JPS6048841B2 - Insulating material for embedding heating wires - Google Patents

Insulating material for embedding heating wires

Info

Publication number
JPS6048841B2
JPS6048841B2 JP3987381A JP3987381A JPS6048841B2 JP S6048841 B2 JPS6048841 B2 JP S6048841B2 JP 3987381 A JP3987381 A JP 3987381A JP 3987381 A JP3987381 A JP 3987381A JP S6048841 B2 JPS6048841 B2 JP S6048841B2
Authority
JP
Japan
Prior art keywords
powder
insulating material
insulating
mica
talc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP3987381A
Other languages
Japanese (ja)
Other versions
JPS57152607A (en
Inventor
幸一 竹迫
泰三 日比野
正 田村
慶樹 浜
進 浦田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP3987381A priority Critical patent/JPS6048841B2/en
Publication of JPS57152607A publication Critical patent/JPS57152607A/en
Publication of JPS6048841B2 publication Critical patent/JPS6048841B2/en
Expired legal-status Critical Current

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  • Resistance Heating (AREA)
  • Inorganic Insulating Materials (AREA)

Description

【発明の詳細な説明】 本発明はコンロ、ホットプレート、コーヒー沸し器等
の熱盤に用いられる絶縁材料に関し、特に、絶縁粉末の
欠落およびクラックの発生を防止するとともに絶縁性能
を向上させようとするものてある。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an insulating material used in heating plates such as stoves, hot plates, coffee makers, etc., and in particular, it is intended to prevent the loss of insulating powder and the occurrence of cracks, and to improve the insulating performance. There is something that says.

一般に、この種の埋込型ヒータは金属製熱盤に溝を形
成し、この溝の中央に電熱線を位置させるように絶縁材
料で埋設してなるものである。
Generally, this type of embedded heater is made by forming a groove in a metal heating plate, and embedding a heating wire in the center of the groove with an insulating material.

従来、上記埋込型ヒータに用いられる絶縁材料にはシリ
か タルク、マグネシア、アルミナ等の絶縁粉末を単品
、又は数種の粉末を混合したものに、リン酸アルミニウ
ム又はシリコーンワニス等を添加したものが用いられて
いた。しかし、絶縁材料が無機物で熱盤がアルミニウム
又は鋳鉄製であり両者の熱膨張率の差により、絶縁材料
にクラックが発生する。そこて粒度配合することにより
粒子間の空隙を小さくし、高温時における空隙の熱膨張
を少なくすることにより、ある程度改良できるが、通電
テストにより、空隙が膨張、収縮を繰返しているうちに
絶縁粉末にクラックが発生してくる。又、シリコーンワ
ニスの使用量が多いと、焼成時にシリコーン樹脂特有の
焼しまりによる収縮が大きく、熱盤の熱膨張率との差が
大となり、絶縁粉末にクラックが生じる。このクラック
発生部分の電熱線が大気と接触するので電熱線の酸化が
急速に進み、断線、絶縁抵抗の低下の原因となつていた
。又、絶縁材料はクラックが入ることにより細切れとな
り熱盤から剥離しやすくなる欠点もあつた。 本発明は
、上記従来の埋込型ヒータ等における電熱線埋込用の絶
縁材料の欠点を解消するもので、以下に本発明の実施例
について添付図面を参照して説明する。
Conventionally, the insulating materials used in the above-mentioned embedded heaters include insulating powders such as silica, talc, magnesia, and alumina, either singly or in a mixture of several powders, to which aluminum phosphate or silicone varnish is added. was used. However, since the insulating material is inorganic and the heating plate is made of aluminum or cast iron, cracks occur in the insulating material due to the difference in thermal expansion coefficient between the two. This can be improved to some extent by reducing the voids between the particles by adjusting the particle size and reducing the thermal expansion of the voids at high temperatures. Cracks begin to appear. Furthermore, if a large amount of silicone varnish is used, the shrinkage due to the burning compaction peculiar to silicone resin during firing will be large, and the difference between the coefficient of thermal expansion of the heating plate will be large, and cracks will occur in the insulating powder. Since the heating wire in the cracked area comes into contact with the atmosphere, oxidation of the heating wire progresses rapidly, causing wire breakage and a decrease in insulation resistance. In addition, the insulating material has the disadvantage that cracks cause it to break into pieces and easily peel off from the hot plate. The present invention eliminates the drawbacks of the insulating material for embedding heating wires in the conventional embedded heaters, etc., and embodiments of the present invention will be described below with reference to the accompanying drawings.

