JPS6050344B2 - Composite terminal for integrated circuits - Google Patents
Composite terminal for integrated circuitsInfo
- Publication number
- JPS6050344B2 JPS6050344B2 JP55026606A JP2660680A JPS6050344B2 JP S6050344 B2 JPS6050344 B2 JP S6050344B2 JP 55026606 A JP55026606 A JP 55026606A JP 2660680 A JP2660680 A JP 2660680A JP S6050344 B2 JPS6050344 B2 JP S6050344B2
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- brazing
- integrated circuits
- composite terminal
- intermediate metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
- H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】
従来、集積回路用セラミック系パッケージ端子は、た
とえば図１に示すごとく、あらかじめセラミック系パッ
ケージ１に被着したリード材３に、あらかじめロウ材４
を固着した端子材２からなる端子Ａを当接し、ロウ付け
部分を適当な温度に加熱しつつ圧力Ｐを加えてロウ付け
して製造する方法が採用されている。DETAILED DESCRIPTION OF THE INVENTION Conventionally, as shown in FIG. 1, for example, ceramic package terminals for integrated circuits have a soldering material 4 attached to a lead material 3 that is previously attached to a ceramic package 1.
A manufacturing method is employed in which a terminal A made of a terminal material 2 having a bonded terminal material 2 is brought into contact with the terminal A, and the brazed portion is heated to an appropriate temperature while applying pressure P to perform brazing.
この場合、ロウ材４は一般に銀ロウ（例えば７２％Ａ
ｇ）２８％Ｃｕ）、あるいは金など高価な貴金属を用い
るため、その低価格化が望まれている。In this case, the solder material 4 is generally silver solder (for example, 72% A
g) 28% Cu) or expensive noble metals such as gold, it is desired to reduce the price.
この低価格化方法の一例としてロウ材の薄肉化があるが
、薄肉にするとロウ材が圧縮変形し難くなり、リード材
３と端子Ａとを均一に全面ロウ付けするためには、ロウ
付け圧力Ｐを著大ならしめる必要がある。この結果、セ
ラミック系パッケージ１にヘヤークラツクが生じたり、
端子Ａが変形するため、ロウ材４の厚さ（を）は一般に
０．０６〜０．０８＄Ｉ）望ましくは０．０８７７！７
７１が必要である。他の低価格化方法としてロウ付け部
の面積を減少させる方法がある。しかし、この場合はロ
ウ付け強度が低下すること、使用中の半導体の温度上昇
を放熱するための端子側への伝熱面積が減少することな
どから、半導体の特性を低下させるおそれがあり好まし
くない。 本発明は上記の問題点を、ロウ材４を端子材
２との間に、ロウ材４とほぼ同等の導電性、熱伝導性お
よび強靭性をもち、かつ安価な中間金属材５を介在させ
ることにより解消せんとするものである。One example of this cost-reducing method is to make the brazing material thinner; however, making the brazing material thinner makes it difficult for the brazing material to be compressed and deformed. It is necessary to make P significant. As a result, hair cracks may occur in the ceramic package 1,
Since the terminal A is deformed, the thickness of the brazing material 4 is generally 0.06 to 0.08$I), preferably 0.0877!7
71 is required. Another cost reduction method is to reduce the area of the brazed portion. However, in this case, the brazing strength decreases, and the heat transfer area to the terminal side for dissipating the temperature rise of the semiconductor during use decreases, which is undesirable because there is a risk of degrading the characteristics of the semiconductor. . The present invention solves the above problem by interposing an intermediate metal material 5 between the brazing material 4 and the terminal material 2, which has substantially the same electrical conductivity, thermal conductivity, and toughness as the brazing material 4, and is inexpensive. This is what we are trying to resolve.
すなわち、本発明の端子は、たとえば第２図に示すごと
く、セラミック系パッケージ１に固着したリード材３（
たとえばＮｉ）に、ロウ材（たとえは７２％Ａｇ−２８
％Ｃｕ合金）と中間金属材５（たとえば７２％Ａｇ−２
８％Ｃｕ合金ににはＣｕあるいはＣｕ合金）を固着した
端子材２（たとえばＦｅ４２％Ｎｉ合金、Ｆｅ−２９％
Ｎｉ−１７％Ｃｏ合金）で構成した端子片Ｂを当接し、
ついで適当温度に加熱しつつ圧力Ｐを加えてロウ付けし
て製造した複合端子てある。 上記のごとき本発明端子
の製造にあたり、過大なロウ付け圧力Ｐを採用する必要
がなく、かつ、ロウ材４と中間金属材５によるロウ付け
圧力の緩衝効果が得られ、セラミック系パッケージのク
ラック発生、端子材２の曲り等もなく、放熱（伝熱）性
も満足でき、信頼性の高い端子が得られた。That is, the terminal of the present invention, as shown in FIG. 2, has a lead material 3 (
For example, Ni), brazing material (for example, 72% Ag-28
% Cu alloy) and intermediate metal material 5 (e.g. 72% Ag-2
Terminal material 2 (for example, Fe42%Ni alloy, Fe-29%
A terminal piece B made of Ni-17%Co alloy) is brought into contact with the
The composite terminal is then manufactured by heating it to an appropriate temperature and applying pressure P to braze it. In manufacturing the terminal of the present invention as described above, it is not necessary to employ an excessive brazing pressure P, and the brazing pressure is buffered by the brazing material 4 and the intermediate metal material 5, thereby preventing cracks in the ceramic package. There was no bending of the terminal material 2, the heat dissipation (heat transfer) was satisfactory, and a highly reliable terminal was obtained.
