク、7a・・・フィン
、8・・・固定ネジ。FIG. 1 is a perspective view showing a conventional example, FIG. 2 is an enlarged side sectional view showing a joint in FIG. 1, FIG. 3 is an exploded perspective view showing an embodiment of the present invention, and FIG. 4 is a third It is a partially enlarged plan view of the assembled state in a figure. 1... Power transistor, 5... Insulating sheet, 6
...first heat sink, 6a...fin, 6b...
-Cavity, 7...Second heat sink, 7a...Fin, 8...Fixing screw.
Claims (1)
部品の放熱を行なう電子部品の冷却構造において、前記
複数の電子部品を二つのヒートシンクで挾持し、前記二
つのヒートシンクは互いに向きが水平方向と垂直方向に
直交するようにフィンを形成したことを特徴とする電子
部品の冷却構造。In an electronic component cooling structure in which a plurality of heat-generating electronic components are attached to a heat sink to dissipate heat from the electronic components, the plurality of electronic components are sandwiched between two heat sinks, and the two heat sinks are oriented horizontally and vertically to each other. A cooling structure for electronic components characterized by having fins formed perpendicular to the fins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13042283U JPS6039251U (en) | 1983-08-25 | 1983-08-25 | Cooling structure for electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13042283U JPS6039251U (en) | 1983-08-25 | 1983-08-25 | Cooling structure for electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6039251U true JPS6039251U (en) | 1985-03-19 |
Family
ID=30295190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13042283U Pending JPS6039251U (en) | 1983-08-25 | 1983-08-25 | Cooling structure for electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6039251U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03143512A (en) * | 1989-09-15 | 1991-06-19 | Pall Corp | Filter device having bypass-free sealed end |
-
1983
- 1983-08-25 JP JP13042283U patent/JPS6039251U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03143512A (en) * | 1989-09-15 | 1991-06-19 | Pall Corp | Filter device having bypass-free sealed end |
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