JPS6050917A - Wafer temperature controller of molecular ray epitaxial device - Google Patents
Wafer temperature controller of molecular ray epitaxial deviceInfo
- Publication number
- JPS6050917A JPS6050917A JP58160073A JP16007383A JPS6050917A JP S6050917 A JPS6050917 A JP S6050917A JP 58160073 A JP58160073 A JP 58160073A JP 16007383 A JP16007383 A JP 16007383A JP S6050917 A JPS6050917 A JP S6050917A
- Authority
- JP
- Japan
- Prior art keywords
- cylinder
- temperature
- window
- wafer
- wafer temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/22—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using physical deposition, e.g. vacuum deposition or sputtering
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は超高真空のチャンバ内にウェハを装填し、との
ウェハには分子線の形でGa、Al・ AS等の材料を
入射して膜生長させる分子線エピタキシャル装置におけ
るウェハ温度制御装置に関する。Detailed Description of the Invention The present invention is a molecular beam epitaxial method in which a wafer is loaded in an ultra-high vacuum chamber, and materials such as Ga, Al, and AS are incident on the wafer in the form of molecular beams to grow a film. The present invention relates to a wafer temperature control device in an apparatus.
分子線エピタキシャル装置は、一般に原理的には第1図
に示すようになっている。A molecular beam epitaxial apparatus is generally designed in principle as shown in FIG.
第1図において、1は内部が超高真空のチャンバ、2は
このチャンバ1内に装填されたGaAsのウェハ、3は
ウェハ加熱用のヒータ、4はウニ/・2に分子線の形で
入射されるGa、Ag、As等の材料供給源、5I′i
ヒータ線、6は/ヤノタ、7は電子銃、8は質量分析器
、9ばRHKEDスクリーンである。第2図は上記チャ
ンバ1の一部破断斜視図である。第2図において、Ll
−j:シャッタ6の操作用ノブ、10は液体窒素の容器
、11はチャンバ1のウェハ装填穴12からチャンバ1
内に装填されたウェハ2を分子線入射側に向けるなどの
操作用ノブである。このような分子線エピタキシャル装
置は、ウェハ2上の膜生長の厚さを精度よく制御できる
ものであるが、従来、このウェハ2は第3図に示すよう
に、モリブデンブロソり13の表面14にインジウム等
の張シ付は用部材15を介して張り付けられた状態でチ
ャンバ1内に装填される。一方、チャンバ1内には、前
記装填位置にあるモリブデンブロック13を支持する部
材16とヒータ3および感温素子としての熱電対17と
が設けられる。したがって、モリブデンブロック13が
チャンバ1内の所定の位置に装填されると、モリブデン
ブロック13の裏面18側にはヒータ3と熱電対17と
が配置されることになる。この熱電対17はヒータ3に
より加熱されるウェハ2の温度を検知し、その検知出力
を図示しない温度制御回路に与えるものである。また、
この温度制御回路はこの検知出力に応答してヒータ3の
加熱動作を制御し、ウェハ2が常に550°C〜”00
°C程度の所定の温度に保たれるようにする。In Figure 1, 1 is a chamber with an ultra-high vacuum inside, 2 is a GaAs wafer loaded in this chamber 1, 3 is a heater for heating the wafer, and 4 is incident on the sea urchin/2 in the form of a molecular beam. Material supply sources such as Ga, Ag, As, etc.
6 is a heater wire, 7 is an electron gun, 8 is a mass spectrometer, and 9 is an RHKED screen. FIG. 2 is a partially cutaway perspective view of the chamber 1. In Figure 2, Ll
-j: knob for operating the shutter 6, 10 is a liquid nitrogen container, 11 is a wafer loading hole 12 of chamber 1 to chamber 1;
This knob is used for operations such as directing the wafer 2 loaded therein toward the molecular beam incidence side. Such a molecular beam epitaxial apparatus is capable of precisely controlling the thickness of the film grown on the wafer 2, but conventionally, the wafer 2 is coated on the surface 14 of the molybdenum broth 13 as shown in FIG. A material such as indium is loaded into the chamber 1 in a state where it is pasted through a member 15. On the other hand, inside the chamber 1, there are provided a member 16 that supports the molybdenum block 13 in the loading position, a heater 3, and a thermocouple 17 as a temperature sensing element. Therefore, when the molybdenum block 13 is loaded at a predetermined position in the chamber 1, the heater 3 and the thermocouple 17 are arranged on the back surface 18 side of the molybdenum block 13. This thermocouple 17 detects the temperature of the wafer 2 heated by the heater 3, and provides its detection output to a temperature control circuit (not shown). Also,
This temperature control circuit controls the heating operation of the heater 3 in response to this detection output, so that the wafer 2 is always kept between 550°C and 00°C.
