JPS60455A - photoconductive member - Google Patents

photoconductive member

Info

Publication number
JPS60455A
JPS60455A JP10785083A JP10785083A JPS60455A JP S60455 A JPS60455 A JP S60455A JP 10785083 A JP10785083 A JP 10785083A JP 10785083 A JP10785083 A JP 10785083A JP S60455 A JPS60455 A JP S60455A
Authority
JP
Japan
Prior art keywords
photoconductive
layer
photoconductive member
photoconductive layer
amorphous silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10785083A
Other languages
Japanese (ja)
Inventor
Naoko Kamata
直子 鎌田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP10785083A priority Critical patent/JPS60455A/en
Publication of JPS60455A publication Critical patent/JPS60455A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03GELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G5/00Recording-members for original recording by exposure, e.g. to light, to heat or to electrons; Manufacture thereof; Selection of materials therefor
    • G03G5/02Charge-receiving layers
    • G03G5/04Photoconductive layers; Charge-generation layers or charge-transporting layers; Additives therefor; Binders therefor
    • G03G5/08Photoconductive layers; Charge-generation layers or charge-transporting layers; Additives therefor; Binders therefor characterised by the photoconductive material being inorganic

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photoreceptors In Electrophotography (AREA)

Abstract

PURPOSE:To obtain a photoconductive member of which the electrical, optical and photoconductive characteristics are uniform over the entire part and with which a sharp image is obtd. with high resolution by suppressing the ruggedness on the surface of a photoconductive layer consisting of amorphous silicon composed essentially of Si within a specific range with respect to the thickness of the photoconductive layer. CONSTITUTION:A photoconductive layer 102 consisting of amorphous silicon composed essentially of Si and contg. H and halogen is formed on a base 101 to form a photoconductive member (photosensitive drum, etc.) 100 or a barrier layer 103 is provided by incorporating the III group, V group, O, C, etc. therein is provided on the base 101 and the layer 102 and a surface barrier layer 104 consisting of amorphous silicon contg. much C, N, etc. are successively laminated thereon to form the member 100. The ruggedness on the surface of the layer 102 or 104 with such photoconductive member is made max. <=1/2 for each 2.5mm. reference length of the surface roughness in accordance with JIS B0601 with respect to the average thickness of the layer 102. Then the photoconductive member which decreases the change in the surface roughness upon repetition of the repetitive electrostatic charging, exposing and developing, provides the stable image for a long period of time and has good cleaning property is obtd.

Description

【発明の詳細な説明】 本発明は、光(ここでは広義の光で、紫外光線、可視光
線、赤外光線、X線、γ線等を示す)のような電磁波に
感受性のある光導電部材に関する。
Detailed Description of the Invention The present invention relates to a photoconductive member that is sensitive to electromagnetic waves such as light (herein, light in a broad sense refers to ultraviolet light, visible light, infrared light, X-rays, gamma rays, etc.). Regarding.

固体撮像装置、あるいは像形成分野における電子写真用
像形成部材や原稿読取装置における光導電層を形成する
光導電材料としては、高感度で。
It is a highly sensitive photoconductive material that forms the photoconductive layer in solid-state imaging devices, electrophotographic image forming members in the image forming field, and document reading devices.

SN比[光電流(Ip) / (Id)、 ]が高く、
照射する電磁波のスペクトル特性にマツチングした吸収
スペクトル特性を有すること、光応答性が速く、所望の
暗抵抗値を有すること、使用度において人体に対して無
公害であること、更には固体撮像装置においては、残像
を所定時間内に容易に処理することができること等の特
性が要求される。殊に、事務器としてオフィスで使用さ
れる電子写真装置内に組込まれる電子写真用像形成部材
の場合には、上記の使用時における無公害性は重要な点
である。
The SN ratio [photocurrent (Ip) / (Id), ] is high,
It has absorption spectral characteristics that match the spectral characteristics of electromagnetic waves to be irradiated, has fast photoresponsiveness, has a desired dark resistance value, is non-polluting to the human body when used, and is suitable for solid-state imaging devices. This requires characteristics such as being able to easily process afterimages within a predetermined time. Particularly, in the case of an electrophotographic image forming member incorporated into an electrophotographic apparatus used in an office as a business machine, the above-mentioned non-polluting property during use is an important point.

このような観点に立脚して最近注目されている光導電材
料に、水素やハロゲン原子等の一価の元素でタングリン
グポンドが修飾されたアモルファスシリコン(以後a−
Siと表記する)があり、例えば独国公開第27489
67号公報、同第2855718号公報には電子写真用
像形成部材への応用が、また。
Based on this viewpoint, amorphous silicon (hereinafter referred to as a-
For example, German Publication No. 27489
No. 67 and No. 2855718 also disclose applications to electrophotographic image forming members.

独国公開第2933411号公報には光電変換読取装置
への応用がそれぞれ記載されており、その優れた光導電
性、対振性、耐熱性及び大面積化が比較的容易であるこ
とから電子写真用像形成部材への応用が期待されている
German Published Publication No. 2933411 describes its application to photoelectric conversion/reading devices, and because of its excellent photoconductivity, resonance properties, heat resistance, and relatively easy expansion into large area, it is suitable for electrophotography. It is expected to be applied to image forming members for use in other applications.

しかしながら、a−9iはそれ単独では暗抵抗値が電子
写真用像形成部材として用いるには十分高くなく、基体
からの電荷注入を阻止するための阻止層を配したり、添
加物をドープして高抵抗化を図る場合が多い。
However, the dark resistance value of a-9i alone is not high enough to be used as an electrophotographic image forming member, and a-9i is not coated with a blocking layer to prevent charge injection from the substrate or doped with additives. In many cases, high resistance is sought.