第1図において、1はアルミニウムダイキャスト製、又
は鋳鉄製の熱盤であり、一側表面には断面略U字状の溝
2が形成されていJる。3は絶縁材料であり、溝2の中
央位置に電熱線4が埋設されている。
In FIG. 1, reference numeral 1 denotes a heating plate made of die-cast aluminum or cast iron, and a groove 2 having a substantially U-shaped cross section is formed on one side surface. 3 is an insulating material, and a heating wire 4 is buried in the center of the groove 2.

なお、絶縁材料3は充填後、例えばl00に9/clt
の圧力でプレス成形され、さらに380℃、5時間の焼
成が行なわれている。次に発明者らは絶縁材料3につい
て検討した。ます材料を鱗片状結晶構造を持つタルク(
3Mg0・4Si0。
Note that the insulating material 3 has a ratio of 9/clt to 100 after filling, for example.
It was press-molded at a pressure of 380° C. for 5 hours. Next, the inventors studied insulating material 3. The material is talc with a scaly crystal structure (
3Mg0・4Si0.

・H。O)と金属酸化物(Al,O,またはMgO)と
雲母(K。O−3A1’。0。
・H. O), metal oxides (Al, O, or MgO), and mica (K.O-3A1'.0.

・6Si0。・哄O)とシリコーンワニスに限定し、配
合割合を種々変化させて実験を行なつた。タルクとアル
ミナの混合粉末に対し雲母が6重量%となるように混合
した絶縁粉末に対しシリコーンワニスの量を変化させた
。この結果、シリコーンワニスの樹脂分が上記絶縁粉末
に対し3重量%未満になるとJシリコーンワニスの量が
少ないので全絶縁粉末粒子間に浸透せず、結合剤として
作用しない。そのため成形はてきるが通電テストを行う
と絶縁材料が欠落したり、熱伝導が悪くなり電熱線が断
線したりして使用に供し得なかつた。また、シリコーン
ワニスの樹脂分が絶縁粉末に対し15重量%を越えると
後工程の焼成により、シリコーン樹脂特有の焼きしまり
による収縮が大きくなり、熱盤の熱膨張率との差が大と
なるので絶縁材料にクラックが生じてしまつた。上記実
験の結果より、シリコーンワニスの樹脂分が絶縁粉末に
対し3〜15重量%の範囲が適当であることが判明し、
9重量%が最適てあつた。なお絶縁粉末をタルク単体又
はタルクとアルミナの配合割合を変化させても又、後で
説明するタルク・アルミナの混合粉末と雲母粉末の配合
割合を変化させてもシリコーンワニスの添加量を変える
必要はなかつた。次に発明者らはタルクとアルミナの混
合粉末に対し、雲母の配合割合を種々検討した。この混
合した絶縁粉末に対し9重量%の樹脂分となるようにシ
リコーンワニースを添加した。この結果を第1表に示す
。この第1表に示す結果より明らかなようにタルクとア
ルミナの混合粉末に対して雲母の添加量は1〜1腫量%
であることが必要であり、望ましくは6重量%であつた
・6Si0.・Experiments were carried out with various blending ratios limited to 哄O) and silicone varnish. The amount of silicone varnish was varied with respect to the insulating powder mixed so that mica was 6% by weight with respect to the mixed powder of talc and alumina. As a result, when the resin content of the silicone varnish is less than 3% by weight based on the insulating powder, the amount of J silicone varnish is so small that it does not penetrate between all the insulating powder particles and does not act as a binder. As a result, although it was possible to mold it, when conducting a current test, the insulating material was missing, heat conduction was poor, and the heating wire broke, making it unusable. In addition, if the resin content of the silicone varnish exceeds 15% by weight based on the insulating powder, the shrinkage due to the burning compaction peculiar to silicone resin will increase during the baking process in the post-process, and the difference between the thermal expansion coefficient of the hot plate will become large. A crack has formed in the insulating material. From the results of the above experiments, it was found that the appropriate resin content of the silicone varnish is in the range of 3 to 15% by weight based on the insulating powder.
9% by weight was found to be optimal. Note that even if you change the insulating powder by talc alone or by changing the blending ratio of talc and alumina, or by changing the blending ratio of talc/alumina mixed powder and mica powder, which will be explained later, there is no need to change the amount of silicone varnish added. Nakatsuta. Next, the inventors investigated various blending ratios of mica in a mixed powder of talc and alumina. Silicone varnish was added to the mixed insulating powder so that the resin content was 9% by weight. The results are shown in Table 1. As is clear from the results shown in Table 1, the amount of mica added to the mixed powder of talc and alumina is 1 to 1% by volume.
The content was preferably 6% by weight.