It is maintained at a predetermined temperature of about °C.
ところで、モリブデンブロック13の熱輻射率は0.2
8であるのに対し、ウエノ・2上に生長するGaA e
生長層のそれは0.7である。また、モリブデンブロッ
ク13のウェハ2を除く表面にもGaAs生長層が生成
されてくる。したがって、生長開始時のウェハ温度は、
モリブデンブロック13の該表面14にGaA[]生長
層が生成されてくるにしたがって低下し、生長終了時の
それと比較して40 ’C〜50 ’Cあるいはそれ以
上に低下してくる。しかるに、熱電対17は、モリブデ
ンブロック13の裏面に位置してモリブデンブロック1
3の局部的な温度をウェハ温度としている。このだめ、
実際のウェハ温度が大きく低下しているのにモリブデン
ブロック130局部的な温度が一定であることによりウ
ェハ温度も一定であるとしてウェハ温度を制御するおそ
れがあった。このような不安定な温度制御では、ウェハ
上に所定の緒特性を満足するGaA[]生長層を得るこ
とをできないという難点があった。また、モリブデンブ
ロックと熱電対との互いの位置関係をどのモリブテンブ
ロックに対しても常に一定に々るように装填することも
困難であり、いずれにしても熱電対を用いるものでは安
定した温度制御を行うことに難点があった。By the way, the thermal emissivity of the molybdenum block 13 is 0.2.
8, whereas GaA e growing on Ueno-2
That of the growing layer is 0.7. Further, a GaAs growth layer is also generated on the surface of the molybdenum block 13 except for the wafer 2. Therefore, the wafer temperature at the start of growth is
As the GaA growth layer is formed on the surface 14 of the molybdenum block 13, the temperature decreases to 40'C to 50'C or more compared to the temperature at the end of growth. However, the thermocouple 17 is located on the back side of the molybdenum block 13 and
The local temperature of No. 3 is taken as the wafer temperature. This is no good,
Since the local temperature of the molybdenum block 130 remains constant even though the actual wafer temperature has significantly decreased, there is a risk that the wafer temperature may be controlled assuming that the wafer temperature is also constant. Such unstable temperature control has the disadvantage that it is impossible to obtain a GaA[] growth layer on the wafer that satisfies predetermined growth characteristics. In addition, it is difficult to load molybdenum blocks and thermocouples so that the mutual positional relationship is always constant for every molybdenum block, and in any case, devices that use thermocouples do not provide stable temperature control. There were some difficulties in doing so.
本発明は、ウエノ・温度を常に安定して制御できるよう
にすると七を主たる目的とする。The main object of the present invention is to enable constant and stable control of temperature.
以下、本発明を図面に示す一実施例に基づいて詳細に説
明する。Hereinafter, the present invention will be explained in detail based on an embodiment shown in the drawings.
第4図はこの実施例の要部の断面図である。この実施例
は、第1図、第2図に示す分子線エピタキシャル装置の
チャンバ1に、モリブデンに張り付けられたウェハから
の赤外線19を通過させるだめの筒状の窓20を有する
。この窓20には、所定の筒長を有する筒体21の一端
側が取付けられる。この筒体21の他端側に石英窓22
が形成される。この他端側の筒長方向線上にウエノ・温
度検知用の赤外線輻射温度計23が配置される。筒体2
1の一部には、石英窓22の汚れを防止する石英板24
が、筒体内外を往復動(図上、上下方向)可能に取付け
られる。即ち、筒体21の一部がその径方向に膨出され
て膨出部25が形成され、石英板24は支持軸26によ
り実線と鎖線との間を往復動可能とされるとともに、鎖
線位置においては膨出部25内に収納されるようになっ
ている。FIG. 4 is a sectional view of the main parts of this embodiment. In this embodiment, a chamber 1 of the molecular beam epitaxial apparatus shown in FIGS. 1 and 2 has a cylindrical window 20 through which infrared rays 19 from a wafer bonded to molybdenum pass. One end side of a cylindrical body 21 having a predetermined length is attached to this window 20 . A quartz window 22 is provided at the other end of this cylinder 21.
is formed. An infrared radiation thermometer 23 for detecting Ueno temperature is arranged on the other end in the cylinder length direction. Cylindrical body 2
1 includes a quartz plate 24 that prevents the quartz window 22 from getting dirty.
is attached so that it can reciprocate inside and outside the cylinder (up and down in the figure). That is, a part of the cylindrical body 21 is bulged in the radial direction to form a bulged portion 25, and the quartz plate 24 can be reciprocated between the solid line and the chain line by the support shaft 26, and the quartz plate 24 can be moved back and forth between the solid line and the chain line. In this case, it is housed in the bulge 25.
