JPS605210B2 - electrical insulation wire - Google Patents

Description

Detailed Description of the Invention The present invention is characterized in that the impregnating resin and the curing catalyst and curing accelerator in the insulating base material do not correspond to each other at room temperature, making it suitable for multi-turn impregnation, and rapidly curing above a certain temperature. It also relates to electrical insulation wire theory that exhibits excellent heat resistance and electrical insulation properties after curing.

Recently, in response to the miniaturization of electrical equipment, electrical insulators are required to have high heat resistance, and class F insulation, which can be operated continuously at 15th grade C or lower, is becoming common.

Conventionally, impregnated insulation is generally used without adding curing catalysts or curing accelerators in order to extend the shelf life of the impregnated resin, so it has disadvantages such as high curing temperature and long curing time. was there. Therefore, a method has also been proposed in which a small amount of a curing aid is included in advance in the millet base material. However, in this case, if for example boron trifluoride monoethylamine or boron trifluoride piveridine is used as a curing accelerator, it will react with the impregnating resin during impregnation and increase the viscosity. , impregnation may stop midway through, resulting in incomplete impregnation. Furthermore, depending on the type of curing aid, if it is allowed to coexist with other components, such as epoxy resin, in the insulating base material, the reaction may proceed by itself, and the shelf life of the insulating base material may be extremely shortened. The inventor of the present invention has carried out extensive studies regarding these points, and has found that an impregnated resin composition consisting of an epoxy resin and an acid anhydride is combined with an aluminum compound such as aluminum triacetylacetonate as a curing catalyst and an aluminum compound as a curing accelerator. When an insulating base material is impregnated with a small amount of a silane compound or a polysiloxane compound containing a hydroxyl group, there is no increase in the viscosity of the impregnated resin composition during impregnation at room temperature, and the viscosity of the impregnated resin composition does not increase in a short period of time at a moderate temperature. It has been found that it cures in a short time and exhibits excellent electrical insulation properties and heat resistance after curing.

Based on the above knowledge, the present invention has been developed so that the impregnated resin does not increase in viscosity during impregnation, can be impregnated with even thick insulation, is passed through a multi-turn high voltage equipment, and is cured in a short time at a moderate temperature. The purpose is to provide an electrical insulation wire theory that has excellent heat resistance and electrical insulation properties.

To explain the present invention below, the present invention involves winding an insulating base material containing an aluminum compound and a hydroxyl group-containing silane compound or a polysiloxane compound as essential components into a wire ring, and then winding the insulating base material with an epoxy resin and an acid anhydride. This is an electrically insulating coil characterized by being impregnated with a resin composition and cured. Examples of the insulating substrate used in the present invention include woven glass cloth, aramid paper, nonwoven polyester or aramid fabric, mica sheet, aramid mica paper, films of polyester, polyimide, polyamideimide, etc., or composites thereof.

These can be used in any form, including sheet or tape. Examples of the aluminum compound used as a curing catalyst include the following.

That is, the general formula (wherein R,, R2 are alkyl groups and B
is a general formula in which R3 to R8 are ligands selected from the group consisting of alkyl groups, e and f are positive integers from 0 to 3, and e+f does not exceed 3). It is a compound. Among these aluminum compounds, aluminum trialkylacetoacetate, aluminum trisacetylacetonate, aluminum alcoholate, aluminum acylate, etc. are particularly useful and are usually selected in an amount of about 0.0001 to 5% by weight based on the epoxy resin of the present invention.

On the other hand, examples of the hydroxyl group-containing silane compound or polysiloxane compound used as a curing accelerator in the present invention include the following. That is, the general formula (wherein R and R' are an alkyl group, a phenyl group,
Aralkyl group, vinyl group, allyl group, which may be the same or different, g and r are positive integers from 0 to 3, and g+
r does not exceed 3.