また、光導電部材の全層に亘る均一性も上記のa−Si
層の高抵抗と同様に重要な問題の一つで、例えば光導電
部材に光導電層の厚さムラがあるような場合、厚い部分
と薄い部分とで画像に濃度ムラが生じたり、光導電層形
成時の成長速度の違いにより光導電層の電気的、光学的
、光導電的特性に差が生じたりする。更に、光導電層表
面にピンホール等の欠陥が存在する場合もその部分に画
像の白抜けが生じ美麗な画像が得らない等1画質面で問
題が生ずる場合が多い。
Further, the uniformity over the entire layer of the photoconductive member is also improved by the above-mentioned a-Si.
This is one of the important problems as well as the high resistance of the layer. For example, if there is uneven thickness of the photoconductive layer in a photoconductive member, density unevenness may occur in the image between thicker and thinner areas, and the photoconductive layer may be uneven. Differences in growth rate during layer formation may cause differences in electrical, optical, and photoconductive properties of the photoconductive layer. Furthermore, when defects such as pinholes are present on the surface of the photoconductive layer, problems often arise in terms of image quality, such as white spots in the image occurring in the defective areas and the failure to obtain beautiful images.

また、単に光導電部材の表面に微細な凹凸があるような
場合でも、クリーニングの際にクリーニングブレードを
摩耗したり、トナーの融着によってクリーニング不良を
起したりするばかりでなく、コロナ照射の際、凸部に異
常放電が発生して画質が大きく損なわれる場合がある。
Furthermore, even if the surface of the photoconductive member has minute irregularities, it not only wears out the cleaning blade during cleaning or causes cleaning failure due to toner adhesion, but also causes damage during corona irradiation. , abnormal discharge may occur in the convex portion, resulting in a significant loss of image quality.

本発明者等の検討によれば、そもそも光導電層に凹凸が
生じるような製造条件は、表面の凹凸それ自体の問題に
留らず、他の電気的、光学的、光導電的特性要因にも波
及的に悪影響を及ぼす場合が多く1例えば帯電電位、S
N比、更には画像流れの問題等にも深くかかわっている
。また、光導電層がプラズマCVD法等の特殊な製造法
により製造されるということに基づく特徴ともいえるが
、このような光導電層に凹凸の発生は、微妙な製造条 
According to the studies of the present inventors, the manufacturing conditions that cause unevenness in the photoconductive layer are not limited to the surface unevenness itself, but are also caused by other electrical, optical, and photoconductive characteristic factors. 1. For example, charged potential, S
It is deeply involved in issues such as the N ratio and even image deletion. In addition, this can be said to be a characteristic based on the fact that the photoconductive layer is manufactured using a special manufacturing method such as plasma CVD, but the occurrence of such unevenness on the photoconductive layer is due to delicate manufacturing conditions.
.

件の変化に対して極めて敏感であり、加えて製造過程に
於いて何らかの凹凸の原因が生起すると、その凹凸は層
厚の増大とともに必ず増長することも判明している。
It has also been found that if some cause of unevenness occurs during the manufacturing process, the unevenness will necessarily increase as the layer thickness increases.

このように光導電部材としての特性に大きな影響を及ぼ
す光導電層表面の凹凸に対処する基本的な考え方として
は、まず、凹凸の核となる原因を極力排除すること、次
にやむなく核が生じた場合には極力その成長を抑えるこ
と、更には層厚とともに増大する凹凸を、層厚に対して
どの程度に抑えれば像形成部材としての侠用に耐えるか
を見い出すことの三点が挙げられる。
The basic idea of dealing with unevenness on the surface of the photoconductive layer, which has such a large effect on the properties of the photoconductive material, is to first eliminate as much as possible the cause of the unevenness, and then to eliminate the cause of the unevenness as much as possible. In such cases, the following three points are raised: to suppress the growth as much as possible, and to find out to what extent the unevenness, which increases with the layer thickness, can be suppressed to withstand use as an image forming member. It will be done.

本発明は上記の諸点に鑑み成されたもので、a−3iに
関し電子写真用像形成部材や固体撮像装置、読取装置等
に使用される光導電部材としての適用性とその応用性と
いう観点から総括的に鋭意研究検討を続けた結果、ケイ
素原子を母体とし、好ましくは水素原子(H)及びハロ
ゲン原子(X)のイスレか少なくとも一方を含有するア
モルファス材料、すなわち、所謂水素化a−8i、ハロ
ゲン含有a−3i、あるいはハロゲン化a−5i (以
後、これ等を総称的にa−9i(H,X)と表記する)
を含有する光導電層を有する光導電部材に於いて、光導
電層表面の凹凸を光導電層の層厚に対して特定の範囲以
内に抑制することによって極めて優れた光導電部材が得
られることを見い出した点に基づくものである。
The present invention has been made in view of the above points, and from the viewpoint of applicability and applicability of a-3i as a photoconductive member used in electrophotographic image forming members, solid-state imaging devices, reading devices, etc. As a result of intensive comprehensive research and examination, we have developed an amorphous material that has a silicon atom as its base material and preferably contains at least one of hydrogen atoms (H) and halogen atoms (X), that is, so-called hydrogenated a-8i. Halogen-containing a-3i or halogenated a-5i (hereinafter, these will be collectively referred to as a-9i (H, X))
In a photoconductive member having a photoconductive layer containing the above, an extremely excellent photoconductive member can be obtained by suppressing irregularities on the surface of the photoconductive layer within a specific range with respect to the layer thickness of the photoconductive layer. This is based on the discovery that

本発明は、電気的、光学的、光導電的特性が光導電部材
の全域に亘って均一であり、画像流れ等の画像欠陥が少
なく、ハーフトーンが鮮明に出せ、且つ解像度の高い、
高品質画像を得ることができる優れた光導電部材を提供
することを目的とする。
The present invention has uniform electrical, optical, and photoconductive properties over the entire area of the photoconductive member, has few image defects such as image deletion, can produce clear halftones, and has high resolution.
It is an object of the present invention to provide an excellent photoconductive member capable of obtaining high-quality images.

