JPS6074331U - flat package - Google Patents

flat package

Info

Publication number
JPS6074331U
JPS6074331U JP16721983U JP16721983U JPS6074331U JP S6074331 U JPS6074331 U JP S6074331U JP 16721983 U JP16721983 U JP 16721983U JP 16721983 U JP16721983 U JP 16721983U JP S6074331 U JPS6074331 U JP S6074331U
Authority
JP
Japan
Prior art keywords
flat package
bottom plate
lead member
fixed
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16721983U
Other languages
Japanese (ja)
Inventor
和智 健
Original Assignee
関西日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 関西日本電気株式会社 filed Critical 関西日本電気株式会社
Priority to JP16721983U priority Critical patent/JPS6074331U/en
Publication of JPS6074331U publication Critical patent/JPS6074331U/en
Pending legal-status Critical Current

Links

Landscapes

  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来の半導体装置用フラットパッケージの分解
斜視図である。第2図はこの考案の一実施例の水晶振動
子用フラットパッケージの金属蓋の一部を切除した平面
図である。第3図および第4図はそれぞれ第2図の■−
■線およびIV−IV線・に沿う断面図である。 11・・・・・・底板、12・・・・・・スペーサ用突
起部、13.16・・・・・・ガラス枠、14.15・
・・・・・リード部材、17・・・・“・・金属枠、1
9・・・・・・接着剤(半田)、20・・・・・・金属
蓋。
FIG. 1 is an exploded perspective view of a conventional flat package for semiconductor devices. FIG. 2 is a partially cut away plan view of a metal lid of a flat package for a crystal resonator according to an embodiment of the invention. Figures 3 and 4 are the ■− of Figure 2, respectively.
FIG. 3 is a cross-sectional view taken along line (2) and line IV-IV. 11...Bottom plate, 12...Protrusion for spacer, 13.16...Glass frame, 14.15.
...Lead member, 17..."...Metal frame, 1
9...Adhesive (solder), 20...Metal lid.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] セラミックよりなる底板と、この底板上にガラス枠を介
して固着されたリード部材と、このリード部材の上にガ
ラス枠を介して固着された金属枠と、この金属枠に接着
剤を介して固着される金属蓋とを備えてなるフラットパ
ッケージにおいて、前記底板の上面の前記リード部材の
配置されない位置にスペーサ用突起部を一体に形成した
ことを特徴とするフラットパッケージ。
A bottom plate made of ceramic, a lead member fixed to the bottom plate via a glass frame, a metal frame fixed to the lead member via the glass frame, and fixed to the metal frame via an adhesive. 1. A flat package comprising a metal lid and a metal lid, characterized in that a spacer protrusion is integrally formed on the top surface of the bottom plate at a position where the lead member is not placed.
JP16721983U 1983-10-27 1983-10-27 flat package Pending JPS6074331U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16721983U JPS6074331U (en) 1983-10-27 1983-10-27 flat package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16721983U JPS6074331U (en) 1983-10-27 1983-10-27 flat package

Publications (1)

Publication Number Publication Date
JPS6074331U true JPS6074331U (en) 1985-05-24

Family

ID=30365891

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16721983U Pending JPS6074331U (en) 1983-10-27 1983-10-27 flat package

Country Status (1)

Country Link
JP (1) JPS6074331U (en)

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