) or the general formula (wherein R
, ~R7 represents a monovalent organosiloxane containing an alkyl group, a phenyl group, a vinyl group, an aralkyl group, an allyl group, or a hydroxyl group, but does not contain an alkyl group, and may be the same or different, e, t, x, y are positive integers from 0 to 2, s t and x+y do not exceed 2, and u, w are 0 to 2.
indicates a positive integer. a and b represent an integer of 0 or 1 or more. ) There are polysiloxane compounds shown by These organosilanol compounds are usually preferably selected in an amount of about 0.0001 to 5% by weight based on 100 parts by weight of the epoxy resin in the impregnated resin composition of the present invention, from the viewpoint of curing accelerating effect. In the present invention, examples of the epoxy resin that is a component of the resin composition impregnated into the bran around which the insulating base material is wound include the following.

That is, bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol/borac type epoxy resin, cresol/porac type epoxy resin, cycloaliphatic epoxy resin, impregnated base ring such as triglycidyl isocyanate and hydanthin epoxy. Epoxy resin, hydrogenated bisphenol A type epoxy resin, aliphatic epoxy resin such as propylene glycol diglycidyl ether and pentaerythritol polyglycidyl ether, aromatic, aliphatic or alicyclic carboxylic acid and epichlorohydrin Epoxy resin obtained by the reaction with spiro ring-containing epoxy resin, G-IJ sidyl ether type epoxy resin which is the reaction product of orthoallylphenol novolac compound and epichlorohydrin, and bisphenol A at the ortho position of each hydroxyl group. These include glycidyl ether type epoxy resin, which is a reaction product of a diallylbisphenol compound having an allyl group and epichlorohydrin.
In addition, monoepoxy resins such as octylene oxide and butyl glycidyl ether may be used as diluents if necessary.
ester, styrene oxide, phenyl glycidyl ether, P-butylphenol glycidyl ether, cresyl glycidyl ether, glycidyl methacrylate, allyl glycidyl ether, cyclohexene vinyl monooxide, and other aniline derivatives such as epoxy may be added.

However, although diluents generally have the effect of lowering viscosity,
Since the properties are also deteriorated, the content should be kept to 3% by weight or less compared to polyepoxide. Furthermore, the acid anhydride which is another component of the impregnated resin composition includes hexahydrophthalic anhydride, tetrahydrophthalic anhydride, 3 (or 4)-methyl-tetrahydrophthalic anhydride, nadic acid anhydride, and methyl nadic anhydride. Examples include acid anhydrides, dodecyl-succinic anhydride, succinic anhydride, octadecyl-succinic anhydride, etc. alone or in mixtures.

On the other hand, in the present invention, the epoxy resin added to the insulating base material as needed is selected from the polyepoxides mentioned above as a component of the impregnating resin.

Generally, low viscosity polyepoxides are preferred for multi-turn insulation with thick insulation thickness. Next, examples of the present invention will be described.

Example 1 As the epoxy resin, alicyclic epoxy resin Chissonox 221 (trade name, Chisso Co., Ltd.) and Shodin 540 were used.
(trade name, Showa Denko Co., Ltd.), bisphenol F type epoxy resin Epiclone 830 (trade name Dainippon Ink Co., Ltd.), bisphenol A type epoxy resin DER332 (trade name, Dow Chemical Company), acid anhydride Epiclone B57
0 (trade name, Dainippon Ink Co., Ltd.) in the proportions shown in Table 1, resin compositions a to d are prepared as impregnating resins.

No. Table 1 These resin compositions a to d all have low viscosity and long pot life.

Separately, a mica sheet made by heat-sealing 1609/that aramid tosho mica paper and 25A thick aramid paper was prepared in advance using a siloxane compound containing a hydroxyl group, 9018 (trade name: Toray Silicone Co., Ltd.). ) and aluminum triacetylacetonate dissolved in methyl ethyl ketone, then immersed in a diluted solution, dried,
SH6018 and aluminum triacetylacetonate in mica sheet at 0.2% and 0.1% by weight, respectively.
Include weight%.