本発明の他の目的は、クリーニングブレード等の他の電
子写真用部品を摩耗したすることのない電子写真用の光
導電部材を提供することにある。
Another object of the present invention is to provide a photoconductive member for electrophotography that does not cause wear of other electrophotographic parts such as a cleaning blade.

すなわち本発明の光導電部材は、支持体と、この支持体
上に設けられ、ケイ素原子を母体とする非晶質材料を含
有する光導電層とを有する光導電部材に於いて、前記光
導電層のJIS B 0801に基づく表面粗さの基準
長さ2.5a+mあたりの最大高さが、該光導電層の平
均層厚の172以下であることを特徴とする。
That is, the photoconductive member of the present invention includes a support and a photoconductive layer provided on the support and containing an amorphous material having silicon atoms as a matrix. The photoconductive layer is characterized in that the maximum height per standard length of 2.5 a+m of surface roughness based on JIS B 0801 is 172 or less of the average layer thickness of the photoconductive layer.

上記したような構造を取るようにして構成された本発明
の光導電部材は、前記した諸問題の総てを解決し得、極
めて優れた電気的、光学的、光導電的特性を光導電部材
全域に亘って均一に有するものである。
The photoconductive member of the present invention configured to have the structure described above can solve all of the problems described above, and has extremely excellent electrical, optical, and photoconductive properties. It has uniformity over the entire area.

殊に、電子写真用像形成部材として適用させた場合には
、その電気的特性が安定しており、画像流れ等の画像欠
陥が少なく、濃度が高く、ハーフトーンが鮮明に出て、
且つ解像度の高い、高品質の可視画像を得ることができ
、加えてクリーニングブレード等の他の電子写真用部品
を摩耗したりすることがない。
In particular, when applied as an electrophotographic image forming member, its electrical properties are stable, there are few image defects such as image deletion, high density, and clear halftones.
Moreover, a high-resolution, high-quality visible image can be obtained, and in addition, other electrophotographic parts such as a cleaning blade are not worn out.

以下、図面に従って、本発明の光導電部材について詳細
に説明する。
Hereinafter, the photoconductive member of the present invention will be explained in detail according to the drawings.

第1図及び第2図は、本発明の光導電部材の構成の実施
態様例を説明するために層構造を模式的に示した図であ
る。
FIGS. 1 and 2 are diagrams schematically showing a layer structure for explaining an embodiment of the structure of a photoconductive member of the present invention.

本発明の光導電部材100は、第1図に示されるように
光導電部材用の支持体101上に、a−5i()1. 
X)を主成分として含有する光導電層102が形成され
て構成される。光導電層102は、第2図に示されるよ
うに光導電層102に接して障壁層103.更には該光
導電層の表面上に表面障壁層104を有してもよい。な
お、本発明に於いては、特にことわらない限り、障壁層
103及び表面障壁層104も光導電層102に含めて
光導電層と称する。
The photoconductive member 100 of the present invention is a photoconductive member having a-5i()1.
A photoconductive layer 102 containing X) as a main component is formed and configured. The photoconductive layer 102 has a barrier layer 103 .contacting the photoconductive layer 102 as shown in FIG. Furthermore, a surface barrier layer 104 may be provided on the surface of the photoconductive layer. In the present invention, unless otherwise specified, the barrier layer 103 and the surface barrier layer 104 are also included in the photoconductive layer 102 and are referred to as a photoconductive layer.

本発明において使用される支持体としては、導電性でも
電気絶縁性であっても良い。導電性支持体としては、例
えば、NiCr、ステンレス、AI。
The support used in the present invention may be electrically conductive or electrically insulating. Examples of the conductive support include NiCr, stainless steel, and AI.

Cr、 No、 Au、 Nb、 Ta、 V 、 T
i、 Pt、 Pd 等の金属又はこれ等の合金が挙げ
られる。
Cr, No, Au, Nb, Ta, V, T
Examples include metals such as Pt, Pd, and alloys thereof.

電気絶縁性支持体としては、ポリエステル、ポリエチレ
ン、ポリカーボネート、セルローズアセテート、ポリプ
ロピレン、ポリ塩化ビニル、ポリ塩化ビニリデン、ポリ
スチレン、ポリアミド等の合成樹脂のフィルム又はシー
ト、ガラス、セラミック、紙等が通常使用される。
As the electrically insulating support, films or sheets of synthetic resins such as polyester, polyethylene, polycarbonate, cellulose acetate, polypropylene, polyvinyl chloride, polyvinylidene chloride, polystyrene, polyamide, glass, ceramic, paper, etc. are usually used. .

支持体の形状としては、所望によって、その形状は決定
されるが、例えば第1図の光導電部材100を電子写真
用像形成部材として使用するのであれば、連続高速複写
の場合には、無端ベルト状又は円筒状とするのが望まし
い、支持体の厚さは、所望通りの光導電部材が形成され
る様に適宜決定されるが、光導電部材として可撓性が要
求される場合には、支持体としての機能が十分発揮され
る範囲内であれば可能な限り薄く、される、しかしなが
ら、このような場合支持体の製造上及び取扱い上、更に
は機械的強度等の点から、通常は、!〇−以上とされる
The shape of the support is determined as desired, but for example, if the photoconductive member 100 of FIG. The thickness of the support, which is preferably belt-shaped or cylindrical, is determined as appropriate so that the desired photoconductive member is formed, but if flexibility is required as a photoconductive member, However, in such cases, from the viewpoint of manufacturing and handling of the support, as well as mechanical strength, etc., it is usually thinner. teeth,! 〇- or more.