この雲母の添加量については以下のように推定される。
すなわち、第3図に示すように鱗片状結晶構造を有する
タルクが添加された混合粉末をブレス成形することによ
り絶縁粉末3は幾重もの層状に成形される。電熱線4の
近くは温度が高いのて絶縁材料3と熱盤1の熱膨張率の
差によりクラックが発生する。更に第2図に示すように
粒子5間の空隙6の熱膨張により電熱線4付近の絶縁粉
末3aにはクラックが発生する。しかし、幾重にもなつ
ている絶縁層のズレによつて熱膨張率の差が緩和され、
電熱線付近のクラックが絶縁材料表面3bまで達しない
。しカル鱗片状結晶構造を持つタルクは非常に軟かく強
度がない為、通電テストを続けていけば約10時間位で
絶縁材料表面3bにもクラックが発生してくる。そこて
強度のある層状構造を持つ雲母粉末を添加することによ
り、幾重からもなる絶縁材料層の強度が向上する。この
主な理由としては、層状構造を持つ雲母は粉末にするこ
とにより扁平な形状となり、この雲母粉末を絶縁粉末3
中に混合してブレス成形を行うことにより、この雲母粉
末も層状に位置することになり、その結果、この雲母粉
末の周囲に複数の絶縁粉末粒子5が接した状態でシリコ
ーンワニスにより雲母粉末と粒子間及び各々粒子5間が
結合されるためである。なお、上記状態において絶縁粉
末に対して熱膨張による引張り荷重が加わり、粒子5間
を分離しようとする力が働くが、この粒子5間には層状
に雲母粉末が介在しており、この雲母粉末を破断させる
に要する力はシリコーンワニスで結合された粒子5間を
分離する力よりはるかに大であるため、雲母粉末が補強
材としての働きを行つて随所に存在するため、絶縁粉末
3へのクラックが発生しなくなる。しかし、添加量を1
1重量%以上にすると雲母のカサ比重が小さいため必然
的に絶縁粉末3の量が多くなり、全粉末粒子間にシリコ
ーンワニスが浸透せす結合剤として作用しない。そのた
め、成形はできるが、通電テストを行うと絶縁材料が欠
落したり、熱伝導率が悪くなり電熱線が断線したりして
使用に供し得なかつた。又、シリコーンワニスの添加量
を多くしても改良はできず、添加量を15重量%以上に
すると焼しまりによる熱盤との熱膨張率の差によるクラ
ックが発生する。なお、タルク単体、又はタルクとアル
ミナの配合割合を変化させても性能に影響がないことを
確認した。又、アルミナに代えてマグネシアを用いたり
、鱗片状結晶構造を持つタルクに代え、同一結晶構造を
持つ蝋石、カオリナイト、ナクライト、デフカイト、ハ
ロイサイト等の材料を用いても同様な結果が得られた。
第4図は従来のシリカ、タルク、マグネシア等を混合し
た絶縁材料Bと本実施例の絶縁材料Aをそれぞれ用いた
埋込型ヒータを通電テスト後、温度40゜C、湿度90
%中において、絶縁性1能を比較したものである。本実
施例の絶縁材料を用いた埋込型ヒータは、クラックが発
生しない為、高温高湿中においてもほとんど絶縁劣化の
ないものとなる。
The amount of mica added is estimated as follows.
That is, as shown in FIG. 3, the insulating powder 3 is formed into many layers by press-molding a mixed powder to which talc having a scale-like crystal structure is added. Since the temperature near the heating wire 4 is high, cracks occur due to the difference in thermal expansion coefficient between the insulating material 3 and the heating plate 1. Furthermore, as shown in FIG. 2, cracks occur in the insulating powder 3a near the heating wire 4 due to thermal expansion of the gaps 6 between the particles 5. However, the difference in thermal expansion coefficient is alleviated due to the misalignment of the multiple insulating layers.
Cracks near the heating wire do not reach the insulating material surface 3b. Since talc having a scale-like crystal structure is very soft and lacks strength, cracks will appear on the insulating material surface 3b in about 10 hours if the current test is continued. Therefore, by adding mica powder having a strong layered structure, the strength of the multi-layered insulating material layer is improved. The main reason for this is that mica, which has a layered structure, becomes flat when it is powdered, and this mica powder is used as an insulating powder.
By mixing the mica powder and performing breath molding, this mica powder is also located in a layered manner, and as a result, the mica powder is mixed with the silicone varnish with a plurality of insulating powder particles 5 in contact with the periphery of the mica powder. This is because the particles and the particles 5 are bonded together. Note that in the above state, a tensile load is applied to the insulating powder due to thermal expansion, and a force that tries to separate the particles 5 acts, but mica powder is interposed between the particles 5 in a layered manner, and this mica powder The force required to break the insulating powder 3 is much greater than the force required to separate the particles 5 bonded by the silicone varnish, so the mica powder acts as a reinforcing material and is present everywhere. Cracks will no longer occur. However, the amount added is 1
If the amount is 1% by weight or more, the bulk specific gravity of mica is small, so the amount of insulating powder 3 will inevitably increase, and it will not act as a binder to allow the silicone varnish to penetrate between all powder particles. As a result, although it could be molded, it could not be used because the insulating material would be missing or the thermal conductivity would be poor and the heating wire would break when an electrical current test was carried out. Further, even if the amount of silicone varnish added is increased, no improvement can be made; if the amount added is 15% by weight or more, cracks will occur due to the difference in thermal expansion coefficient with the hot plate due to baking compaction. Furthermore, it was confirmed that there was no effect on performance even if talc alone or the blending ratio of talc and alumina was changed. Similar results were also obtained by using magnesia instead of alumina, and by using materials such as rouseite, kaolinite, nacrite, defukite, and halloysite, which have the same crystal structure, instead of talc, which has a scaly crystal structure. .
Figure 4 shows an embedded heater using the conventional insulating material B mixed with silica, talc, magnesia, etc. and the insulating material A of this example at a temperature of 40°C and a humidity of 90°C after an electrical current test.
This is a comparison of insulation properties in %. Since the embedded heater using the insulating material of this example does not generate cracks, there is almost no insulation deterioration even in high temperature and high humidity environments.

