JPS6049634U - bonding equipment - Google Patents

bonding equipment

Info

Publication number
JPS6049634U
JPS6049634U JP1983142398U JP14239883U JPS6049634U JP S6049634 U JPS6049634 U JP S6049634U JP 1983142398 U JP1983142398 U JP 1983142398U JP 14239883 U JP14239883 U JP 14239883U JP S6049634 U JPS6049634 U JP S6049634U
Authority
JP
Japan
Prior art keywords
capillary
bonding equipment
thin wire
vibrator
wire inside
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983142398U
Other languages
Japanese (ja)
Inventor
丹治　幸雄
山口　光男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1983142398U priority Critical patent/JPS6049634U/en
Publication of JPS6049634U publication Critical patent/JPS6049634U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member

Landscapes

  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図はキャピラリの断面図、第２図は従来におけるボ
ンディング機械の概略図、第３図は本考案の一実施例を
示す断面図である。 １・・・キャピラリ本体、１ａ・・・キャピラリ入口、
１ｂ・・・キャピラリ先端、１ｃ・・・孔、２・・・細
線スプール、３・・・細線クランプ部分、４・・・ピン
セット、５・・・被ボンデイング用膜回路基板、６・・
・細線、７′・・・押さえ、８・・・振動子、９・・・
手元スイッチ、９ａ・・・スイッチボタン。FIG. 1 is a sectional view of a capillary, FIG. 2 is a schematic diagram of a conventional bonding machine, and FIG. 3 is a sectional view showing an embodiment of the present invention. 1... Capillary body, 1a... Capillary inlet,
1b... Capillary tip, 1c... Hole, 2... Thin wire spool, 3... Thin wire clamp portion, 4... Tweezers, 5... Film circuit board for bonding, 6...
・Thin wire, 7'... Holder, 8... Vibrator, 9...
Hand switch, 9a...switch button.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] キャピラリと、該キャピラリ内の細線を振動させる振動
子とを具備し、前記振動子の振動によって前記キャピラ
リ内の細線を自動的にキャピラリ外に引き出す事を特徴
とするボンディング装置。1. A bonding device comprising a capillary and a vibrator that vibrates a thin wire inside the capillary, and automatically draws the thin wire inside the capillary out of the capillary by vibration of the vibrator.
JP1983142398U 1983-09-14 1983-09-14 bonding equipment Pending JPS6049634U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983142398U JPS6049634U (en) 1983-09-14 1983-09-14 bonding equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983142398U JPS6049634U (en) 1983-09-14 1983-09-14 bonding equipment

Publications (1)

Publication Number Publication Date
JPS6049634U true JPS6049634U (en) 1985-04-08

Family

ID=30318193

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983142398U Pending JPS6049634U (en) 1983-09-14 1983-09-14 bonding equipment

Country Status (1)

Country Link
JP (1) JPS6049634U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6276527A (en) * 1985-09-30 1987-04-08 Toshiba Corp Wire bonding capillary

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6276527A (en) * 1985-09-30 1987-04-08 Toshiba Corp Wire bonding capillary

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