This is cut into tape shapes to obtain mica tape, which is an insulating base material. Then, as shown in Figure 1, this mica tape 1
Wrap it around wire theory 2 1' double times 13 times, put it in a simulated iron core (not shown), put it together with the iron core in an impregnating tank, and apply a 0.1 core Hg.
After reducing the pressure for 5 hours at
d was fed and pressurized at 5k9' (gauge pressure) for 1 hour, then taken out from the impregnation tank and placed in an oven for 1 hour.
By heating and curing at 50℃ for 1 hour, we obtained a turtle-like wisteria.

Table 2 shows the results of measuring the tan6 (after dielectric positive) of these electrically insulated coils at a voltage of 150q0 and IKV/.

Table 2 According to this Table 2, the maximum value of n6 is 5.5%, and it can be seen that the dielectric loss is extremely small in both cases.

In addition, these electrically insulated wire rings are all 20K at 150℃.
It showed a high dielectric breakdown voltage of V/Yanagi. Another 155oo
The bending strength was also 5k9/m or more, which was perfect for an insulated wire ring. When the insulating layer was disassembled, it was found that the entire insulating layer was completely soaked with resin, indicating that there was no problem with impregnation. Example 2 The mica sheet described in Example 1 was mixed with 100 parts by weight of DER431 (trade name, Dow Chemical Company), which is an epoxy resin obtained from phenol formaldehyde novolac, 2 parts by weight of SH6018 (previous generation), and 1 part by weight of aluminum triacetylacetonate. The mica tape is soaked in a solution in which parts by weight are dissolved in methyl ethyl ketone, dried, and contained in a mica tape adhesive amount of 1% by weight.

This is cut into tape shapes to obtain mica tape, which is an insulating base material. This mica tape was more flexible than that of Example 1 and had good winding properties. Then, this mica tape was wound around a wire in the same manner as in Example 1, and an electrically insulated wire was obtained in the same manner as in Example 1 using the resin composition C in Table 1.

In this electrically insulated wire ring, the n6 at 15yo was 2% or less, and the dielectric breakdown voltage was also as high as 2 arc V/, and it was found that the characteristics were further improved compared to Example 1. In addition to this, a wire ring of 1/a heavy wrapping of 30 times using conventional mica tape, which differs from Example 2 in that boron trifluoride monoethylamine was used as a curing accelerator, and the mica tape used in Example 2 were also used. Figure 2 shows the change in capacitance during impregnation under the same conditions of 1/a heavy winding 3 Tsukasa's line theory using conventional mica tape.
It was found that the time required for the capacitance to become saturated was slower than that of the mica tape used in Example B, and that the viscosity of the impregnated resin increased due to the action of boron trifluoride monoethylamine in the mica.

It should be noted that the present invention is not limited to the embodiments described above and shown in the drawings; for example, there are no particular limitations on the type or amount of the adhesive in the insulating base material, etc., without changing the gist of the invention. Of course, it can be implemented with various modifications.

As explained above, according to the present invention, there is no increase in the viscosity of the impregnated resin composition during impregnation, so even in the case of multiple turns with thick insulation, it is sufficiently impregnated, and it hardens rapidly above a certain temperature. After curing, it is possible to provide an electrically insulating coil that exhibits excellent heat resistance and electrically insulating properties, especially for high voltage applications.

[Brief explanation of the drawing]

Fig. 1 is a cross-sectional view showing an embodiment of the electrical insulation wire theory of the present invention, and Fig. 2 is a curve showing the change in capacitance during manufacturing of the slave and the electrical insulation wire theory of an embodiment of the present invention. It is a diagram. 1...Mica tape which is an insulating base material, 2...
... Line theory, A ... Capacitance change curve in the case of the conventional case, B ... ... Capacitance change curve in the case of the present invention. Figure 1 Figure 2

Claims (1)

[Claims] 1. An insulating base material containing an aluminum compound and a silane compound or polysiloxane compound containing a hydroxyl group as essential components is wound around a wire ring and impregnated with a resin composition consisting of an epoxy resin and an acid anhydride. An electrically insulated wire ring characterized by being hardened. 2. The electrically insulating coil according to claim 1, wherein the insulating base material also contains an epoxy resin.