なお、第5図は鱗片状結晶構造を持つタルクと金属酸化
物アルミナの混合粉末に対し6重量%の雲母を混合した
絶縁粉末に9重量%の樹脂分となるように添加されたシ
リコーンワニスとを有し、溝2に充填後、100k9/
c透の圧力てブレスし380゜C)5時間の焼成を行な
つた絶縁材料の断面電子顕微鏡写真で フある。以上の
説明から明らかなように本発明によれば、鱗片状結晶構
造を有する材料を含む絶縁粉末に対し、1〜川重量%の
強度のある層状構造を持つ雲母粉末を混合し、これに対
し3〜15重量%のシリコーン樹脂を含有させるように
したもので、層状構造を持つ雲母が粉末にすることによ
り扁平な形状となるため、この雲母粉末を絶縁粉末中に
混合してブレス成形を行うと、雲母粉末が層状に位置し
て、その周囲が複数の絶縁粉末粒子と接した状態でシリ
コーン樹脂により結合されることになり、その結果、絶
縁粉末に対して熱膨張による引張り荷重が加わり、絶縁
粉末粒子間を分離しようとする力が働いても、この粒子
間には層状に雲母粉末が介在しており、この雲母粉末を
破断させるに要する力はシリコーン樹脂で結合された粒
子間を分離する力よりはるかに大であり、この雲母粉末
が補強材としての働きを行い、随所に存在するため、絶
縁粉末へのクラックや欠落の発生がなく、さらに通電テ
ストを行つても絶縁粉末へのクラックが発生しないため
、断線の発生もなく、絶縁性能も向上した電熱線埋込用
の絶縁材料を提供することができるものである。なお、
本発明の絶縁材料をシーズヒータに用いてもクラック発
生を防止てきるなど同等の効果を奏することは言うまで
もない。
In addition, Figure 5 shows a silicone varnish with a resin content of 9% by weight added to an insulating powder made by mixing 6% by weight of mica with a mixed powder of talc having a scale-like crystal structure and alumina, a metal oxide. and after filling groove 2, 100k9/
This is a cross-sectional electron micrograph of an insulating material that was pressed under a pressure of 380°C and fired for 5 hours. As is clear from the above description, according to the present invention, mica powder having a strong layered structure is mixed with an insulating powder containing a material having a scaly crystal structure in an amount of 1 to 1% by weight, and It contains 3 to 15% by weight of silicone resin. Mica, which has a layered structure, becomes a flat shape when powdered, so this mica powder is mixed into insulating powder and press molded. Then, the mica powder is located in a layered manner, and the periphery of the mica powder is in contact with multiple insulating powder particles and bonded by silicone resin, and as a result, a tensile load due to thermal expansion is applied to the insulating powder. Even if a force tries to separate the insulating powder particles, there is a layer of mica powder between these particles, and the force required to break the mica powder separates the particles bonded with silicone resin. This mica powder acts as a reinforcing material and is present everywhere, so there is no cracking or chipping of the insulating powder, and there is no damage to the insulating powder even when conducting an energization test. Since cracks do not occur, it is possible to provide an insulating material for embedding heating wires that does not cause disconnection and has improved insulation performance. In addition,
It goes without saying that even when the insulating material of the present invention is used in a sheathed heater, similar effects such as preventing the occurrence of cracks can be achieved.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例を示す埋込型ヒータの断面図
、第2図は同埋込型ヒータの絶縁材料の模式図、第3図
は同埋込型ヒータ要部断面拡大模式図、第4図は同埋込
型ヒータおよび従来の埋込型ヒータの絶縁抵抗の時間特
性図、第5図は本発明の一実施例を示す埋込型ヒータの
絶縁材料の電子顕微鏡写真てある。 3・・・・・・絶縁材料。
Fig. 1 is a sectional view of an embedded heater showing an embodiment of the present invention, Fig. 2 is a schematic diagram of the insulating material of the embedded heater, and Fig. 3 is an enlarged cross-sectional view of the main part of the embedded heater. 4 is a time characteristic diagram of insulation resistance of the same embedded heater and a conventional embedded heater, and FIG. 5 is an electron micrograph of an insulating material of an embedded heater showing an embodiment of the present invention. be. 3...Insulating material.