本発明において、a−5i(H,X)で構成される光導
電層を形成するには、例えばグロー放電法、スパッタリ
ング法、あるいはイオンブレーティング法等の従来公知
の種々の放電現象を利用する真空堆積法が適用される。
In the present invention, in order to form a photoconductive layer composed of a-5i (H, A vacuum deposition method is applied.

本発明の光導電部材の光導電層中に含有されてもよいハ
ロゲン原子(X)としては、具体的にはフッ素、塩素、
臭素、ヨウ素が挙げられるが、特に塩素、とりわけフッ
素を好適なものとして挙げることができる。光導@yi
ro2中に含有されるケイ素原子、水素原子、ハロゲン
原子以外の成分としては、禁止帯幅やフェルミ準位等を
調整する成分として、ホウ素、ガリウム等のm前原子、
窒素、リン、ヒ素等のV前原子、酸素原子、炭素原子、
ゲルマニウム原子等を単独若しくは適宜組み合わせて含
有させることができる。
Specifically, the halogen atoms (X) that may be contained in the photoconductive layer of the photoconductive member of the present invention include fluorine, chlorine,
Mention may be made of bromine and iodine, particularly chlorine, especially fluorine. Light guide @yi
Components other than silicon atoms, hydrogen atoms, and halogen atoms contained in ro2 include pre-m atoms such as boron and gallium as components that adjust the forbidden band width and Fermi level, etc.
V atoms such as nitrogen, phosphorus, arsenic, oxygen atoms, carbon atoms,
Germanium atoms and the like can be contained alone or in appropriate combinations.

障壁層103は、光導@@102と中間層との密着性向
上あるいは電荷受容能の調整等の目的で設置されるもの
であり、目的に応じてm前原子、V前原子、酸素原子、
炭素原子、ゲルマニウム原子等を含むa−9i(H,X
)層若しくは微結晶−9i(H,X)層が、一層あるい
は多層に形成される。
The barrier layer 103 is provided for the purpose of improving the adhesion between the light guide @@102 and the intermediate layer or adjusting the charge-accepting ability, and depending on the purpose, it may contain m-preatoms, V-preatoms, oxygen atoms,
a-9i (H,
) layer or microcrystalline-9i(H,X) layer is formed in one layer or in multiple layers.

また、光導電層102の上部に表面電荷注入防止層ある
いは保護層として、炭素原子、窒素原子、酸素原子等を
多量に含有する非晶質ケイ素による上部層あるいは高抵
抗有機物質からなる表面障壁層104を設置してもよい
Further, as a surface charge injection prevention layer or a protective layer on the photoconductive layer 102, an upper layer made of amorphous silicon containing a large amount of carbon atoms, nitrogen atoms, oxygen atoms, etc. or a surface barrier layer made of a high-resistance organic substance. 104 may be installed.

次に、このような光導電層102(光導電層の上部に表
面障壁層104が設置される場合には表面障壁層)の表
面の凹凸を光導電層の平均層厚に対して特定の範囲以内
に抑制するための個々の具体的要因について説明する。
Next, the unevenness on the surface of the photoconductive layer 102 (or the surface barrier layer when the surface barrier layer 104 is provided on top of the photoconductive layer) is adjusted to a specific range with respect to the average layer thickness of the photoconductive layer. We will explain each specific factor to suppress the above.

本発明等の多くの実験によれば、前記光導電層の凹凸の
発生に大きな影響を与える因子の一つとして、まず、支
持体の表面形状があることが判明している。支持体表面
に微細な凹凸が存在すると、堆積膜の均一性が低下し、
柱状構造や球状突起が形成されやすく、これに従って光
導電層表面の凹凸は増大する。したがって、支持体の表
面性は極めて重要な因子である。しかしながら、従来は
、アルミニウム製のシリンダーが専ら使用されていたこ
と、更には研磨装置の性能等の関係で、あまり表面精度
の良い支持体を使用できなかったのが実情であり、この
観点からの最適化がおろそかにされてきた所以でもある
According to many experiments conducted in the present invention, it has been found that one of the factors that greatly influences the occurrence of unevenness in the photoconductive layer is the surface shape of the support. If minute irregularities exist on the surface of the support, the uniformity of the deposited film will decrease.
Columnar structures and spherical protrusions are likely to be formed, and the surface roughness of the photoconductive layer increases accordingly. Therefore, the surface properties of the support are a very important factor. However, in the past, aluminum cylinders were exclusively used, and furthermore, due to the performance of polishing equipment, it was not possible to use supports with very good surface precision. This is also the reason why optimization has been neglected.

光導電層の凹凸の発生に影響を及ぼす他の要因として、
放電時のプラズマ状態が挙げられる。例えば放電開始時
に異常放電が起ると、内部電極であるドラム基体シリン
ダー近傍に必要とされるカスプラズマあるいはラジカル
若しくはイオンの儂度分布が大きく変わるため、基体上
に1例えば結晶核や島状の構造が形成され、このため定
常時の放電安定性が優れたものであっても形成される光
導電層は結果として凹凸の大きいものとなってしまう。
Other factors that influence the occurrence of unevenness in the photoconductive layer include:
One example is the plasma state during discharge. For example, if an abnormal discharge occurs at the start of discharge, the intensity distribution of the gas plasma or radicals or ions required near the drum base cylinder, which is the internal electrode, will change significantly. Therefore, even if the discharge stability during steady state is excellent, the formed photoconductive layer ends up having large irregularities.

