JPS6048287U - Cooling structure for circuit components - Google Patents
Cooling structure for circuit componentsInfo
- Publication number
- JPS6048287U JPS6048287U JP13936883U JP13936883U JPS6048287U JP S6048287 U JPS6048287 U JP S6048287U JP 13936883 U JP13936883 U JP 13936883U JP 13936883 U JP13936883 U JP 13936883U JP S6048287 U JPS6048287 U JP S6048287U
- Authority
- JP
- Japan
- Prior art keywords
- cooling structure
- circuit components
- circuit board
- copper foil
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案による冷却構造の一実施例を適用したプ
リント基板の構成を示す平面図、第２図は第１図の■−
■線拡線断大断面図る。
１・・・プリント基板、３・・・銅箔、１０・・・アル
ミ冷却フィン。FIG. 1 is a plan view showing the configuration of a printed circuit board to which an embodiment of the cooling structure according to the present invention is applied, and FIG.
■Large-scale cross-section diagram of expanded line. 1... Printed circuit board, 3... Copper foil, 10... Aluminum cooling fin.
Claims (1)
態で設け、前記プリント基板に取り付けられた回路部品
から発生する熱を、前記銅箔およびアルミ冷却フィンを
介して放散することを特徴とする回路部品の冷却構造。A circuit characterized in that an aluminum cooling fin is provided in contact with a copper foil of a printed circuit board, and heat generated from circuit components attached to the printed circuit board is dissipated via the copper foil and the aluminum cooling fin. Cooling structure for parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13936883U JPS6048287U (en) | 1983-09-07 | 1983-09-07 | Cooling structure for circuit components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13936883U JPS6048287U (en) | 1983-09-07 | 1983-09-07 | Cooling structure for circuit components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6048287U true JPS6048287U (en) | 1985-04-04 |
Family
ID=30312399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13936883U Pending JPS6048287U (en) | 1983-09-07 | 1983-09-07 | Cooling structure for circuit components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6048287U (en) |
-
1983
- 1983-09-07 JP JP13936883U patent/JPS6048287U/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6048287U (en) | Cooling structure for circuit components | |
| JPS6030591U (en) | Cooling structure for circuit components | |
| JPS6071195U (en) | Heat dissipation device in printed circuit board | |
| JPS60185343U (en) | cooling fins | |
| JPS59127270U (en) | printed circuit board equipment | |
| JPS5993170U (en) | Mounting structure of flat package IC | |
| JPS602841U (en) | semiconductor mounting board | |
| JPS60109332U (en) | Hybrid integrated circuit device | |
| JPS59192870U (en) | printed circuit board equipment | |
| JPS5993167U (en) | Continuous printed circuit board | |
| JPS58114047U (en) | Semiconductor device mounting structure | |
| JPS6071160U (en) | printed wiring board | |
| JPS59138259U (en) | Manufacturing method of printed circuit board with heatsink | |
| JPS5889995U (en) | Mounting structure of transistor heat generating parts | |
| JPS587351U (en) | Heat dissipation mechanism | |
| JPS60121696U (en) | Heat dissipation structure of printed circuit board mounting case | |
| JPS5942068U (en) | Printed wiring board with heatsink | |
| JPS58155897U (en) | printed wiring device | |
| JPS59145092U (en) | Heatsink for installing electrical circuit components | |
| JPS6061740U (en) | Hybrid integrated circuit device | |
| JPS5929095U (en) | electronic equipment | |
| JPS5937742U (en) | Heat dissipation structure | |
| JPS59173347U (en) | Power-iC heat dissipation mechanism | |
| JPS5897890U (en) | Printed circuit board mounting equipment | |
| JPS58166089U (en) | printed wiring board equipment |