JPS6051678A - セラミツクス粒子のニツケル化学コ−ト方法 - Google Patents

セラミツクス粒子のニツケル化学コ−ト方法

Info

Publication number: JPS6051678A
Authority: JP; Japan
Prior art keywords: ceramic particles; nickel; treatment; chemical coating; chemical
Prior art date: 1983-08-31
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP15996983A

Other languages

English (en)

Japanese (ja)

Other versions

JPH0148239B2 (2

Inventor

千田　恭一

笠原　真

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Resonac Holdings Corp

Original Assignee

Showa Denko KK

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1983-08-31

Filing date

1983-08-31

Publication date

1985-03-23

1983-08-31 Application filed by Showa Denko KK filed Critical Showa Denko KK

1983-08-31 Priority to JP15996983A priority Critical patent/JPS6051678A/ja

1985-03-23 Publication of JPS6051678A publication Critical patent/JPS6051678A/ja

1989-10-18 Publication of JPH0148239B2 publication Critical patent/JPH0148239B2/ja

Status Granted legal-status Critical Current

Links

PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims description 51
239000002245 particle Substances 0.000 title claims description 37
238000000576 coating method Methods 0.000 title claims description 31
239000000126 substance Substances 0.000 title claims description 28
239000000919 ceramic Substances 0.000 title claims description 26
229910052759 nickel Inorganic materials 0.000 title claims description 11
239000011248 coating agent Substances 0.000 claims description 28
238000000034 method Methods 0.000 claims description 13
239000003638 chemical reducing agent Substances 0.000 claims description 2
150000002815 nickel Chemical class 0.000 claims description 2
238000011282 treatment Methods 0.000 description 27
238000000227 grinding Methods 0.000 description 14
239000006061 abrasive grain Substances 0.000 description 11
238000006243 chemical reaction Methods 0.000 description 7
206010070834 Sensitisation Diseases 0.000 description 4
230000004913 activation Effects 0.000 description 4
230000008313 sensitization Effects 0.000 description 4
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
229910003460 diamond Inorganic materials 0.000 description 3
239000010432 diamond Substances 0.000 description 3
239000002184 metal Substances 0.000 description 3
229910052751 metal Inorganic materials 0.000 description 3
CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
229910052582 BN Inorganic materials 0.000 description 2
PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
230000000052 comparative effect Effects 0.000 description 2
230000007812 deficiency Effects 0.000 description 2
238000011221 initial treatment Methods 0.000 description 2
238000001556 precipitation Methods 0.000 description 2
238000003756 stirring Methods 0.000 description 2
UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
241000218691 Cupressaceae Species 0.000 description 1
ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
239000007868 Raney catalyst Substances 0.000 description 1
NPXOKRUENSOPAO-UHFFFAOYSA-N Raney nickel Chemical compound [Al].[Ni] NPXOKRUENSOPAO-UHFFFAOYSA-N 0.000 description 1
VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
239000002253 acid Substances 0.000 description 1
239000003513 alkali Substances 0.000 description 1
PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
238000004458 analytical method Methods 0.000 description 1
238000004364 calculation method Methods 0.000 description 1
235000013339 cereals Nutrition 0.000 description 1
230000003247 decreasing effect Effects 0.000 description 1
230000008021 deposition Effects 0.000 description 1
235000011868 grain product Nutrition 0.000 description 1
230000017525 heat dissipation Effects 0.000 description 1
239000003446 ligand Substances 0.000 description 1
239000007788 liquid Substances 0.000 description 1
238000004519 manufacturing process Methods 0.000 description 1
239000000463 material Substances 0.000 description 1
LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
230000002093 peripheral effect Effects 0.000 description 1
230000002787 reinforcement Effects 0.000 description 1
239000011347 resin Substances 0.000 description 1
229920005989 resin Polymers 0.000 description 1
HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
229910010271 silicon carbide Inorganic materials 0.000 description 1
235000017281 sodium acetate Nutrition 0.000 description 1
239000001632 sodium acetate Substances 0.000 description 1
CSMWJXBSXGUPGY-UHFFFAOYSA-L sodium dithionate Chemical compound [Na+].[Na+].[O-]S(=O)(=O)S([O-])(=O)=O CSMWJXBSXGUPGY-UHFFFAOYSA-L 0.000 description 1
239000007787 solid Substances 0.000 description 1
239000002904 solvent Substances 0.000 description 1
239000004575 stone Substances 0.000 description 1

Landscapes

Polishing Bodies And Polishing Tools (AREA)
Compositions Of Oxide Ceramics (AREA)

JP15996983A 1983-08-31 1983-08-31 セラミツクス粒子のニツケル化学コ−ト方法 Granted JPS6051678A (ja)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP15996983A JPS6051678A (ja)	1983-08-31	1983-08-31	セラミツクス粒子のニツケル化学コ−ト方法