また、異常放電によって著しく大きなエネルギーを得た
ガス、イオン、ラジカルが基体表面を攻撃して凹凸を形
成することもあり、放電時のプラズマ状態を正常にコン
トロールすることも極めて重要である。
In addition, gases, ions, and radicals that have acquired significantly large amounts of energy due to abnormal discharge may attack the substrate surface and form irregularities, so it is extremely important to properly control the plasma state during discharge.

また、不純物を核としての堆積膜の異常成長も層の凹凸
の発生の有力な原因となり、このような不純物としては
1例えば製膜中に放電チャン/<−内に生成する高分子
シリコンを主体とする粉末等が挙げられる。
In addition, abnormal growth of the deposited film using impurities as nuclei is also a strong cause of the occurrence of unevenness in the layer, and such impurities include 1. Examples include powders such as

更に、放電パワーの絶対値、ガス流量、基板温度等の光
導電層の製造条件の殆ど全てが何らかの形で膜の凹凸の
発生に影響を及ぼしている。例えばガス流量についてみ
れば、カス流量が小さ過ぎる場合には柱状構造や球状突
起が形成されたときにその成長が増長され、逆にガス流
量が大き過ぎる場合には緻密な堆積膜が得られず、膜表
面の凹凸は増大する。
Furthermore, almost all of the manufacturing conditions of the photoconductive layer, such as the absolute value of the discharge power, the gas flow rate, and the substrate temperature, influence the occurrence of unevenness in the film in some way. For example, if we look at the gas flow rate, if the gas flow rate is too small, the growth of columnar structures and spherical protrusions will be increased when they are formed, and conversely, if the gas flow rate is too large, a dense deposited film will not be obtained. , the unevenness of the film surface increases.

このようにして、支持体の表面形状、不純物の排除、放
電時のプラズマ状態の安定化、更には種々の光導電層の
製造条件等を適切に調整することによって初めて、光導
電層のJIS B OHIに基づく表面粗さの基準長さ
2.5■あたりの最大高さを、該光導電層の平均層厚の
1i2以内に抑制した本発明の光導電部材を製造するこ
とができる。
In this way, it is only by appropriately adjusting the surface shape of the support, the exclusion of impurities, the stabilization of the plasma state during discharge, and the manufacturing conditions of various photoconductive layers that JIS B of the photoconductive layer can be achieved. The photoconductive member of the present invention can be manufactured in which the maximum height of the surface roughness based on OHI per reference length of 2.5 cm is suppressed to within 1i2 of the average layer thickness of the photoconductive layer.

本発明に於ける光導電層の表面粗さの測定は、光導電部
材が平板状のものであれば、光導電層表面の任意の位置
に於ける少なくとも10回の測定での最大高さの最大値
をめることにより実施され、ドラム状のものであれば、
任意の位置に於けるドラム軸に平行な方向への少なくと
も10回の測定での最大値をめることにより実施される
In the present invention, the surface roughness of the photoconductive layer is measured by measuring the maximum height at any position on the surface of the photoconductive layer at least 10 times if the photoconductive member is a flat plate. It is carried out by calculating the maximum value, and if it is drum-shaped,
This is carried out by finding the maximum value of at least 10 measurements in a direction parallel to the drum axis at any position.

光導電層の表面粗さは、その最大高さの絶対値ができる
だけ小さい方が好ましく、特にクリーニング性能は最大
高さの絶対値に対する依存性が大きい。しかし、光導電
層の電気的、光学的、光導電的特性は、必ずしも最大高
さの絶対値だけで論するのは適当ではなく、光導電層の
平均層厚との相対的関係で特定値以下に抑制するのが良
好な特性を有する光導電層を形成する上では重要である
。すなわち、表面粗さの最大高さを、光導電層の平均層
厚の1i2以内に抑制することによって優れた光導電部
材が得られる。したがって、最大高さの絶対値を相当小
さくしたとしても、光導電層の平均層厚が薄く、最大高
さが平均層厚の1/2を超える場合には、前述した堆積
膜の均一性の低下、柱状構造や球状突起の生成による光
導電層の特性が低下する。
Regarding the surface roughness of the photoconductive layer, it is preferable that the absolute value of its maximum height is as small as possible, and in particular, the cleaning performance is highly dependent on the absolute value of the maximum height. However, it is not always appropriate to discuss the electrical, optical, and photoconductive properties of the photoconductive layer only in terms of the absolute value of the maximum height, but rather in the relative relationship with the average layer thickness of the photoconductive layer. In order to form a photoconductive layer having good properties, it is important to suppress the amount below. That is, an excellent photoconductive member can be obtained by suppressing the maximum height of surface roughness to within 1i2 of the average layer thickness of the photoconductive layer. Therefore, even if the absolute value of the maximum height is made considerably small, if the average layer thickness of the photoconductive layer is thin and the maximum height exceeds 1/2 of the average layer thickness, the above-mentioned uniformity of the deposited film will be affected. The characteristics of the photoconductive layer deteriorate due to the formation of columnar structures and spherical protrusions.

次にグロー放電分解法による光導電部材の製造方法の例
について説明する。
Next, an example of a method for manufacturing a photoconductive member using a glow discharge decomposition method will be described.

第3図にグロー放電分解法による光導電部材の製造装−
を示す。
Figure 3 shows an apparatus for manufacturing photoconductive members using the glow discharge decomposition method.
shows.

