JPS608480Y2 - small electrical equipment - Google Patents

Description

[Detailed description of the invention] The present invention relates to small electric devices such as chargers and power adapters, and simplifies the installation of heat sinks for large current semiconductor devices used in the devices and printed circuit boards that connect the devices. It's completely amazing.

BACKGROUND ART Conventionally, small electric devices such as chargers have used Schottky diodes as large current semiconductor elements, and as shown in FIG. 1, diode a is attached to a heat sink with screws C and c.

In this case, the input terminal pins e and e which protrude upward and downward in the drawing from the through hole d of the heat sink and the surface f of the diode case, which is the output terminal, are connected to a printed circuit board (not shown) by lead wires g, respectively.

Therefore, the heat sink and the printed circuit board must be individually installed inside the charger case, which has the disadvantage of poor workability.

The present invention has been devised in view of these points, and one embodiment of the present invention will be described below with reference to FIGS. 2 to 4.

Reference numeral 1 denotes a molded type semiconductor element for large current, such as a Schottky diode or a power transistor shown in the embodiment.

The element 1 is attached to the heat sink 3 by screws 2 as shown in FIG. Planted and connected.

In this case, the lower end of the heat sink 3 contacts the printed circuit board 5 so that the heat sink 3 is substantially perpendicular to the printed circuit board 5, and the element 1, the heat sink 3, and the printed circuit board 5 are firmly connected.
be integrated.

In Fig. 4, 6 is the charger case, and the upper case 7 is
and a lower case 8, the upper case 7 is formed with a recess 9 for removably housing the battery to be charged, and inside the upper case are a pair of left and right ends 10 and 10 of the heat sink 3 that engage with each other. A groove portion 11 is formed.

The groove is formed by ribs 12,12.

In order to reduce the number of lead wires, a tangent piece 13 and a negative tangent piece 14 are connected in advance to the printed circuit board 5, and charging-required parts 15 are attached as appropriate.

In the above configuration, both left and right ends 10.10 of the heat sink 3 are engaged with each groove 11 provided inside the upper case 7.

In this case, the negative contact piece 14 partially projects into the recess 9 from a window 16 provided on one of the opposite walls of the recess 9, and the tip 17 of the negative contact piece 14 is engaged with the engagement groove 18.

Further, the tangential piece 13 is a window 1 provided on the other side of the opposing wall of the recess 9.
9.

In this way, the printed circuit board 5 is positioned by the engagement of the heat sink 3 and the engagement of the tip of the negative contact piece 14.

In this state, the lower case 8 is fixed to the upper case 7 by appropriate means.

In this case, the fitting protrusion 20 provided on the lower case 8 fits into the fitting hole 21 of the printed circuit board 5, thereby preventing the printed circuit board 5 from shifting from side to side.

Further, an appropriate number of protrusions 22 and 23 are provided from the upper and lower cases 7.8, respectively, to abut the printed circuit board 5, and these protrusions prevent the printed circuit board 5 from shifting in the vertical direction.

Therefore, by combining the upper and lower cases 7.8, the printed circuit board 5
is positioned and fixed in the storage space 24 of the charger case 6.

25 is a heat radiation hole. As described above, according to the configuration of the present invention, the large current semiconductor element, the heat sink attached to the element, and the printed circuit board to which the terminal pins of the element are implanted and connected are integrated, and are inserted into the groove provided inside the upper case. Since the printed circuit board is positioned and fixed in the storage space formed by the upper and lower cases by engaging the heat sink, the printed circuit board can be positioned by inserting and engaging the heat sink into the groove. There is no need to separately attach the heat sink and the printed circuit board, and since the elements are connected to the printed circuit board by implantation, the assembly workability can be improved compared to conventional devices, such as eliminating the need for lead wires.

[Brief explanation of the drawing]

Fig. 1 is a front view of a diode used in a conventional device attached to a heat sink, Figs. 2 to 4 show an embodiment of a small electric device according to the present invention, and Fig. 2 shows a large current semiconductor element. FIG. 3 is a front view of the device attached to a heat sink, FIG. 3 is a side view of the device attached to a printed circuit board, and FIG. 4 is a sectional view of the charger. 3... Heat sink, 1... Large current semiconductor element, 5... Printed circuit board, 7... Upper case, 11... Groove section, 8...lower case, 24...storage space.

Claims (1)

[Scope of utility model registration request] The terminal pins of the large current semiconductor element with the heat sink attached are connected to the printed circuit board to integrate the element, the heat sink, and the printed circuit board, and the heat sink is engaged with the groove provided inside the upper case. By doing so, the printed circuit board is positioned and fixed in a storage space formed by the upper case and the lower case coupled to the upper case.