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP15996983A JPS6051678A (ja)	1983-08-31	1983-08-31	セラミツクス粒子のニツケル化学コ−ト方法

Publications (2)

Publication Number	Publication Date
JPS6051678A true JPS6051678A (ja)	1985-03-23
JPH0148239B2 JPH0148239B2 (2)	1989-10-18

Family

ID=15705122

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP15996983A Granted JPS6051678A (ja)	1983-08-31	1983-08-31	セラミツクス粒子のニツケル化学コ−ト方法

Country Status (1)

Country	Link
JP (1)	JPS6051678A (2)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS61158874A (ja) *	1984-12-29	1986-07-18	新日本製鐵株式会社	取鍋用セミジルコン質流し込み不定形耐火物
US7097678B2 (en)	2003-01-06	2006-08-29	Showa Denko K.K.	Metal-coated cubic boron nitride abrasive grain, production method thereof, and resin bonded grinding wheel

Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5227875A (en) *	1975-08-25	1977-03-02	Tokuyama Soda Kk	Manufacture of thermal plastic filmmcovered inorganic fiber mat

1983
- 1983-08-31 JP JP15996983A patent/JPS6051678A/ja active Granted

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5227875A (en) *	1975-08-25	1977-03-02	Tokuyama Soda Kk	Manufacture of thermal plastic filmmcovered inorganic fiber mat

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS61158874A (ja) *	1984-12-29	1986-07-18	新日本製鐵株式会社	取鍋用セミジルコン質流し込み不定形耐火物
US7097678B2 (en)	2003-01-06	2006-08-29	Showa Denko K.K.	Metal-coated cubic boron nitride abrasive grain, production method thereof, and resin bonded grinding wheel

Also Published As

Publication number	Publication date
JPH0148239B2 (2)	1989-10-18

Publication	Publication Date	Title
US7073496B2 (en)	2006-07-11	High precision multi-grit slicing blade
CN1646267A (zh)	2005-07-27	金属镀层磨料、使用金属镀层磨料的砂轮以及生产金属镀层磨料的方法
CA1043578A (en)	1978-12-05	Abrasive particles
US20050081454A1 (en)	2005-04-21	Metal-coated cubic boron nitride abrasive grain, production method thereof, and resin bonded grinding wheel
JP2001246560A (ja)	2001-09-11	電着砥石を用いた研削加工方法
JPH0148239B2 (2)	1989-10-18
KR100599349B1 (ko)	2006-07-12	금속 피복 연삭재, 금속 피복 연삭재를 이용한 연삭 휠,및 금속 피복 연삭재의 제조 방법
JPS6334071A (ja)	1988-02-13	砥石の製造方法
JP3854835B2 (ja)	2006-12-06	エポキシ樹脂乳濁液を用いたレジノイド砥石の製造方法
PT1702969E (pt)	2010-06-25	Grãos abrasivos de nitreto de boro cúbico revestidos com metal e método para a sua produção e rebolo ligado com resina
JP3086670B2 (ja)	2000-09-11	超砥粒砥石
JPH09254041A (ja)	1997-09-30	合成砥石及びその製造法
JPH085012B2 (ja)	1996-01-24	メタルボンド砥石
JP3250746B2 (ja)	2002-01-28	研削研磨用砥石の製造方法および研削研磨用砥石
JPH10235563A (ja)	1998-09-08	超砥粒及びこれを利用した超砥粒ホイール
JPH10329029A (ja)	1998-12-15	電着超砥粒砥石
JPH0360970A (ja)	1991-03-15	研磨用定盤
JP2003260642A (ja)	2003-09-16	鏡面研削方法およびその装置
JP3482322B2 (ja)	2003-12-22	半導体基板用研磨布のドレッサーおよびその製造方法
JPS6333990B2 (2)	1988-07-07
JP3482328B2 (ja)	2003-12-22	半導体基板用研磨布のドレッサーおよびその製造方法
JP4419652B2 (ja)	2010-02-24	研削砥石およびその製造方法
JPH11277439A (ja)	1999-10-12	混合砥粒超砥粒砥石
JP2520474B2 (ja)	1996-07-31	磁気ディスク基盤用多孔質砥石
JPH1199474A (ja)	1999-04-13	鏡面加工用超砥粒砥石

JPS6051678A - セラミツクス粒子のニツケル化学コ−ト方法 - Google Patents

Info

Links

Landscapes

Priority Applications (1)

Applications Claiming Priority (1)

Publications (2)

Family

ID=15705122

Family Applications (1)

Country Status (1)

Cited By (2)

Citations (1)

Patent Citations (1)

Cited By (2)

Also Published As

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