図中の1102〜110Bのガスボンベには、本発明の
光導電部材の光導電層を形成するための原料ガスが密封
されており、その−例として、例えば1102は、5i
)1ガス(純度99.98%)ボンベ、1103はHで
面釈されたBHガス(純度99.99%、以下BH/H
カスと略す)ボンベ、1104はN)l カス(純度9
L99%)ボンベ、+105はC)l ガス(純度89
.89%)ボンベ、1108はSiFガス(純度H,9
9%)ボンベである。図示されていないがこれら以外に
、必要に応じて所望のガス種を増設することが可能であ
る。
Gas cylinders 1102 to 110B in the figure are sealed with raw material gas for forming the photoconductive layer of the photoconductive member of the present invention.
) 1 gas (purity 99.98%) cylinder, 1103 is BH gas (purity 99.99%, hereinafter BH/H
1104 is N)l scum (purity 9)
L99%) cylinder, +105 is C)l gas (purity 89
.. 89%) cylinder, 1108 is SiF gas (purity H, 9
9%) It is a cylinder. Although not shown in the drawings, it is possible to add other desired gas types as needed.

これらのガスを反応室110.1に流入させるには、ガ
スポンベ1102〜110Bの各バルブ1122〜11
2B及びリークバルブ1135が閉じられていることを
確認し、また、流入バルブ1112〜ttte、流出バ
ルブ1117〜1121及び補助バルブ1132.11
33が開かれていることを確認して、先づメインバルブ
1134を開いて反応室!101及びガス配管内を排゛
気する。次に真空計1136の読みが約5X 10’ 
torrになった時点で補助バルブ1132.1133
及び流出バルブ!117〜112+を閉じる。続いてガ
スポンベ1102よりSiHガス、ガスポンベ1103
よりB H/Hガス、ガスポンベ1104よりN)I 
カス、ガスポンベ1105よりCHガス、ガスポンベ1
106よりSiFカスをそれぞれバルブ1122− t
t2eヲ開イテ出ロ圧ゲージ1127〜1131ノ圧を
1Kg / cm2に調整し、流入バルブ1112〜1
11Bヲ徐々に開けて、マスフロコントローラ1107
〜1111内に流入させる。引き続いて流出バルブ11
17〜+121及び補助バルブ1132.1133を徐
々に開いてそれぞれのガスを反応室1101に流入させ
る。このときのこれら各ガス流量の比が所望の値になる
ように流出バルブ1117〜1121を調整し、また、
反応室内の圧力が所望の値になるように真空計1138
の読みを見ながらメインバルブ1134の開口を調整す
る。そして気体シリンダー1137の温度が加熱ヒータ
ー1138により50〜400℃の温度に設定されてい
ることを確認した後、電源1140を所望の電力に設定
して反応室1101内にグロー放電を生起させる。
In order to flow these gases into the reaction chamber 110.1, each valve 1122-11 of the gas pump 1102-110B is
2B and leak valve 1135 are closed, and also inlet valves 1112-ttte, outlet valves 1117-1121 and auxiliary valves 1132.11.
33 is open, first open the main valve 1134 and open the reaction chamber! 101 and gas piping. Next, the reading on the vacuum gauge 1136 is approximately 5X 10'
When it becomes torr, auxiliary valve 1132.1133
and outflow valve! Close 117-112+. Next, SiH gas from gas pump 1102, gas pump 1103
From B H/H gas, gas pump 1104 N) I
CH gas, gas pombe 1 from scum, gas pombe 1105
106 to each valve 1122-t.
Open t2e and adjust the pressure of the outlet pressure gauges 1127 to 1131 to 1Kg/cm2, and then open the inflow valves 1112 to 1.
Gradually open 11B and install mass flow controller 1107.
~1111. Subsequently, the outflow valve 11
17 to +121 and auxiliary valves 1132 and 1133 are gradually opened to allow the respective gases to flow into the reaction chamber 1101. The outflow valves 1117 to 1121 are adjusted so that the ratio of these gas flow rates at this time becomes a desired value, and
Vacuum gauge 1138 is installed so that the pressure inside the reaction chamber reaches the desired value.
Adjust the opening of the main valve 1134 while checking the reading. After confirming that the temperature of the gas cylinder 1137 is set to 50 to 400° C. by the heater 1138, the power source 1140 is set to a desired power to generate glow discharge in the reaction chamber 1101.

また、層形成を行っている間は、層形成の均一化を計る
ために基体シリンダー1137をモータ1138により
一定速度で回転させることが望ましい。
Further, during layer formation, it is desirable that the base cylinder 1137 be rotated at a constant speed by the motor 1138 in order to ensure uniform layer formation.

反応スパッタリング法或いはイオンブレーティング法に
依ってa−9i(Hlに)から成る光導電層を形成する
には、例えばスパッタリング法の場合にはSiから成る
ターゲットを使用して、これを所定のカスプラズマ雰囲
気中でスパッタリングレ、イオンブレーティング法の場
合には、多結晶シリコン又は単結晶シリコンを蒸発源と
して蒸着ボートに収容し、このシリコン蒸発源を抵抗加
熱法、あるいはエレクトロンビーム法(EB法)等によ
って加熱蒸発させ飛翔蒸発物を所定のガスプラズマ雰囲
気中を通過させることによって実施できる。
To form a photoconductive layer made of a-9i (Hl) by a reactive sputtering method or an ion blasting method, for example, in the case of a sputtering method, a target made of Si is used and the target is spun into a predetermined cast. In the case of sputtering gray or ion blating methods in a plasma atmosphere, polycrystalline silicon or single crystal silicon is housed in a deposition boat as an evaporation source, and this silicon evaporation source is used by resistance heating method or electron beam method (EB method). This can be carried out by heating and evaporating the flying evaporated material by, for example, passing through a predetermined gas plasma atmosphere.

以下、実施例について説明する。Examples will be described below.