実施例
図２において、ロウ材４として７２％Ａｇ−２８％Ｃ
ｕ合金板と、中間金属材５として純銅板とを厚さ比１：
６で冷間圧延により圧着し、ついでこれらの圧着材を端
子材２（Ｆｅ−４２％Ｎｉ合金）に冷間圧延により圧着
して最終厚さを、：０．０１０■、を。Example In Fig. 2, the brazing material 4 is 72%Ag-28%C.
The thickness ratio of the u alloy plate and the pure copper plate as the intermediate metal material 5 is 1:
6, and then these crimped materials were crimped to the terminal material 2 (Fe-42%Ni alloy) by cold rolling to give a final thickness of: 0.010 mm.
：Ｏ、Ｏ７０７Ｔ０７ｌ）を３：Ｏ、２５４ｗｎに仕上
げした。その他この端子材から精密打抜きした複合端子
Ｂを、アルミナニセラミツク系パッケージ１に被着した
リード材３（Ｎ１）に当接し、ついで８００℃に加熱し
たロウ付け炉（図示せず）内で０．５ｋ９／Ｗｌｔの圧
力Ｐでロウ付けした。この結果、上記パッケージ１には
まつたくクラックの発生がみられず、端子Ｂも実用上支
障となる曲りは認められなかつた。:O, O707T07l) was finished to 3:O, 254wn. In addition, a composite terminal B precision punched from this terminal material was brought into contact with the lead material 3 (N1) adhered to the alumina ceramic package 1, and then placed in a brazing furnace (not shown) heated to 800°C. Brazing was performed at a pressure P of .5k9/Wlt. As a result, no cracks were observed in the package 1, and no bending that would pose a practical problem was observed in the terminal B.
以上のとおり、本発明は端子側に銀ロウ材とほぼ同等の
導電性、熱伝導性、強靭性を有する中間金属材を介在さ
せて、高価な銀ロウ材を薄肉化させたことにあるが、上
記中間金属材として実施例に示す純銅のほか銅合金も利
用できるから業界におよぼす技術的成果は著大である。As described above, the present invention consists in making the expensive silver brazing material thinner by interposing an intermediate metal material having almost the same electrical conductivity, thermal conductivity, and toughness as the silver brazing material on the terminal side. In addition to the pure copper shown in the examples, copper alloys can also be used as the intermediate metal material, so the technical results in the industry are significant.
図面の簡単な説明図１は従来の集積回路用端子の断面図
、図２は本発明の集積回路用端子の断面図。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a sectional view of a conventional integrated circuit terminal, and FIG. 2 is a sectional view of an integrated circuit terminal of the present invention.
１：パツケージ、２：端子材、３：リード材、４：ロウ
材、５：中間金属材。1: Package cage, 2: Terminal material, 3: Lead material, 4: Brazing material, 5: Intermediate metal material.
Claims (1)
ド材にロウ付けする端子において、ロウ材と端子材との
間に中間金属材を介在固着した集積回路用複合端子。1. A composite terminal for integrated circuits in which an intermediate metal material is interposed and fixed between the soldering material and the terminal material in a terminal to be brazed to a lead material fixed to a ceramic package for integrated circuits.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55026606A JPS6050344B2 (en) | 1980-03-05 | 1980-03-05 | Composite terminal for integrated circuits |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55026606A JPS6050344B2 (en) | 1980-03-05 | 1980-03-05 | Composite terminal for integrated circuits |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56124253A JPS56124253A (en) | 1981-09-29 |
| JPS6050344B2 true JPS6050344B2 (en) | 1985-11-08 |
Family
ID=12198156
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55026606A Expired JPS6050344B2 (en) | 1980-03-05 | 1980-03-05 | Composite terminal for integrated circuits |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6050344B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0561652U (en) * | 1991-12-28 | 1993-08-13 | 株式会社トヨトミ | Refueling safety device for oil combustor |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2525873B2 (en) * | 1988-07-26 | 1996-08-21 | 住友電気工業株式会社 | Connection structure between semiconductor device parts |
-
1980
- 1980-03-05 JP JP55026606A patent/JPS6050344B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0561652U (en) * | 1991-12-28 | 1993-08-13 | 株式会社トヨトミ | Refueling safety device for oil combustor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56124253A (en) | 1981-09-29 |
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