なお、この実施例では膨出部25は筒体21の一部を膨
出してつくられているが、筒体21とは側構造にし、こ
れを窓20と筒体21との間に設けることもできる。こ
のよりな側構造にした場合には上記筒体21はこの側構
造も含む用語であると定義する。この実施例では、先ず
石英板24を膨出部25内の鎖線位置に退避させた状態
で赤外線19を筒体21内を通過させ、石英窓22を介
して赤外線輻射温度計23に入射させる。赤外線輻射温
度計23で、入射された赤外線19による輻射温度を計
測する。このときの計測温度をTloCとする。次に、
石英板24を実線位置にまで可動させた状態で同様に輻
射温度を計測する。このときの計測温度を12°Cとす
る。この計測温度の差をΔT ℃とする。この温度差Δ
T ℃に対応して、温度計23の計測温度は12°Cで
あるが、これがTloCとして読取られるように温度計
23の補正用ボリュームを調整する。In this embodiment, the bulging portion 25 is made by bulging out a part of the cylindrical body 21, but it is also possible to form a side structure with the cylindrical body 21 and provide it between the window 20 and the cylindrical body 21. You can also do it. When this side structure is adopted, the term cylindrical body 21 is defined to include this side structure. In this embodiment, first, with the quartz plate 24 retracted to the position indicated by the chain line in the bulge 25, infrared rays 19 are passed through the cylinder 21 and are made to enter the infrared radiation thermometer 23 through the quartz window 22. The infrared radiation thermometer 23 measures the radiation temperature due to the incident infrared rays 19. Let the measured temperature at this time be TloC. next,
The radiation temperature is similarly measured with the quartz plate 24 moved to the solid line position. The measured temperature at this time is 12°C. This difference in measured temperature is defined as ΔT°C. This temperature difference Δ
Corresponding to T° C., the temperature measured by the thermometer 23 is 12° C., and the correction volume of the thermometer 23 is adjusted so that this is read as TloC.
ところが、石英板24は、チャンバ1内のAsなどによ
り汚れてくるので、前記計測温度T2°Cが変化してく
る。ただし、石英窓22は石英板24により汚れが防止
されるので例えば数カ月程度では測定値に影響を与える
程にはほとんど汚れず、したがって前記計測温度T1°
Cはほぼ一定であるとみなしてよい。このため、計測温
度の差がΔT ’Cから277°Cに変化するとき、こ
の変化の差から更に補正用ボリュームをこのΔT/°C
に対応して調整する。したがって、石英板24が汚れて
きても温度計23の読取温度をウニ・・の温度に正確に
対応させることができる。ただし、基準となる計測温度
T1°Cは、GaAsおよび石英窓22の各熱輻射率を
考慮して計測されたものである。However, since the quartz plate 24 becomes contaminated with As in the chamber 1, the measured temperature T2°C changes. However, since the quartz window 22 is prevented from getting dirty by the quartz plate 24, it will hardly get dirty to the extent that it will affect the measured value, for example, for several months, and therefore the measured temperature T1°
C may be considered to be approximately constant. Therefore, when the difference in measured temperature changes from ΔT'C to 277°C, the correction volume is further adjusted to ΔT/°C based on the difference in temperature.
Adjust accordingly. Therefore, even if the quartz plate 24 becomes dirty, the temperature read by the thermometer 23 can accurately correspond to the temperature of the sea urchin. However, the reference measurement temperature T1°C was measured taking into consideration the thermal emissivity of GaAs and the quartz window 22.