実施例1 PNEUMOPRECLSION ING、製の精密切
削用エアダンパー付旋盤に、先端部曲率0.01(am
’ )のタイヤモンドパイトを、シリング中心角に対し
て5°の負のすくい角を得るようにセットした。次にこ
の旋盤の回転軸フランジに、アルミニウムシリンダーを
真空チャックし、付設したノズルからの白燈油噴霧、同
じく付設した真空ノズルからの切り粉の吸引を並用しつ
つ、周速1000(+I+/+in) 。
Example 1 A lathe with an air damper for precision cutting manufactured by PNEUMO PRECLSION ING was equipped with a tip curvature of 0.01 (am
') was set to obtain a negative rake angle of 5° with respect to the Schilling center angle. Next, an aluminum cylinder was vacuum chucked to the rotating shaft flange of this lathe, and while white kerosene was sprayed from an attached nozzle and chips were sucked from the attached vacuum nozzle, the circumferential speed was increased to 1000 (+I+/+in). .

送り速度0.01(mm/R)の条件で鏡面切削を施こ
した。同シリンダを表面粗さ測定装置にかけ、軸方向に
基準長さ2.5ma+あたりの最大高さの測定を10回
行なったところ最大高−さが0.02μ以内に収まって
いることが確認された。
Mirror cutting was performed at a feed rate of 0.01 (mm/R). The same cylinder was subjected to a surface roughness measurement device and the maximum height was measured 10 times per standard length of 2.5 m in the axial direction, and it was confirmed that the maximum height was within 0.02 μ. .

次に、先に詳述した第3図に示す作製装置を用い、同シ
リンダー上に第1表の条件で光導電層を形成した。
Next, a photoconductive layer was formed on the same cylinder under the conditions shown in Table 1 using the manufacturing apparatus shown in FIG. 3, which was detailed above.

この光導電部材の表面粗さにつき、軸方向に基準長さ2
.5■あたりの最大高さのを測定を10回行なったとこ
ろ、最大高さは2−内であった。この光導電部材を複写
装置にセ・ントし、画像出しを行なったところ、画像欠
陥が少ない良好な画質が得られた。
Due to the surface roughness of this photoconductive member, the standard length 2 in the axial direction
.. When the maximum height around 5cm was measured 10 times, the maximum height was within 2. When this photoconductive member was placed in a copying machine and an image was produced, a good image quality with few image defects was obtained.

次に上記の画像出し工程を10万回行なった後に、同じ
ような画像評価を行なったが、初期の状態と殆ど変わら
ない良好な画質が得られた。更に、この時のクリーニン
グブレードを検査したところ、殆ど摩耗していなかった
Next, after performing the above-mentioned image forming process 100,000 times, a similar image evaluation was performed, and a good image quality that was almost the same as the initial state was obtained. Furthermore, when the cleaning blade at this time was inspected, it was found that it was hardly worn.

実施例2〜5及び比較例1〜2 実施例1で使用した旋盤を用い5周速と送り速度を変え
てアルミニウムシリンダー基板の表面性を第2表のよう
に変化させた以外は、実施例1と全く同じ条件で光導電
層を形成した。こうして得られた光導電部材につき実施
例1と同様の評価を行なったところ、第2表の結果を得
た。
Examples 2 to 5 and Comparative Examples 1 to 2 The lathe used in Example 1 was used, except that the peripheral speed and feed rate were changed to change the surface properties of the aluminum cylinder substrate as shown in Table 2. A photoconductive layer was formed under exactly the same conditions as in Example 1. The photoconductive member thus obtained was evaluated in the same manner as in Example 1, and the results shown in Table 2 were obtained.

実施例6 第3図に示した光導電部材の製造装置を一部改造して、
チャンバー内の電極部のヒーター等の突起物を全て除き
、さらに露出するエツジ部分に全てRをつけ、シリンダ
ー周辺で何らかの異常放電が全く認められない反応装置
を試作した。このような反応装置を用い実施例1で製作
した表面粗さの最大高さが0.02uのアルミニウムシ
リンターを用いる以外は実施例1と全く同じ条件で光導
電層を形成した。こうして得られた光導電部材につき実
施例1と同様の評価を行なったところ、実施例2の場合
と同様、最大高さが0.8μ以内に収まっていることが
確認された。
Example 6 The photoconductive member manufacturing apparatus shown in FIG. 3 was partially modified,
By removing all protrusions such as heaters from the electrodes in the chamber and rounding all exposed edges, we created a prototype reactor in which no abnormal discharge of any kind was observed around the cylinder. A photoconductive layer was formed under exactly the same conditions as in Example 1, except for using such a reaction apparatus and using the aluminum syringe produced in Example 1 and having a maximum surface roughness of 0.02 μ. When the thus obtained photoconductive member was evaluated in the same manner as in Example 1, it was confirmed that, as in Example 2, the maximum height was within 0.8 μm.

実施例7.8及び比較例3 実施例1で使用した旋盤を用い、アルミニウムシリンダ
ーを周速333(m/l1in) 、送り速度0.03
(mm/R)の条件で鏡面切削を施こし、このシリンダ
ー上に層厚を変えたことを除いて実施例1と同じ条件で
光導電層を形成した。こうして得られた光導電部材につ
き実施例1と同様の評価を行なったところ、第3表の結
果を得た。
Example 7.8 and Comparative Example 3 Using the lathe used in Example 1, the aluminum cylinder was moved at a circumferential speed of 333 (m/l 1 in) and a feed rate of 0.03.
(mm/R), and a photoconductive layer was formed on the cylinder under the same conditions as in Example 1, except that the layer thickness was changed. The photoconductive member thus obtained was evaluated in the same manner as in Example 1, and the results shown in Table 3 were obtained.

