JPS604225A - Method for removing resin burr in resin mold semiconductor device - Google Patents

Abstract

PURPOSE:To remove the resin burrs of leads of a frame or between the leads easily in a short time by irradiation with laser beam. CONSTITUTION:Irradiation with laser beam removes the resin burrs of leads of a frame or between the leads. For example, a transporting member which is intermittently actuated transports a resin-mold semiconductor device 3 to place it right under a mask 14. Subsequently, a laser oscillator is actuated to project the laser beam 17 which goes through a deflecting member 12, a condensing lens 13 and slits 16, 16 of the mask 14 to irradiate the resin burrs 5... on the leads 4 or between the leads 4 of the semiconductor device 3 and to remove them by sublimation.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method for removing resin debris from a resin-sealed semiconductor device.

[Technical background of the invention]

A resin-sealed semiconductor device, for example, a flat-pack type semiconductor device, has a structure in which a semiconductor element (not shown) mounted on a frame 1 is sealed with a resin layer 2, as shown in FIG. Normally, a semiconductor device having such a structure is encapsulated with resin by housing a frame on which a semiconductor element is mounted in a molding mold, and then injecting a resin such as epoxy resin into the mold to seal the element in a resin layer. A method of sealing is used. However, in such a resin sealing process,
Since 1 fat burrs 5 are generated on and between the leads 4 of the frame 1 near the resin layer 2, a step of removing the burrs 5 is required as a post-processing.

For this reason, in the past, there were two methods: ■Remove the cracks by rubbing with a brush, ■Remove the cracks by spraying with glass beads, etc., and ■Mechanically remove the cracks when cutting and bending outleads. How to crush and remove
is being carried out.

[Problems with background technology]

However, it is difficult to completely remove paris in a short period of time using the methods (1) to (2) above, and complete removal requires a long processing time.

[Purpose of the invention]

SUMMARY OF THE INVENTION The present invention provides a method for removing resin debris from a resin-sealed semiconductor device by which resin debris deposited on and between the leads of a frame can be removed easily and in a short amount of time.

[Summary of the invention]

The present invention is mounted on a frame'2, /1. In a semiconductor device having a structure in which a semiconductor element is sealed with a resin layer, a laser beam is irradiated on the lead J and the resin pars between the leads in order to remove the resin pars adhered on and between the leads of the frame. The main idea is to completely remove resin debris easily and in a short time by doing this.

[Embodiments of the invention]

Hereinafter, embodiments of the present invention will be described and explained with reference to FIGS. 2 and 3.

The number 11 laser in the figure is an oscillator, and a direction changing member 12 having a mirror that directs the laser beam downward is disposed on the laser beam output side of the oscillator 11. A condenser lens system 13 is disposed below the direction changing member 12, and a mask 14 is further disposed below the condensing lens system 13.

As shown in FIG. 3, this mask 14 is formed of a mask substrate 15 and slits (light-transmitting portions) 16, each having an opening corresponding to the shape of a lead of a semiconductor device to be processed on this substrate 15. .

Next, the method for removing resin debris of the present invention will be explained.

First, the resin-sealed semiconductor devices shown in FIG. 1 are transported by a transport member that is driven intermittently, and the device is positioned directly in front of the mask 14 as shown in FIG. Next, the laser oscillator is turned on to emit the laser beam 17, and the direction changing member 12, the condensing lens system 13, and the slit 1 of the mask 14 are
6. Through 16, the resin particles 5 on and between the leads 4 of the semiconductor device 1 are irradiated and removed by sublimation.

Therefore, in the present invention, since the resin particles are sublimated by the high energy of the laser beam, the resin particles can be removed easily and in a short time.

It should be noted that the present invention is not limited to the removal of resin debris from a flat type semiconductor device as shown in FIG. 1, but can be similarly applied to the removal of resin debris from a D-type semiconductor device, etc.

〔Effect of the invention〕

As described in detail above, according to the present invention, it is possible to easily and quickly remove the resin adhering on the leads of the frame and between the IJs 17, and to improve the productivity of the resin-sealed semiconductor device. (j, (0 that can provide a method for removing greasy flakes)

[Brief explanation of drawings]

FIG. 1 is a perspective view showing a flat nine-piece resin-sealed semiconductor device to which resin particles are attached, and FIG. 2 is a schematic diagram showing one form of a resin particle removal device used in the method of the present invention.
FIG. 3 is a perspective view of a mask incorporated into the apparatus of FIG. 2; 1...Frame, 2...Resin layer, J...Semiconductor device, 4...')''% 5...IF fat pad, 1 No....Laser oscillator, 12.One-way conversion Parts, No. 4...
・Mask, 17...Laser light.

Claims (1)

[Claims] In a semiconductor device having a structure in which a semiconductor element mounted on a frame is sealed with a resin layer, a laser beam is applied to the resin particles on the leads and between the leads in order to remove the resin particles attached on and between the leads of the frame. A method for removing resin pars from a resin-sealed semiconductor device, the method comprising removing resin particles by irradiating light over a long period of time.