以上のように、本発明によれば、超高真空のチャンバに
、モリブデンに張り付けられたウエノ・からの赤外線を
通過させる窓を形成し、この窓に所定の筒長を有する筒
体の一端側を取付け、この筒体の他端側に石英窓を形成
するとともにこの他端側の筒長方向線上にウニ・・温度
検知用の赤外線輻射温度計を配置し、筒体の一部には、
石英窓の汚れを防止する石英板を筒体外と筒体内との間
を往復動可能に取付け、石英板が筒体内にあるときとな
いときとの間の赤外線輻射温度計の読取温度差の変化を
該読取温度の補正値としたので、熱電対によるウェハ温
度制御をすることがなくなり、また石英窓の汚れを防止
するために石英板を更に設け、この石英板の汚れによる
輻射温度の読取り誤差は補正によりなくすことが可能と
なり、正確にかつ安定したウエノ・温度の制御を行い、
ウエノ・上の生長膜の質の向上を図ることができる。As described above, according to the present invention, a window is formed in an ultra-high vacuum chamber through which infrared rays from Ueno bonded to molybdenum pass, and one end of a cylinder having a predetermined length is placed in the window. A quartz window is formed on the other end of the cylinder, and an infrared radiation thermometer for detecting sea urchin temperature is placed on the other end of the cylinder.
A quartz plate that prevents the quartz window from becoming dirty is attached so that it can move back and forth between the outside and inside of the cylinder, and the change in temperature difference read by an infrared radiation thermometer between when the quartz plate is inside the cylinder and when it is not. is used as the correction value for the reading temperature, so there is no need to use a thermocouple to control the wafer temperature, and a quartz plate is additionally provided to prevent the quartz window from getting dirty. It is now possible to eliminate this through correction, allowing accurate and stable Ueno/temperature control.
It is possible to improve the quality of the growth film on Ueno.
第1図は分子線エピタキシャル装置の原理説明に供する
該装置の模式図、第2図はこの装置のチャンバの一部切
欠き斜視図、第3図は従来例の断面図、第4図は本発明
の実施例の断面図である。
1・・−f−ヤ7)Z、19・・赤外線、20・g、2
1・・筒体、22・・石英窓、23・・赤外線輻射温度
計、24・・石英板。
出 願 人 ローム株式会社
代 理 人 弁理士岡田和秀Fig. 1 is a schematic diagram of a molecular beam epitaxial apparatus used to explain the principle of the apparatus, Fig. 2 is a partially cutaway perspective view of the chamber of this apparatus, Fig. 3 is a cross-sectional view of a conventional example, and Fig. 4 is a diagram of the present invention. FIG. 2 is a cross-sectional view of an embodiment of the invention. 1...-f-ya7) Z, 19...infrared, 20・g, 2
1. Cylindrical body, 22.. Quartz window, 23.. Infrared radiation thermometer, 24.. Quartz plate. Applicant: ROHM Co., Ltd. Agent: Kazuhide Okada, patent attorney
Claims (1)
られたウニ・・からの赤外線を通過させる窓を形成し、
この窓に所定の筒長を有する筒体の一端側を取付け、こ
の筒体の他端側に石英窓を形成するとともにこの他端側
の筒長方向線上にウェハ温度検知用の赤外線輻射温度計
を配置し、筒体の一部には、前記石英窓の汚れを防止す
る石英板を筒体外と筒体内との間を往復動可能に取付け
、石英板が筒体内にあるときとないときとの間の赤外線
輻射温度計の計測温度差の変化を該計測温度の補正値と
する、分子線エピタキシャル装置のウェハ温度制御装置
。(1) A window is formed in an ultra-high vacuum chamber that allows infrared rays from the sea urchin attached to molybdenum to pass through.
One end side of a cylinder having a predetermined cylinder length is attached to this window, and a quartz window is formed on the other end side of this cylinder, and an infrared radiation thermometer for detecting wafer temperature is placed on the cylinder length direction line on this other end side. A quartz plate is attached to a part of the cylinder so that it can move back and forth between the outside of the cylinder and the inside of the cylinder to prevent the quartz window from getting dirty. A wafer temperature control device for a molecular beam epitaxial apparatus, which uses a change in a temperature difference measured by an infrared radiation thermometer between the steps as a correction value for the measured temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58160073A JPS6050917A (en) | 1983-08-30 | 1983-08-30 | Wafer temperature controller of molecular ray epitaxial device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58160073A JPS6050917A (en) | 1983-08-30 | 1983-08-30 | Wafer temperature controller of molecular ray epitaxial device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6050917A true JPS6050917A (en) | 1985-03-22 |
| JPH0113214B2 JPH0113214B2 (en) | 1989-03-03 |
Family
ID=15707296
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58160073A Granted JPS6050917A (en) | 1983-08-30 | 1983-08-30 | Wafer temperature controller of molecular ray epitaxial device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6050917A (en) |
-
1983
- 1983-08-30 JP JP58160073A patent/JPS6050917A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0113214B2 (en) | 1989-03-03 |
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