比較例3 ポールベアリング式の軸受けを有し、何ら防振対策の施
されていない所謂汎用旋盤を用い、バイト刃先にはダイ
ヤモンドのRバイトを使用して、周速45(+s/■i
n) 、送り速度0.5(m園/R)の条件でアルミニ
ウムシリンダーを研磨、したところ、軸方向に基準長さ
 2.5m+mあたりの最大高さのを測定を10回行な
ったところ最大高さは0.54であった。このシリンダ
ーを用い、クリンルーム外に設置された第3図のグロー
放電分解法による光導電部材の製造装置を使用し、パワ
ー500W、 SiHガス流量509CCM、基板温度
250℃の条件のもとに、光導電層の層厚20−の光導
電部材を作製した。この時の光導電層の表面粗さを軸方
向に基準長さ2.51あたりの最大高さの測定を゛1G
回行なったところ、最大高さが10u以上になる筒所が
多数部められた。
Comparative Example 3 Using a so-called general-purpose lathe with a pole bearing type bearing and no anti-vibration measures, a diamond R cutting tool was used for the tool cutting edge, and the circumferential speed was 45 (+s/■i).
n) When an aluminum cylinder was polished at a feed rate of 0.5 (m/R), the maximum height per standard length of 2.5 m + m in the axial direction was measured 10 times, and the maximum height was The value was 0.54. Using this cylinder, a photoconductive member manufacturing apparatus using the glow discharge decomposition method shown in Fig. 3 installed outside the clean room was used under the conditions of power 500W, SiH gas flow rate 509CCM, and substrate temperature 250℃. A photoconductive member with a photoconductive layer having a layer thickness of 20 mm was produced. At this time, the surface roughness of the photoconductive layer was measured in the axial direction at the maximum height per reference length of 2.51 ゛1G.
When I went around it, I found many cylinders with a maximum height of 10u or more.

この光導電部材を複写装置にセットし、画像出しを行な
ったところ、初期の画質において既にガサつきが認めら
れ、約2000回の耐久画像出し試験でブレードの摩耗
が著しく、クリーニング不良を起すことが確認された。
When this photoconductive member was set in a copying machine and an image was printed, roughness was already observed in the initial image quality, and after approximately 2,000 image printing durability tests, the blade was significantly worn, resulting in poor cleaning. confirmed.

また、コロナ照射によって異常放電が生じ、ピンホール
が生成して画像欠陥が多数少じていることも確認された
It was also confirmed that abnormal discharge occurred due to corona irradiation, pinholes were generated, and many image defects were caused.

第3表 (2)評価基準は第2表の場合と同じ。Table 3 (2) Evaluation criteria are the same as in Table 2.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図及び第2図は本発明の光導電部材の構成の実施態
様例を説明するために層構造を模式的に示した図である
。第3図は、グロー放電分解法による光導電部材の製造
装置を示した図である。 100:光導電部材 101 :支持体102:光導電
層 103:障壁層 104:表面障壁層 1101 :反応室1102〜1
106:ガスボンベ 1107〜1111:マスフロコントローラ1112〜
1118 :流入バルブ 1117〜1121 :流出バルブ 1122〜1128:バルブ 1127〜1131 :圧力調整器
FIGS. 1 and 2 are diagrams schematically showing a layer structure for explaining an embodiment of the structure of a photoconductive member of the present invention. FIG. 3 is a diagram showing an apparatus for manufacturing a photoconductive member using a glow discharge decomposition method. 100: Photoconductive member 101: Support 102: Photoconductive layer 103: Barrier layer 104: Surface barrier layer 1101: Reaction chamber 1102-1
106: Gas cylinder 1107-1111: Mass flow controller 1112-
1118: Inflow valves 1117-1121: Outflow valves 1122-1128: Valves 1127-1131: Pressure regulator

Claims (1)

【特許請求の範囲】[Claims] 支持体と、この支持体上に設けられ、ケイ素原子を母体
とする非晶質材料を含有する光導電層とを有する光導電
部材に於いて、前記光導電層のJIS BO301に基
づく表面粗さの基準長さ2.511mあたりの最大高さ
が、該光導電層の平均層厚の172以下であることを特
徴とする光導電部材。
In a photoconductive member having a support and a photoconductive layer provided on the support and containing an amorphous material having silicon atoms as a matrix, the surface roughness of the photoconductive layer is based on JIS BO301. A photoconductive member characterized in that the maximum height per reference length of 2.511 m is 172 or less of the average layer thickness of the photoconductive layer.
JP10785083A 1983-06-17 1983-06-17 photoconductive member Pending JPS60455A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10785083A JPS60455A (en) 1983-06-17 1983-06-17 photoconductive member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10785083A JPS60455A (en) 1983-06-17 1983-06-17 photoconductive member

Publications (1)

Publication Number Publication Date
JPS60455A true JPS60455A (en) 1985-01-05

Family

ID=14469639

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10785083A Pending JPS60455A (en) 1983-06-17 1983-06-17 photoconductive member

Country Status (1)

Country Link
JP (1) JPS60455A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62124561A (en) * 1985-11-25 1987-06-05 Mitsubishi Chem Ind Ltd Amorphous silicon electrophotographic photoreceptor
JP2002098570A (en) * 2000-09-26 2002-04-05 Aichi Tokei Denki Co Ltd Mounting structure of flow meter

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62124561A (en) * 1985-11-25 1987-06-05 Mitsubishi Chem Ind Ltd Amorphous silicon electrophotographic photoreceptor
JP2002098570A (en) * 2000-09-26 2002-04-05 Aichi Tokei Denki Co Ltd Mounting structure of flow meter

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