JPS6055207U - closed switchboard - Google Patents
closed switchboardInfo
- Publication number
- JPS6055207U JPS6055207U JP1983146625U JP14662583U JPS6055207U JP S6055207 U JPS6055207 U JP S6055207U JP 1983146625 U JP1983146625 U JP 1983146625U JP 14662583 U JP14662583 U JP 14662583U JP S6055207 U JPS6055207 U JP S6055207U
- Authority
- JP
- Japan
- Prior art keywords
- closed switchboard
- utility
- model registration
- heat dissipation
- resin body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
- H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
- H02B1/56—Cooling; Ventilation
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Patch Boards (AREA)
- Installation Of Bus-Bars (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図はこの考案を適用した閉鎖配電盤の側面図、第２
図は放熱装置の一実施例を示す正面図、第３図は第２図
のＡ−Ａ’線で切断した断面図である。
１・・・・・・閉鎖配電盤本体、３・・・・・・母線導
体、４・・・・・・放熱装置、４１・・・・・十−トパ
イプ、４２・・・・・・ひだ、４３・・・・・・取付フ
ランジ。Figure 1 is a side view of a closed switchboard to which this invention is applied, Figure 2
The figure is a front view showing one embodiment of the heat dissipation device, and FIG. 3 is a sectional view taken along line AA' in FIG. 2. 1... Closed switchboard main body, 3... Bus conductor, 4... Heat dissipation device, 41... Tent pipe, 42... Folds, 43...Mounting flange.
Claims (1)
る放熱装置の、その放熱部を盤外に導出するとともに前
記ヒートパイプの一端部を発熱体と接続した閉鎖配電盤
。 ２ 樹脂体の放熱部に複数のひだを形成した実用新案登
録請求の範囲第１項記載の閉鎖配電盤。 ３ 樹脂体の放熱部表面に導電性塗料を塗着した実用新
案登録請求の範囲第１項又は第２項記載の閉鎖配電盤。[Claims for Utility Model Registration] 1. A heat dissipation device comprising a heat pipe embedded in a highly thermally conductive resin body, the heat dissipation portion of which is led out of the board, and one end of the heat pipe is connected to a heating element. Closed switchboard. 2. The closed switchboard according to claim 1 of the utility model registration claim, in which a plurality of folds are formed in the heat dissipation part of the resin body. 3. The closed switchboard according to claim 1 or 2 of the utility model registration claim, in which a conductive paint is applied to the surface of the heat dissipating part of the resin body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983146625U JPS6055207U (en) | 1983-09-20 | 1983-09-20 | closed switchboard |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983146625U JPS6055207U (en) | 1983-09-20 | 1983-09-20 | closed switchboard |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6055207U true JPS6055207U (en) | 1985-04-18 |
Family
ID=30326320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1983146625U Pending JPS6055207U (en) | 1983-09-20 | 1983-09-20 | closed switchboard |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6055207U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013509155A (en) * | 2009-10-26 | 2013-03-07 | アルストム・テクノロジー・リミテッド | Cooling device for cooling medium voltage switchgear by using a heat pipe that is energized |
| WO2016027386A1 (en) * | 2014-08-20 | 2016-02-25 | 株式会社 東芝 | Heat releasing device for solid-insulated device |
-
1983
- 1983-09-20 JP JP1983146625U patent/JPS6055207U/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013509155A (en) * | 2009-10-26 | 2013-03-07 | アルストム・テクノロジー・リミテッド | Cooling device for cooling medium voltage switchgear by using a heat pipe that is energized |
| WO2016027386A1 (en) * | 2014-08-20 | 2016-02-25 | 株式会社 東芝 | Heat releasing device for solid-insulated device |
| JPWO2016027386A1 (en) * | 2014-08-20 | 2017-06-29 | 株式会社東芝 | Heat dissipation device for solid insulation equipment |
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