Claims (1)

【特許請求の範囲】[Claims] 1 鱗片状結晶構造を有する材料を含む絶縁粉末に対し
、1〜10重量%の強度のある層状構造を持つ雲母粉末
を混合し、これに対し3〜15重量%のシリコーン樹脂
を含有させてなる電熱線埋込用の絶縁材料。
1. 1 to 10% by weight of mica powder having a strong layered structure is mixed with an insulating powder containing a material having a scaly crystal structure, and 3 to 15% by weight of silicone resin is contained therein. Insulating material for embedding heating wires.
JP3987381A 1981-03-18 1981-03-18 Insulating material for embedding heating wires Expired JPS6048841B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3987381A JPS6048841B2 (en) 1981-03-18 1981-03-18 Insulating material for embedding heating wires

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3987381A JPS6048841B2 (en) 1981-03-18 1981-03-18 Insulating material for embedding heating wires

Publications (2)

Publication Number Publication Date
JPS57152607A JPS57152607A (en) 1982-09-21
JPS6048841B2 true JPS6048841B2 (en) 1985-10-29

Family

ID=12565093

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3987381A Expired JPS6048841B2 (en) 1981-03-18 1981-03-18 Insulating material for embedding heating wires

Country Status (1)

Country Link
JP (1) JPS6048841B2 (en)

Also Published As

Publication number Publication date
JPS57152607A (en) 1982-09-21

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